← Back to Patent Explorer
US4415607A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing printed circuit network devices

Assignee: UFE Inc
•
Filing: 1982-09-13
•
Granted: 1983-11-15
•
Expires: 2002-09-13
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method of making a printed circuit network device including steps of depositing an insulating primary substrate layer on a temporary support member having a release surface, applying to the exposed surface of the primary substrate layer certain defined conductor areas, applying defined resistor areas on the exposed surface of the primary substrate layer and in electrical connection with the conductor areas, trimming the respective resistor areas to a predetermined resistive value, mounting the temporary support member with its several layers in facing relationship with a permanent support member, and thereafter releasing and removing the temporary support member from the mounted primary support layer.

Inventors

  • 👤 Oscar L. Denes
  • 👤 Lynn R. Kiphart
  • 👤 Paul P. Szalewski

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 15:59
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/207; H05K1/00; H05K1/16; H05K1/167; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/02; H05K2201/0275; H05K2201/0284; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09009; H05K2201/09118; H05K2201/09818; H05K2201/09936; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0537; H05K3/22; H05K3/28; H05K3/281; H05K3/38; H05K3/386; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 94 words
A method of manufacturing an electrical network package comprising the steps of: providing a temporary support member having a release surface; depositing an insulating primary substrate layer on said release surface; depositing defined conductor areas of conductive material to the exposed surface of said primary substrate layer; joining said temporary support member to a permanent insulating support member with the said substrate layer and its aforestated pre-applied conductor areas in facing relationship with a supporting surface of said permanent support member; and releasing and removing said temporary support member from said primary substrate layer.
Claim 2
Independent Claim 94 words
A method of manufacturing an electrical network package comprising the steps of: providing a temporary support member having a release surface; depositing an insulating primary substrate layer on said release surface; depositing defined conductor areas of conductive material to the exposed surface of said primary substrate layer; joining said temporary support member to a permanent insulating support member with the said substrate layer and its aforestated pre-applied conductor areas in facing relationship with a supporting surface of said permanent support member; and releasing and removing said temporary support member from said primary substrate layer.
Claim 3
Dependent Claim 18 words
The method of claim 1, wherein the permanent insulating support member is formed of a molded plastic material.
Claim 4
Dependent Claim 16 words
The method of claim 1, wherein the temporary support member is a release coated paper material.
Claim 5
Dependent Claim 56 words
The method of claim 1, and further comprising the steps of: depositing defined resistor areas of resistive material to the exposed surface of said primary substrate layer with portions of the resistor areas in electrical contact with respective conductor areas; and removing portions of said resistor areas to trim said areas to a predetermined resistive value.
Claim 6
Dependent Claim 21 words
The method of claim 1, and further comprising the step of: printing indicia areas in reverse format on said release surface.
Claim 7
Dependent Claim 15 words
The method of claim 4, wherein said resistor areas include portions overlying respective conductor areas.
Claim 8
Dependent Claim 24 words
The method of claim 6, further comprising the step of applying defined terminal contactor areas of conductive material overlying portions of said resistor areas.
Claim 9
Independent Claim 163 words
A method of manufacturing an electrical resistor network package comprising the sequential steps of: providing a temporary support member having a release surface; printing indicia areas in reverse format on said release surface; depositing an insulating primary substrate layer over said indicia and on said release surface; depositing defined conductor areas of conductive material to the exposed surface of said primary substrate layer; depositing defined resistor areas of resistive material to the exposed surface of said primary substrate layer with portions of the resistor areas overlying respective conductor areas; depositing defined terminal contactor areas of conductive material overlying portions of said resistor areas; removing portions of said resistor areas to trim said areas to a predetermined resistive value; joining said temporary support member to a permanent support member with the said substrate layer and its aforestated pre-applied areas in facing relationship with a supporting surface of said permanent support member; and releasing and removing said temporary support member from said primary substrate layer.
Claim 10
Independent Claim 163 words
A method of manufacturing an electrical resistor network package comprising the sequential steps of: providing a temporary support member having a release surface; printing indicia areas in reverse format on said release surface; depositing an insulating primary substrate layer over said indicia and on said release surface; depositing defined conductor areas of conductive material to the exposed surface of said primary substrate layer; depositing defined resistor areas of resistive material to the exposed surface of said primary substrate layer with portions of the resistor areas overlying respective conductor areas; depositing defined terminal contactor areas of conductive material overlying portions of said resistor areas; removing portions of said resistor areas to trim said areas to a predetermined resistive value; joining said temporary support member to a permanent support member with the said substrate layer and its aforestated pre-applied areas in facing relationship with a supporting surface of said permanent support member; and releasing and removing said temporary support member from said primary substrate layer.

References Cited (Backward Citations)

US634523A Cited
US2447541A Cited
US2724674A Cited
US2692190A Cited
US2874085A Cited
US3181986A Cited
US3282755A Cited
US3956041A Cited
US4329779A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-11-14 1987-05-16 1987-11-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-11-14 1991-05-16 1991-11-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-11-14 1995-05-16 1995-11-15 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag