US5761801A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making a conductive film composite
Assignee: Henkel Loctite Corp
•
Filing: 1995-06-07
•
Granted: 1998-06-09
•
Expires: 2015-06-07
Abstract
Abstract A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it. The method comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness. The laminate may be debossed through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon. This step involves impressing the tool onto the foil layer surface thereby causing the foil layer to impress into the unimpeded thickness of the thermosetting resin layer and retaining one or more of a debossed and embossed pattern in the metal foil and the attached resin film that is complementary to the raised electrical circuit pattern on the tool. The debossed laminate is subjected to conditions that effect one of near-gelation, gelation and cure of the attached resin film and fixes the retained pattern in the metal foil layer and the resin layer of the laminate.
Inventors
- 👤 William F. Gebhardt
- 👤 Rocco Papalia
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 08:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/04; H05K3/045; H05K3/10; H05K3/107; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49151; Y10T29/49153; Y10T29/49155
Claims Analysis
Total Claims: 148
Claim 1
Independent Claim
117 words
A method for making a thin film printed board precursor containing a laminate of an isotropic controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the isotropic controlled-flow dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises adhesively bonding an electrically conductive metal foil layer to an isotropic controlled-flow dielectric thermosetting resin film layer that has said unimpeded thickness.
Claim 2
Independent Claim
117 words
A method for making a thin film printed board precursor containing a laminate of an isotropic controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the isotropic controlled-flow dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises adhesively bonding an electrically conductive metal foil layer to an isotropic controlled-flow dielectric thermosetting resin film layer that has said unimpeded thickness.
Claim 3
Dependent Claim
94 words
The method of claim 1 wherein the laminate is debossed through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon, which comprises the step of impressing the tool onto the foil layer surface thereby causing the foil layer to impress into the unimpeded thickness of the thermosetting resin layer and retaining one or more of a debossed and embossed pattern in the metal foil and the attached resin film that is complementary to the raised electrical circuit pattern on the tool.
Claim 4
Dependent Claim
43 words
The method of claim 2 wherein the debossed laminate is subjected to conditions that effect one of near-gelation, gelation and cure of the attached resin film and fixes the retained pattern in the metal foil layer and the resin layer of the laminate.
Claim 5
Dependent Claim
29 words
The method of claim 3 wherein said conditions involves subjecting the debossed laminate to elevated temperature while the laminate is in contact with or free of the debossing tool.
Claim 6
Dependent Claim
15 words
The method of claim 4 wherein the laminate is in contact with the debossing tool.
Claim 7
Dependent Claim
14 words
The method of claim 4 wherein the laminate is free of the debossing tool.
Claim 8
Dependent Claim
26 words
The method of claim 3 wherein the laminate is further heated to effect one or more of cure and post cure of the attached resin film.
Claim 9
Dependent Claim
26 words
The method of claim 4 wherein the laminate is further heated to effect one or more of cure and post cure of the attached resin film.
Claim 10
Dependent Claim
26 words
The method of claim 5 wherein the laminate is further heated to effect one or more of cure and post cure of the attached resin film.
Claim 11
Dependent Claim
26 words
The method of claim 6 wherein the laminate is further heated to effect one or more of cure and post cure of the attached resin film.
Claim 12
Dependent Claim
22 words
The method of claim 2 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 13
Dependent Claim
22 words
The method of claim 3 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 14
Dependent Claim
22 words
The method of claim 4 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 15
Dependent Claim
22 words
The method of claim 5 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 16
Dependent Claim
22 words
The method of claim 6 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 17
Dependent Claim
22 words
The method of claim 7 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 18
Dependent Claim
22 words
The method of claim 8 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 19
Dependent Claim
22 words
The method of claim 9 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 20
Dependent Claim
22 words
The method of claim 10 wherein the pattern on the tool comprises embossed fine lines characterizing an electrical circuit of a PB.
Claim 21
Dependent Claim
26 words
The method of claim 11 wherein the electrical circuit pattern debossed in the laminate comprising one or more of grooves, cavities, channels, ridges, sockets and plateaus.
Claim 22
Dependent Claim
30 words
The method of claim 1 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 23
Dependent Claim
30 words
The method of claim 2 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 24
Dependent Claim
30 words
The method of claim 3 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 25
Dependent Claim
30 words
The method of claim 4 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 26
Dependent Claim
30 words
The method of claim 5 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 27
Dependent Claim
30 words
The method of claim 6 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 28
Dependent Claim
30 words
The method of claim 7 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 29
Dependent Claim
30 words
The method of claim 8 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 30
Dependent Claim
30 words
The method of claim 9 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 31
Dependent Claim
30 words
The method of claim 10 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 32
Dependent Claim
30 words
The method of claim 11 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 33
Dependent Claim
30 words
The method of claim 12 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 34
Dependent Claim
30 words
The method of claim 13 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 35
Dependent Claim
30 words
The method of claim 14 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 36
Dependent Claim
30 words
The method of claim 15 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 37
Dependent Claim
30 words
The method of claim 16 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 38
Dependent Claim
30 words
The method of claim 17 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 39
Dependent Claim
30 words
The method of claim 18 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 40
Dependent Claim
30 words
The method of claim 19 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 41
Dependent Claim
30 words
The method of claim 20 wherein the controlled-flow dielectric thermosetting resin film layer exhibits flow under pressure at a temperature below the near-gel and gel temperature of the thermosetting resin.
Claim 42
Dependent Claim
12 words
The method of claim 1 wherein the supporting layer comprises a fabric.
Claim 43
Dependent Claim
13 words
The method of claim 1 wherein the supporting layer comprises a thermoplastic polymer.
Claim 44
Dependent Claim
11 words
The method of claim 1 wherein the supporting layer comprises fibers.
Claim 45
Dependent Claim
12 words
The method of claim 2 wherein the supporting layer comprises a fabric.
Claim 46
Dependent Claim
13 words
The method of claim 2 wherein the supporting layer comprises a thermoplastic polymer.
Claim 47
Dependent Claim
11 words
The method of claim 2 wherein the supporting layer comprises fibers.
Claim 48
Dependent Claim
12 words
The method of claim 3 wherein the supporting layer comprises a fabric.
Claim 49
Dependent Claim
13 words
The method of claim 3 wherein the supporting layer comprises a thermoplastic polymer.
Claim 50
Dependent Claim
11 words
The method of claim 3 wherein the supporting layer comprises fibers.
Claim 51
Dependent Claim
12 words
The method of claim 4 wherein the supporting layer comprises a fabric.
Claim 52
Dependent Claim
13 words
The method of claim 4 wherein the supporting layer comprises a thermoplastic polymer.
Claim 53
Dependent Claim
11 words
The method of claim 4 wherein the supporting layer comprises fibers.
Claim 54
Dependent Claim
12 words
The method of claim 11 wherein the supporting layer comprises a fabric.
Claim 55
Dependent Claim
13 words
The method of claim 11 wherein the supporting layer comprises a thermoplastic polymer.
Claim 56
Dependent Claim
11 words
The method of claim 11 wherein the supporting layer comprises fibers.
Claim 57
Dependent Claim
12 words
The method of claim 21 wherein the supporting layer comprises a fabric.
Claim 58
Dependent Claim
13 words
The method of claim 21 wherein the supporting layer comprises a thermoplastic polymer.
Claim 59
Dependent Claim
11 words
The method of claim 21 wherein the supporting layer comprises fibers.
Claim 60
Dependent Claim
12 words
The method of claim 22 wherein the supporting layer comprises a fabric.
Claim 61
Dependent Claim
13 words
The method of claim 22 wherein the supporting layer comprises a thermoplastic polymer.
Claim 62
Dependent Claim
11 words
The method of claim 22 wherein the supporting layer comprises fibers.
Claim 63
Dependent Claim
19 words
The method of claim 42 wherein the thermoplastic polymer is a thin layer of a performance or engineering polymer.
Claim 64
Dependent Claim
19 words
The method of claim 45 wherein the thermoplastic polymer is a thin layer of a performance or engineering polymer.
Claim 65
Dependent Claim
19 words
The method of claim 48 wherein the thermoplastic polymer is a thin layer of a performance or engineering polymer.
Claim 66
Dependent Claim
19 words
The method of claim 51 wherein the thermoplastic polymer is a thin layer of a performance or engineering polymer.
Claim 67
Dependent Claim
19 words
The method of claim 54 wherein the thermoplastic polymer is a thin layer of a performance or engineering polymer.
Claim 68
Dependent Claim
19 words
The method of claim 57 wherein the thermoplastic polymer is a thin layer of a performance or engineering polymer.
Claim 69
Dependent Claim
19 words
The method of claim 60 wherein the thermoplastic polymer is a thin layer of a performance or engineering polymer.
Claim 70
Dependent Claim
48 words
The method of claim 1 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 71
Dependent Claim
48 words
The method of claim 2 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 72
Dependent Claim
48 words
The method of claim 3 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 73
Dependent Claim
48 words
The method of claim 4 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 74
Dependent Claim
48 words
The method of claim 5 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 75
Dependent Claim
48 words
The method of claim 6 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 76
Dependent Claim
48 words
The method of claim 7 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 77
Dependent Claim
48 words
The method of claim 11 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 78
Dependent Claim
48 words
The method of claim 20 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 79
Dependent Claim
48 words
The method of claim 21 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 80
Dependent Claim
48 words
The method of claim 22 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 81
Dependent Claim
48 words
The method of claim 23 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 82
Dependent Claim
48 words
The method of claim 24 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 83
Dependent Claim
48 words
The method of claim 25 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 84
Dependent Claim
48 words
The method of claim 26 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 85
Dependent Claim
48 words
The method of claim 27 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 86
Dependent Claim
48 words
The method of claim 31 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 87
Dependent Claim
48 words
The method of claim 40 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 88
Dependent Claim
48 words
The method of claim 41 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 89
Dependent Claim
48 words
The method of claim 42 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 90
Dependent Claim
48 words
The method of claim 43 wherein the electrically conductive metal foil layer is deposited or wrought foil and has an uniform thickness between about 0.1 mil (2.54×10 -4 cm) to about 20 mils (5.08×10 -2 cm); varying ±10 percent for deposited foils and ±5 percent for wrought foils.
Claim 91
Dependent Claim
28 words
The method of claim 1 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 92
Dependent Claim
28 words
The method of claim 2 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 93
Dependent Claim
28 words
The method of claim 3 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 94
Dependent Claim
28 words
The method of claim 4 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 95
Dependent Claim
28 words
The method of claim 5 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 96
Dependent Claim
28 words
The method of claim 6 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 97
Dependent Claim
28 words
The method of claim 7 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 98
Dependent Claim
28 words
The method of claim 11 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 99
Dependent Claim
28 words
The method of claim 20 wherein the dielectric resin film has an unimpeded thickness that is at least equal to that of the foil film bonded to it.
Claim 100
Dependent Claim
29 words
The method of claim 90 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 101
Dependent Claim
29 words
The method of claim 91 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 102
Dependent Claim
29 words
The method of claim 92 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 103
Dependent Claim
29 words
The method of claim 93 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 104
Dependent Claim
29 words
The method of claim 94 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 105
Dependent Claim
29 words
The method of claim 95 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 106
Dependent Claim
29 words
The method of claim 96 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 107
Dependent Claim
29 words
The method of claim 97 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 108
Dependent Claim
29 words
The method of claim 98 wherein the dielectric resin film has an unimpeded thickness that is at least about 1.2 times thicker than the thickness of the foil film.
Claim 109
Dependent Claim
39 words
The method of claim 1 wherein the thickness of the thin laminate comprising the foil layer and the unimpeded resin film layer is from about one (1) mil (0.00254 cm.) to about two hundred fifty (250) mils (0.635 cm.).
Claim 110
Dependent Claim
39 words
The method of claim 2 wherein the thickness of the thin laminate comprising the foil layer and the unimpeded resin film layer is from about one (1) mil (0.00254 cm.) to about two hundred fifty (250) mils (0.635 cm.).
Claim 111
Dependent Claim
39 words
The method of claim 3 wherein the thickness of the thin laminate comprising the foil layer and the unimpeded resin film layer is from about one (1) mil (0.00254 cm.) to about two hundred fifty (250) mils (0.635 cm.).
Claim 112
Dependent Claim
39 words
The method of claim 4 wherein the thickness of the thin laminate comprising the foil layer and the unimpeded resin film layer is from about one (1) mil (0.00254 cm.) to about two hundred fifty (250) mils (0.635 cm.).
Claim 113
Dependent Claim
39 words
The method of claim 5 wherein the thickness of the thin laminate comprising the foil layer and the unimpeded resin film layer is from about one (1) mil (0.00254 cm.) to about two hundred fifty (250) mils (0.635 cm.).
Claim 114
Dependent Claim
39 words
The method of claim 6 wherein the thickness of the thin laminate comprising the foil layer and the unimpeded resin film layer is from about one (1) mil (0.00254 cm.) to about two hundred fifty (250) mils (0.635 cm.).
Claim 115
Dependent Claim
39 words
The method of claim 7 wherein the thickness of the thin laminate comprising the foil layer and the unimpeded resin film layer is from about one (1) mil (0.00254 cm.) to about two hundred fifty (250) mils (0.635 cm.).
Claim 116
Dependent Claim
11 words
The method of claim 1 carried out as a batch process.
Claim 117
Dependent Claim
11 words
The method of claim 2 carried out as a batch process.
Claim 118
Dependent Claim
11 words
The method of claim 3 carried out as a batch process.
Claim 119
Dependent Claim
11 words
The method of claim 4 carried out as a batch process.
Claim 120
Dependent Claim
11 words
The method of claim 5 carried out as a batch process.
Claim 121
Dependent Claim
11 words
The method of claim 6 carried out as a batch process.
Claim 122
Dependent Claim
11 words
The method of claim 7 carried out as a batch process.
Claim 123
Dependent Claim
11 words
The method of claim 1 carried out as a semi-continuous process.
Claim 124
Dependent Claim
11 words
The method of claim 2 carried out as a semi-continuous process.
Claim 125
Dependent Claim
11 words
The method of claim 3 carried out as a semi-continuous process.
Claim 126
Dependent Claim
11 words
The method of claim 4 carried out as a semi-continuous process.
Claim 127
Dependent Claim
11 words
The method of claim 5 carried out as a semi-continuous process.
Claim 128
Dependent Claim
11 words
The method of claim 6 carried out as a semi-continuous process.
Claim 129
Dependent Claim
11 words
The method of claim 7 carried out as a semi-continuous process.
Claim 130
Dependent Claim
11 words
The method of claim 1 carried out as a continuous process.
Claim 131
Dependent Claim
11 words
The method of claim 2 carried out as a continuous process.
Claim 132
Dependent Claim
11 words
The method of claim 3 carried out as a continuous process.
Claim 133
Dependent Claim
11 words
The method of claim 4 carried out as a continuous process.
Claim 134
Dependent Claim
11 words
The method of claim 5 carried out as a continuous process.
Claim 135
Dependent Claim
11 words
The method of claim 6 carried out as a continuous process.
Claim 136
Dependent Claim
11 words
The method of claim 7 carried out as a continuous process.
Claim 137
Independent Claim
137 words
A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness, and the thermosetting resin contains in situ-expandable thermoplastic particles and the film contains an essentially uniform density and thickness across the breadth of the film.
Claim 138
Independent Claim
137 words
A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness, and the thermosetting resin contains in situ-expandable thermoplastic particles and the film contains an essentially uniform density and thickness across the breadth of the film.
Claim 139
Dependent Claim
133 words
The method of claim 136 wherein the laminate is debossed through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon, which comprises the steps of impressing the tool onto the foil layer surface thereby causing the foil layer to impress into the unimpeded thickness of the thermosetting resin layer and retaining one or more of a debossed and embossed pattern in the metal foil and the attached resin film that is complementary to the raised electrical circuit pattern on the tool, and said debossed laminate is subjected to conditions that effect one of near-gelation, gelation and cure of the attached resin film and thereby fixing the retained pattern in the metal foil layer and the resin layer of the laminate.
Claim 140
Dependent Claim
29 words
The method of claim 137 wherein said conditions involves subjecting the debossed laminate to elevated temperature while the laminate is in contact with or free of the debossing tool.
Claim 141
Dependent Claim
15 words
The method of claim 138 wherein the laminate is in contact with the debossing tool.
Claim 142
Independent Claim
257 words
A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises (i) adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness, and (ii) debossing the laminate through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon, which comprises the step of impressing the tool onto the foil layer surface thereby causing the foil layer to impress into the unimpeded thickness of the thermosetting resin layer and retaining one or more of a debossed and embossed pattern in the metal foil and the attached resin film that is complementary to the raised electrical circuit pattern on the tool, and further either the surface of the metal foil that is to contact the thermosetting resin film, or the thermosetting resin film before contacting the metal foil, has printed on it a release agent coating that replicates the non-raised portion of the raised electrical circuit pattern which is to be debossed into the foil-resin composite.
Claim 143
Independent Claim
257 words
A method for making a thin film printed board precursor containing a laminate of a controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises (i) adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness, and (ii) debossing the laminate through the metal foil layer and into the dielectric thermosetting resin film layer with a tool containing a raised electrical circuit pattern thereon, which comprises the step of impressing the tool onto the foil layer surface thereby causing the foil layer to impress into the unimpeded thickness of the thermosetting resin layer and retaining one or more of a debossed and embossed pattern in the metal foil and the attached resin film that is complementary to the raised electrical circuit pattern on the tool, and further either the surface of the metal foil that is to contact the thermosetting resin film, or the thermosetting resin film before contacting the metal foil, has printed on it a release agent coating that replicates the non-raised portion of the raised electrical circuit pattern which is to be debossed into the foil-resin composite.
Claim 144
Dependent Claim
52 words
The method of claim 140 wherein the printing may be effected by a release agent deposition step effected by transferring release agent from (a) transfer sheets to the metal foil film, or (b) through screens to the metal foil film, or (c) by application from rotogravure rolls, to the metal foil film.
Claim 145
Independent Claim
142 words
A method for making a thin film printed board precursor containing a laminate of an isotropic controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally, containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness, and the resin film contains, as its major ingredients, (i) a thermosetting resin that advances in molecular weight without forming a significant volatile byproduct and (ii) a flow component.
Claim 146
Independent Claim
142 words
A method for making a thin film printed board precursor containing a laminate of an isotropic controlled-flow dielectric thermosetting resin film layer and a heat and electrically conductive metal foil layer in direct adhesive bonding with a side of the resin film, optionally, containing a supporting layer comprising one or more of fiber, fabric and thermoplastic polymer in contact with the other side of the resin layer, wherein the dielectric thermosetting resin layer has an unimpeded thickness that is at least equal to that of the foil layer bonded to it, which comprises adhesively bonding an electrically conductive metal foil layer to a dielectric thermosetting resin film layer that has said unimpeded thickness, and the resin film contains, as its major ingredients, (i) a thermosetting resin that advances in molecular weight without forming a significant volatile byproduct and (ii) a flow component.
Claim 147
Dependent Claim
133 words
The method of claim 142 wherein the resin film has a) a uniform areal thickness ranging from about 1 to about 250 mils (about 0.00254 cm to about 0.635 cm) as measured by the weight of resin film for a given area; b) with minimum and maximum thicknesses not exceeding the deviation factor set forth in Table A: TABLE A
______________________________________
Range in mils Deviation Factor
______________________________________
1 to 5 ±1 mil (±0.00254 cm)
5 to 10 ±2 mils (±0.00508 cm)
10 to 250 ±20%
______________________________________ c) low flow at a broad temperature range; d) the ability to cure, gel, or near-gel, at temperatures from about 20° C. to about 250° C., in less than about 7 days and more than 1 second; and e) a low dielectric constant in the thermoset state.
Claim 148
Dependent Claim
77 words
The method of claim 143 wherein the thermosetting resin film employs as the flow control agent a diverse group of materials, such as: i) one or more electronic grade fillers; ii) a thermoplastic resin that is soluble or partially soluble in the thermosetting resin; iii) an elastomer-type polymer that provide discrete elastomer phases (second phases) in the thermosetting resin matrix; iv) a thixotrope; and v) a mixture of two or more of i), ii), iii) and iv).
References Cited (Backward Citations)
US2955351A
Cited
US2972003A
Cited
US2772501A
Cited
US2986804A
Cited
US2998839A
Cited
US3037265A
Cited
US3201238A
Cited
US3301730A
Cited
US3209066A
Cited
US3340606A
Cited
US3303254A
Cited
US3678577A
Cited
US4059479A
Cited
US3990142A
Cited
US4323421A
Cited
US4363930A
Cited
US4320572A
Cited
US4374457A
Cited
US4550051A
Cited
EP0163856A1
Cited
US4601916A
Cited
US4614837A
Cited
US4816427A
Cited
US5206074A
Cited
US4969257A
Cited
US4812421A
Cited
US4886686A
Cited
US4827611A
Cited
US4831723A
Cited
US5153987A
Cited
US4912844A
Cited
US4944087A
Cited
US4944908A
Cited
US4997702A
Cited
US4994316A
Cited
JPH0362935A
Cited
US5002818A
Cited
US5260130A
Cited
US5108825A
Cited
US5030144A
Cited
US5168624A
Cited
US5090122A
Cited
US5351393A
Cited
US5288542A
Cited
US5346747A
Cited
US5334279A
Cited
US5390412A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-08 | 2001-12-08 | 2002-06-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-08 | 2005-12-08 | 2006-06-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-08 | 2009-12-08 | 2010-06-09 | $7700.00 | Window Closed / Lapsed |