Carrier film with peripheral slits

Claim 1

A carrier film for use in manufacturing a carrier film semiconductor device comprising a semiconductor chip to which said carrier film is adhered, said carrier film comprising: a chip mounting region on which the semiconductor chip is to be adhered, said chip mounting region having a flat surface having a length and width substantially equal to the length and width of the semiconductor chip; slit means for absorbing a stress generated as a result of a thermal expansion during a heat process of adhering the semiconductor chip to the chip mounting region of the carrier film, and for preventing a stripping of said carrier film off of the semiconductor chip during a cutting process of cutting the carrier film to the periphery of the chip mounting region and to the semiconductor chip, wherein said slit means for absorbing a stress and for preventing a stripping comprises a plurality of slits formed in the carrier film, said slits having an inner boundary substantially incident to the periphery of the chip mounting region and an outer boundary outside of said periphery.