US5751062A — Cooling device of multi-chip module

Claim 1

Independent Claim 242 words

A cooling device of a multi-chip module, comprising: a plurality of micropackages, each having an LSI chip hermetically sealed therein; a first substrate having said micropackages mounted thereon; a housing covering said first substrate; heat conduction members provided respectively between said micropackages and said housing for conducting heat generated by said LSI chips to said housing; wherein each of said micropackages includes a first heat conduction member, having a cap portion for receiving said LSI chip and a first fin that is integral with said cap portion and formed of the same material as that of said cap portion, and a second substrate fixed to said cap portion of said first heat conduction member; wherein each of said LSI chips is mounted on said second substrate and fixed at a back surface thereof to an inner surface of said cap portion; a cooler for finally releasing the heat generated by said LSI chips, wherein said cooler is formed integrally with the housing of the multi-chip module so as to be a constituent part of said housing; and second heat conduction members, each having a second fin and being movable with respect to a respective associated first heat conduction member and said cooler to form a flexible heat conduction path, disposed in contact with said cooler, said second heat conduction members being respectively engaged in a heat transfer relationship with said respective associated first heat conduction member through said first and second fins.

Claim 2

Dependent Claim 242 words

A cooling device of a multi-chip module, comprising: a plurality of micropackages, each having an LSI chip hermetically sealed therein; a first substrate having said micropackages mounted thereon; a housing covering said first substrate; heat conduction members provided respectively between said micropackages and said housing for conducting heat generated by said LSI chips to said housing; wherein each of said micropackages includes a first heat conduction member, having a cap portion for receiving said LSI chip and a first fin that is integral with said cap portion and formed of the same material as that of said cap portion, and a second substrate fixed to said cap portion of said first heat conduction member; wherein each of said LSI chips is mounted on said second substrate and fixed at a back surface thereof to an inner surface of said cap portion; a cooler for finally releasing the heat generated by said LSI chips, wherein said cooler is formed integrally with the housing of the multi-chip module so as to be a constituent part of said housing; and second heat conduction members, each having a second fin and being movable with respect to a respective associated first heat conduction member and said cooler to form a flexible heat conduction path, disposed in contact with said cooler, said second heat conduction members being respectively engaged in a heat transfer relationship with said respective associated first heat conduction member through said first and second fins.

Claim 3

Dependent Claim 58 words

A cooling device according to claim 1, wherein an elastic member is interposed between every mutually engaged pair of said first and second heat conduction members, so that said second heat conduction member is kept in pressure contact with a bottom surface of said cooler, serving as an inner wall surface of said housing, by said elastic member.

Claim 4

Dependent Claim 25 words

A cooling device according to claim 2, wherein each said mutually engaged pair of said first and second fins have a micro gap between them.

Claim 5

Dependent Claim 51 words

A cooling device according to claim 2, wherein the contact area of each of said second heat conduction members with the bottom surface of said cooler is larger than a size of said micropackage, and is substantially equal to an area allotted to each of said micropackages on said first substrate.

Claim 6

Dependent Claim 24 words

A cooling device according to claim 3, wherein at least either of said first and second-heat conduction members is made of a dielectric material.

Claim 7

Dependent Claim 25 words

A cooling device according to claim 1, wherein each said first fin is a cylindrical fin and each said second fin is a hollow cylinder.

Claim 8

Dependent Claim 202 words

A multi-chip module, comprising: a plurality of micropackages, each having an LSI chip hermetically sealed therein; a first substrate having said micropackages mounted thereon; a housing covering said first substrate; heat conduction members provided respectively between said micropackages and said housing for conducting heat generated by said LSI chips to said housing; wherein each of said micropackages includes a first heat conduction member, having a cap portion for receiving said LSI chip and a first fin that is integral with said cap portion and formed of the same material as that of said cap portion, and a second substrate fixed to said cap portion of said first heat conduction member; wherein each of said LSI chips is mounted on said second substrate and fixed at a back surface thereof to an inner surface of said cap portion; second heat conduction members, each having a second fin and being movable with respect to a respective associated first heat conduction member and said housing to form a flexible heat conduction path, disposed in contact with said housing, said second heat conduction members being respectively engaged in a heat transfer relationship with said respective associated first heat conduction member through said first and second fins.

Claim 9

Dependent Claim 202 words

A multi-chip module, comprising: a plurality of micropackages, each having an LSI chip hermetically sealed therein; a first substrate having said micropackages mounted thereon; a housing covering said first substrate; heat conduction members provided respectively between said micropackages and said housing for conducting heat generated by said LSI chips to said housing; wherein each of said micropackages includes a first heat conduction member, having a cap portion for receiving said LSI chip and a first fin that is integral with said cap portion and formed of the same material as that of said cap portion, and a second substrate fixed to said cap portion of said first heat conduction member; wherein each of said LSI chips is mounted on said second substrate and fixed at a back surface thereof to an inner surface of said cap portion; second heat conduction members, each having a second fin and being movable with respect to a respective associated first heat conduction member and said housing to form a flexible heat conduction path, disposed in contact with said housing, said second heat conduction members being respectively engaged in a heat transfer relationship with said respective associated first heat conduction member through said first and second fins.

Claim 10

Dependent Claim 17 words

A multi-chip module according to claim 7, wherein said LSI chip is 15-20 by 15-20 millimeters square.

Claim 11

Dependent Claim 18 words

A multi-chip module according to claim 7, wherein the heat-generation density of said LSI chips is 5-100 W/cm2.

Claim 12

Dependent Claim 51 words

A multi-chip module according to claim 7, further comprising an elastic member interposed between every mutually engaged pair of said first and second heat conduction members, so that said second heat conduction member is kept in pressure contact with an upper inner wall surface of said housing, by said elastic member.

Claim 13

Dependent Claim 25 words

A multi-chip module according to claim 7, wherein each said mutually engaged pair of said first and second fins have a micro gap between them.

Claim 14

Dependent Claim 53 words

A multi-chip module according to claim 7, wherein the contact area of each of said second heat conduction members with the upper inner wall surface of said housing is larger than a size of said micropackage, and is substantially equal to an area allotted to each of said micropackages on said first substrate.

Claim 15

Dependent Claim 25 words

A multi-chip module according to claim 7, wherein at least either of said first and second heat conduction members is made of a dielectric material.

Claim 16

Dependent Claim 25 words

A multi-chip module according to claim 7, wherein each said first fin is a cylindrical fin and each said second fin is a hollow cylinder.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2001-05-11	2001-11-10	2002-05-12	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2005-05-11	2005-11-10	2006-05-12	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2009-05-11	2009-11-10	2010-05-12	$7700.00	Window Closed / Lapsed

Cooling device of multi-chip module

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