EP0644593A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor module
Assignee: Hitachi Ltd
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Filing: 1994-08-10
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Granted: —
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Expires: 2014-08-10
Abstract
Abstract The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members (10) are provided, each of which has an area of contact with a semiconductor device (3) or an inner surface of a housing (5, 7) and has opposed heat transfer surfaces. A radiator (7, 30) is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.
Inventors
- 👤 Noriyuki Ashiwake
- 👤 Takahiro Daikoku
- 👤 Kenichi Kasai
- 👤 Keizou Kawamura
- 👤 Hideyuki Kimura
- 👤 Atsuo Nishihara
- 👤 Toshio Hatada
- 👤 Toshiki Iino
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-05 13:15
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/774; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
75 words
A semiconductor module comprising a circuit board (2), a plurality of semiconductor devices (3) mounted on said circuit board, a housing (5, 7) covering said circuit board, thermal conductor members (10) interposed between the respective semiconductor devices and said housing and transferring heat from surfaces of said semiconductor devices to said housing, flow passages (12, 13) formed in said housing, and couplers (14) of valve-contained type connecting and disconnecting supplying and discharging a cooling fluid.
Claim 2
Dependent Claim
85 words
A semiconductor module comprising a circuit board (2), a plurality of semiconductor devices (3) mounted on said circuit board, a housing (5, 7) covering said circuit board, thermal conductor means (10, 16, 17, 18, 21, 22, 26, 27, 28) provided between the respective semiconductor devices and said housing and transferring heat from surfaces of said semiconductor devices to said housing, and a radiator (7, 30) formed integrally on said housing and radiating the heat transferred from the surfaces of said semiconductor devices to said housing.
Claim 3
Dependent Claim
82 words
A semiconductor module according to claim 2, wherein the housing covering said circuit board has holes (9) formed therein, each of the thermal conductor means being brought into contact with the surface of the associated semiconductor device, the thermal conductor means being inserted in the respective holes of the housing with a gap left between each thermal conductor means and the associated hole, and resilient members (11, 19, 24, 29) are provided interposed between the respective thermal conductor means and the housing.
Claim 4
Dependent Claim
136 words
A semiconductor module according to claim 2, wherein the thermal conductor means comprises first thermal conductor members (18) and second thermal conductor members, each of said first thermal conductor members having a base (16) and first fins (17) formed thereon, said base being brought into contact with the surface of the associated semiconductor device, each of said second thermal conductor members having second fins (15) formed on said housing, said first fins of each of said first thermal conductor members engaging with said second fins of associated one of said second thermal conductor members, and resilient members (19) are interposed between respective surfaces of said bases of said first thermal conductor members, from which said first fins extend, and a surface of said housing from which said second fins of said second thermal conductor members extend.
Claim 5
Dependent Claim
159 words
A semiconductor module according to claim 2, wherein the thermal conductor means comprises first thermal conductor members (18) and second thermal conductor members (23), each of said first thermal conductor members having a base (16) fixedly secured to the surface of the associated semiconductor device and first fins (17) formed on said base, each of said second thermal conductor members having a base (21) brought into contact with an inner surface of said housing and second fins (22) formed on said base of the second thermal conductor member, said first fins of each of said first thermal conductor members engaging with said second fins of associated one of said second thermal conductor members, and a resilient member (24) is interposed between a surface of said base of each of said first thermal conductor members, from which said first fins extend, and a surface of said base of the associated second thermal conductor member from which said second fins extend.
Claim 6
Dependent Claim
111 words
A semiconductor module according to claim 2, wherein the thermal conductor means comprise first thermal conductor members (26) fixedly secured to the respective surfaces of said semiconductor devices and second thermal conductor members (27) brought into contact with an inner surface of said housing, each of said second thermal conductor members having a hole formed therein, said first thermal conductor members being inserted in the respective holes of said second thermal conductor members with a gap left between each first thermal conductor member and the associated hole, and a resilient member (29) is interposed between each of said first thermal conductor members and associated one of said second thermal conductor members.
Claim 7
Dependent Claim
65 words
A semiconductor module according to claim 4 or 5, wherein the first fins of each of the first thermal conductor members are formed in a plate shape and arranged substantially perpendicularly to the surface of the associated semiconductor device, the second fins are formed in a plate shape to be engaged with the first fins of the associated first thermal conductor member through minute gaps.
Claim 8
Dependent Claim
35 words
A semiconductor module according to one of the claims 5 or 6, wherein the housing has the radiator formed integrally on an outer surface thereof, and the inner surface of the housing is formed flat.
Claim 9
Dependent Claim
33 words
A semiconductor module according to claim 5, wherein each of the second thermal conductor members has an area substantially equal to an area of the circuit board occupied by the associated semiconductor device.
Claim 10
Dependent Claim
29 words
A semiconductor module according to claim 1 to 9, further comprising a thermally-conductive, electrically-insulative fluid filled in a space (9, 12) defined by the circuit board and the housing.
Claim 11
Dependent Claim
38 words
A semiconductor module according to claim 2 to 10, wherein the radiator includes a plurality of flow passages formed integrally in the housing and couplers (14) of valve-contained type connecting and disconnecting supplying and discharging a cooling fluid.
Claim 12
Dependent Claim
23 words
A semiconductor module according to claim 2 to 10, wherein the radiator comprises a plurality of fins (30) formed integrally on the housing.
Claim 13
Dependent Claim
49 words
A semiconductor module according to claim 5 or 6, wherein each of the first thermal conductor members fixedly secured to the respective semiconductor devices is made of a material which is electrically insulative and has a linear expansion coefficient close to that of a material of the semiconductor devices.
References Cited (Backward Citations)
No citation records indexed.
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