Patent US5744171A successfully refreshed from Google Patents.
US5744171A
Expired / Lapsed
US
⏱️ 0.0 years remaining
System for fabricating conductive epoxy grid array semiconductor packages
Assignee: LSI Corp
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Filing: 1997-05-12
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Granted: 1998-04-28
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Expires: 2017-05-12
Abstract
Abstract System for producing a plurality of semiconductor device assemblies utilizing a grid array of conductive epoxy for connecting them to an electronic system. Conductive epoxy is screen printed in a desired pattern onto a printed wire board of the semiconductor device assembly. The conductive epoxy is B-staged by heating in an oven. The semiconductor device assembly is then placed onto a system printed circuit board wherein the B-staged conductive epoxy is further cured by heat and effectively makes mechanical and electrical connections between the semiconductor device assembly and the system printed circuit board.
Inventors
- 👤 Mark Schneider
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:16
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/321; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/099; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10719; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/11; H05K2203/1105; H05K3/10; H05K3/12; H05K3/1216; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
131 words
A system for fabricating a semiconductor device assembly, said system comprising: means for attaching a semiconductor device to a printed wiring board having conductive paths thereon; means for connecting the semiconductor device to the conductive paths on the printed wiring board; means for encapsulating the semiconductor device and part of the printed wiring board having the semiconductor device attached thereto; means for depositing conductive epoxy onto selected areas of the printed wiring board such that the conductive epoxy is deposited on the printed wiring board at a desired thickness so as to form conductive epoxy contacts adapted for connection to a printed circuit board, the selected areas being electrically connected to the conductive paths which are connected to the semiconductor device; and means for partially staging the deposited conductive epoxy contacts.
Claim 2
Independent Claim
131 words
A system for fabricating a semiconductor device assembly, said system comprising: means for attaching a semiconductor device to a printed wiring board having conductive paths thereon; means for connecting the semiconductor device to the conductive paths on the printed wiring board; means for encapsulating the semiconductor device and part of the printed wiring board having the semiconductor device attached thereto; means for depositing conductive epoxy onto selected areas of the printed wiring board such that the conductive epoxy is deposited on the printed wiring board at a desired thickness so as to form conductive epoxy contacts adapted for connection to a printed circuit board, the selected areas being electrically connected to the conductive paths which are connected to the semiconductor device; and means for partially staging the deposited conductive epoxy contacts.
Claim 3
Dependent Claim
43 words
The system of claim 1, wherein the means for depositing conductive epoxy is a screen stencil in communication with a face of the printed wiring board and through which the conductive epoxy is patterned onto the selected areas of the printed wiring board.
Claim 4
Dependent Claim
56 words
The system of claim 1, wherein the means for depositing conductive epoxy is an array of hollow needles having a desired pattern and aligned with a face of the printed wiring board so that the conductive epoxy flows through the hollow needles and forms the desired pattern onto the selected areas of the printed wiring board.
Claim 5
Dependent Claim
16 words
The system of claim 1, wherein the semiconductor device is a plurality of integrated circuit dies.
Claim 6
Dependent Claim
14 words
The system of claim 1, wherein the semiconductor device is an integrated circuit die.
Claim 7
Dependent Claim
15 words
The system of claim 1, wherein the conductive epoxy contacts are arranged in an array.
Claim 8
Dependent Claim
16 words
The system of claim 6, wherein the conductive epoxy contacts are arranged in a rectangular array.
Claim 9
Dependent Claim
15 words
The system of claim 1, wherein the conductive epoxy contacts are partially staged by heating.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-04-27 | 2001-10-27 | 2002-04-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-04-27 | 2005-10-27 | 2006-04-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-04-27 | 2009-10-27 | 2010-04-28 | $7700.00 | Window Closed / Lapsed |