US4919970A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Solder deposition control
Assignee: International Business Machines Corp
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Filing: 1986-09-15
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Granted: 1990-04-24
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Expires: 2006-09-15
Abstract
Abstract A technique for one step solder application through a mask to a printed circuit board (PCB) having pads for surface mountable components and through holes for a leaded components is disclosed wherein the amount of solder deposited on the pads and in the holes is simultaneously, independently controlled as a function of mask thickness, blade hardness and blade to mask angle.
Inventors
- 👤 Karl G. Hoebener
- 👤 John J. Stankus
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 06:28
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1216; H05K3/1233; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09572; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0139; H05K2203/16; H05K2203/163
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
97 words
A single step process for depositing solder through a mask, using a resilient blade, onto pads for surface mountable components and into plated through holes for leaded components said pads and plated through holes being provided on and in a printed circuit substrate, comprising the steps of: controlling the amount of solder deposited on the surface mount lands as a function of mask thickness; and simultaneously and independently controlling the amount of solder deposited into the plated through holes as a function of the hardness of the blade and an angle between the blade and mask surface.
Claim 2
Dependent Claim
97 words
A single step process for depositing solder through a mask, using a resilient blade, onto pads for surface mountable components and into plated through holes for leaded components said pads and plated through holes being provided on and in a printed circuit substrate, comprising the steps of: controlling the amount of solder deposited on the surface mount lands as a function of mask thickness; and simultaneously and independently controlling the amount of solder deposited into the plated through holes as a function of the hardness of the blade and an angle between the blade and mask surface.
Claim 3
Dependent Claim
17 words
The process of claim 1 wherein the hardness of the blade is between 60 and 80 durometer.
Claim 4
Dependent Claim
28 words
The process of claims 1 or 2 wherein the attack angle between the resilient blade and mask is varied by changing a length dimension of the blade holder.
Claim 5
Dependent Claim
26 words
The process of claims 1, 2 or 3 wherein the attack angle may be varied in a range from about 15 degrees to about 45 degrees.
Claim 6
Dependent Claim
111 words
Apparatus for applying various amounts of solder through a mask to various sites on and in a printed circuit substrate fixedly held in contact therewith, in one pass comprising: a resilient blade adapted for contacting the mask at a predetermined angle; means for varying the angle of contact of the blade to the mask; and means for causing relative motion between the blade and the mask, whereby the amount of solder deposited at sites on the surface of the substrate is a function of mask thickness and the amount of solder deposited into holes at sites in the substrate is a function of the hardness and attack angle of the blade.
Claim 7
Dependent Claim
111 words
Apparatus for applying various amounts of solder through a mask to various sites on and in a printed circuit substrate fixedly held in contact therewith, in one pass comprising: a resilient blade adapted for contacting the mask at a predetermined angle; means for varying the angle of contact of the blade to the mask; and means for causing relative motion between the blade and the mask, whereby the amount of solder deposited at sites on the surface of the substrate is a function of mask thickness and the amount of solder deposited into holes at sites in the substrate is a function of the hardness and attack angle of the blade.
Claim 8
Dependent Claim
104 words
A process for depositing solder through a mask using a resilient blade in a holder adapted for relative motion with the mask, said blade having a hardness between 60 and 80 durometers, said solder being deposited both onto and into a printed circuit substrate having pads for surface mountable components and plated through holes for leaded components, comprising the steps of: controlling the amount solder deposited on pads as a function of mask thickness; and simultaneously controlling the amount of solder deposited into the plated through holes as a function of the hardness of the blade and an angle between the blade and mask.
Claim 9
Dependent Claim
104 words
A process for depositing solder through a mask using a resilient blade in a holder adapted for relative motion with the mask, said blade having a hardness between 60 and 80 durometers, said solder being deposited both onto and into a printed circuit substrate having pads for surface mountable components and plated through holes for leaded components, comprising the steps of: controlling the amount solder deposited on pads as a function of mask thickness; and simultaneously controlling the amount of solder deposited into the plated through holes as a function of the hardness of the blade and an angle between the blade and mask.
Claim 10
Dependent Claim
28 words
The process of claim 6 additionally including the step of: varying the angle between the resilient blade and mask by changing a length dimension of the blade holder.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-04-23 | 1993-10-23 | 1994-04-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-04-23 | 1997-10-23 | 1998-04-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-04-23 | 2001-10-23 | 2002-04-24 | $7700.00 | Window Closed / Lapsed |