Semiconductor package substrate and ball grid array (BGA) semiconductor package using same

Claim 2

A substrate for a chip package comprising: a cavity formed in the substrate; a bumper and a plurality of leads for conductive connections to the chip package formed on the substrate adjacent to said cavity; and at least one of a plurality of holes and a plurality of recesses formed on the substrate interdispersed between conductive leads for receiving a molding resin.

Claim 3

The substrate of claim 1, wherein the square measure of said cavity is larger than that of a package chip being mounted therein by a predetermined factor.

Claim 4

The substrate of claim 1, wherein said bumper is formed of a material selected from one of a copper foil, epoxy, resin, glass fiber and solder resister.

Claim 5

The substrate of claim 1, wherein said bumper has a width at least equal to about 0.1 mm.

Claim 6

The substrate of claim 4, wherein said bumper has a width not greater than about 10 mm.

Claim 7

The substrate of claim 1, wherein said bumper has a height at least equal to about 0.1 mm.

Claim 8

The substrate of claim 6, wherein said bumper has a height not greater than about 10 mm.

Claim 9

The substrate of claim 1, wherein said recesses and holes have a diameter at least equal to about 0.1 mm.

Claim 10

The substrate of claim 8, wherein said recesses have a depth at least equal to one third of a substrate thickness.

Claim 11

The substrate of claim 1, wherein said bumper substantially surrounds said cavity.

Claim 12

A chip package comprising: a substrate having a plurality of conductive leads, a cavity at least one bumper formed on said substrate adjacent to said cavity and a plurality of holes and recesses; a package chip mounted on the bottom surface of said cavity, wherein the package chip has a plurality of bond pads; means for connecting said bonding package pads of said package chip and said plurality of conductive leads and said substrate; and a molding compound, formed on said substrate, for packaging said package chip and said connecting means and filling said holes and said recesses, wherein an adhesive strength between the molding compound and said substrate in said holes and said recesses decreases delamination.

Claim 13

A chip package comprising: a substrate having a plurality of conductive leads, a cavity at least one bumper formed on said substrate adjacent to said cavity and a plurality of holes and recesses; a package chip mounted on the bottom surface of said cavity, wherein the package chip has a plurality of bond pads; means for connecting said bonding package pads of said package chip and said plurality of conductive leads and said substrate; and a molding compound, formed on said substrate, for packaging said package chip and said connecting means and filling said holes and said recesses, wherein an adhesive strength between the molding compound and said substrate in said holes and said recesses decreases delamination.

Claim 14

The package of claim 11, wherein the square measure of the bottom surface of said cavity is larger than that of said package chip by a predetermined factor.

Claim 15

The package of claim 11, wherein said bumper is formed of a material selected from one of a copper foil, epoxy resin, glass fiber and solder resister.

Claim 16

The package of claim 11, further comprising PIQ filling said cavity and covering said package chip.

Claim 17

The package of claim 11, wherein said connecting means comprises a plurality of conductive wires.

Claim 18

The package of claim 11, further comprising a plurality of conductive balls coupled to said plurality of conductive leads.

Claim 19

The package of claim 11, wherein said molding compound completely covers the package chip.

Claim 20

The package of claim 11, wherein said bumper has a width at least equal to about 0.1 mm and not greater than about 10 mm.

Claim 21

The package of claim 11, wherein said bumper has a height at least equal to about 0.1 mm and not greater than about 10 mm.

Claim 22

The package of claim 11, wherein said recesses and holes have a diameter at least equal to about 0.1 mm.

Claim 23

The package of claim 20, wherein said recesses have a depth at least equal to one third of a substrate thickness.

Claim 24

The substrate of claim 1, wherein an adhesive strength between the molding resin and at least one of said plurality of holes and recesses decreases delamination.

Claim 25

The substrate of claim 10, wherein said bumper is encapsulated by the molding resin.

Claim 26

The package of claim 11, wherein said holes and said recesses are interdispersed between said plurality of conductive leads.

Claim 27

The package of claim 11, wherein said bumper is a anti-cracking bumper.