Abstract A process for manufacturing a flash EEPROM system functioning as a mass storage medium for a host computer includes a controller and at least one flash EEPROM memory module. The flash EEPROM memory module includes at least one flash EEPROM chip having an on-chip programmable power generation circuit including a high voltage generator circuit capable of generating a high voltage Vpp from a logic level voltage Vdd provided to the chip, a serial protocol logic circuit, a data latch, a data bus, a register address decoder, and a multi-voltage generator/regulator. The multi-voltage generator/regulator includes a plurality of registers and provides the programming, reading, and erasing voltages required for proper operation of the flash EEPROM system from digital values stored in the plurality of registers by the controller. The high voltage generator circuit includes both high current and low current charge pump circuits for generating the high voltage Vpp. The high current charge pump circuit is connected to relatively large off-chip charge storage devices, and the low current charge pump circuit is connected to relatively small on-chip charge storage devices. The controller may activate one or the other of the high or low current charge pump circuits through control signals connected to enabling circuitry respectively connected to the high and low current charge pump circuits. Alternatively, the controller may deactivate both the high and low current charge pump circuits and cause the high voltage Vpp to be provided from other circuitry on another flash EEPROM chip in the flash EEPROM module.
A method of forming a charge pump circuit on a substrate comprising the steps of: mounting a charge storage unit on said substrate; and mounting a flash EEPROM chip including a switching circuit on said substrate such that said switching circuit is coupled through a plurality of nodes to said charge storage unit to form said charge pump circuit.
Claim 2
Independent Claim
59 words
A method of forming a charge pump circuit on a substrate comprising the steps of: mounting a charge storage unit on said substrate; and mounting a flash EEPROM chip including a switching circuit on said substrate such that said switching circuit is coupled through a plurality of nodes to said charge storage unit to form said charge pump circuit.
Claim 3
Dependent Claim
27 words
The method as recited in claim 1, wherein said charge storage unit mounting step comprises the step of mounting a plurality of discrete capacitors on said substrate.
Claim 4
Independent Claim
64 words
A method of forming a plurality of charge pump circuits on a substrate, comprising the steps of: mounting a charge storage unit on said substrate; and mounting a plurality of flash EEPROM chips including a plurality of switching circuits on said substrate such that said plurality of switching circuits are coupled to said charge storage unit to form said plurality of charge pump circuits.
Claim 5
Independent Claim
64 words
A method of forming a plurality of charge pump circuits on a substrate, comprising the steps of: mounting a charge storage unit on said substrate; and mounting a plurality of flash EEPROM chips including a plurality of switching circuits on said substrate such that said plurality of switching circuits are coupled to said charge storage unit to form said plurality of charge pump circuits.
Claim 6
Dependent Claim
27 words
The method as recited in claim 3, wherein said charge storage unit mounting step comprises the step of mounting a plurality of discrete capacitors on said substrate.