Method and apparatus for sequentially metalized polymeric films and products made thereby

Claim 1

A method for electroplating a metal onto a non-metallic electrically insulating substrate, comprising the steps of: a) depositing a thin flash of metal onto one side of a non-metallic electrically-insulating substrate; b) moving said substrate along a path including a non-conductive surface through an electrolytic solution having a plurality of adjacent anodes which are positioned adjacent to and facing said surface, said anodes defining a thin uniform gap with said surface, said substrate moving along said surface with said metal side of said substrate facing said anodes and exiting said electrolytic solution after passing said anodes; c) passing said metal side of said substrate over an electrically conductive cathode located outside said electrolytic solution; and d) causing groups of one or more of said adjacent anodes to have a different level of current density as said substrate passes through said electrolytic solution to continuously electrodeposit and build up metal on said metal side of said moving substrate, the level of current density of a specific group of anodes being greater than a group of anodes which precedes it along said path and being based upon current carrying capacity of the flash metal or of the built-up metal existing on said substrate between said specific group of anodes and said cathode.

Claim 2

A method for electroplating a metal onto a non-metallic electrically insulating substrate, comprising the steps of: a) depositing a thin flash of metal onto one side of a non-metallic electrically-insulating substrate; b) moving said substrate along a path including a non-conductive surface through an electrolytic solution having a plurality of adjacent anodes which are positioned adjacent to and facing said surface, said anodes defining a thin uniform gap with said surface, said substrate moving along said surface with said metal side of said substrate facing said anodes and exiting said electrolytic solution after passing said anodes; c) passing said metal side of said substrate over an electrically conductive cathode located outside said electrolytic solution; and d) causing groups of one or more of said adjacent anodes to have a different level of current density as said substrate passes through said electrolytic solution to continuously electrodeposit and build up metal on said metal side of said moving substrate, the level of current density of a specific group of anodes being greater than a group of anodes which precedes it along said path and being based upon current carrying capacity of the flash metal or of the built-up metal existing on said substrate between said specific group of anodes and said cathode.

Claim 5

A method of electrodepositing a rectal onto a non-metallic electrically insulating substrate, comprising the steps of: providing a plurality of elongated anodes side-by-side in a close packed array in an electrolytic solution, each of said anodes having an active anode surface aligned with the active anode surfaces of an adjacent anode to form a generally continuous active forming surface; moving a thin flash of metal having a non-conductive backing thereon along a non-conductive surface in said electrolytic solution and past said continuous active forming surface while maintaining a uniform spacing between said metal and said forming surface of less than 1" as it passes therealong, said flash of metal facing said anodes; causing said metal as it exits said electrolytic solution to pass over a cathode pick-up outside said electrolytic solution; and electrically energizing groups of one or more adjacent anodes to continuously electrodeposit and build up metal on said metal flash, each successive group of said anodes having a higher energization level than the preceding group, the level of current density of a specific group of anodes being based upon current carrying capacity of the metal flash or of the built-up metal existing between said specific group of anodes and said cathode.

Claim 6

A method of electrodepositing a rectal onto a non-metallic electrically insulating substrate, comprising the steps of: providing a plurality of elongated anodes side-by-side in a close packed array in an electrolytic solution, each of said anodes having an active anode surface aligned with the active anode surfaces of an adjacent anode to form a generally continuous active forming surface; moving a thin flash of metal having a non-conductive backing thereon along a non-conductive surface in said electrolytic solution and past said continuous active forming surface while maintaining a uniform spacing between said metal and said forming surface of less than 1" as it passes therealong, said flash of metal facing said anodes; causing said metal as it exits said electrolytic solution to pass over a cathode pick-up outside said electrolytic solution; and electrically energizing groups of one or more adjacent anodes to continuously electrodeposit and build up metal on said metal flash, each successive group of said anodes having a higher energization level than the preceding group, the level of current density of a specific group of anodes being based upon current carrying capacity of the metal flash or of the built-up metal existing between said specific group of anodes and said cathode.

Claim 7

A method of electrodepositing a metal onto a non-metallic electrically insulating substrate, comprising the steps of: a) moving an electrically non-conductive substrate having a metal flash thereon along a path wherein said substrate is first moved through an electrolytic solution on a non-conductive surface in said electrolytic solution and past a plurality of anodes disposed in said solution and then over a conductive cathode surface located outside said electrolytic solution, said metal flash on said substrate facing said anodes in said solution and engaging said conductive cathode surface; and b) electrically energizing groups of one or more adjacent anodes at different levels to continuously electrodeposit and build up metal onto said metal flash of said substrate wherein a successive group of anodes has a higher energization level than a preceding group, the energization level of each of a specific group of anodes being based upon current carrying capacity of the metal flash or of the built-up metal existing on the substrate between said specific group of anodes and said cathode.

Claim 8

A method of electrodepositing a metal onto a non-metallic electrically insulating substrate, comprising the steps of: a) moving an electrically non-conductive substrate having a metal flash thereon along a path wherein said substrate is first moved through an electrolytic solution on a non-conductive surface in said electrolytic solution and past a plurality of anodes disposed in said solution and then over a conductive cathode surface located outside said electrolytic solution, said metal flash on said substrate facing said anodes in said solution and engaging said conductive cathode surface; and b) electrically energizing groups of one or more adjacent anodes at different levels to continuously electrodeposit and build up metal onto said metal flash of said substrate wherein a successive group of anodes has a higher energization level than a preceding group, the energization level of each of a specific group of anodes being based upon current carrying capacity of the metal flash or of the built-up metal existing on the substrate between said specific group of anodes and said cathode.