Patent US5682673A successfully refreshed from Google Patents.
US5682673A
Expired / Lapsed
US
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Method for forming encapsulated IC packages
Assignee: IPAC Inc
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Filing: 1995-04-17
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Granted: 1997-11-04
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Expires: 2015-04-17
Abstract
Abstract A mold is provided for use in encapsulating integrated circuit (IC) dies attached to die attach pads of lead frames, wherein the mold has one or more support elements in cavities of the mold for supporting the die attach pad portions of the lead frame while the mold is closed on the lead frame and encapsulation material is injected to encapsulate the IC dies and die attach pads. The support elements are, in a preferred embodiment, pins extending from the surfaces of the cavities in the mold, and the pins keep the die attach pads from moving into contact with surfaces of the cavities, so die attach pads or dies are not exposed in finished packages. In a preferred embodiment the pins each are tapered in the extended portion, so the amount of exposure of the die attach pad is absolutely minimized. In another embodiment, the support elements are retractable. In still other embodiments, support elements are beads bonded to a lead frame strip or dimples provided to a lead frame strip in the process of manufacturing the strip. Methods for practicing the invention are provided as well.
Inventors
- 👤 Gerald K. Fehr
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 20:17
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
210 words
A method for molding an integrated circuit (IC) package, comprising steps of: (a) placing a lead frame having a die attach pad and an IC die attached thereto between an upper and a lower portion of a mold having mating mold cavities for forming an encapsulation volume around the lead frame and attached IC die; (b) providing a support element in at least one of the mold cavities for spacing the die attach pad and attached die from an adjacent surface of one of the mold cavities, the support element providing contact to at least one of the IC die and die attach pad and to the adjacent surface in a manner allowing substantially all of the volume between the thusly spaced-apart elements to be filled with encapsulation material; (c) closing the upper and lower portions of the mold on the lead frame such that the die attach pad and attached die is enclosed and spaced apart from the adjacent surface while providing space for encapsulation material to flow into the space created by the support element; (d) injecting encapsulation material into the encapsulation volume; and (e) opening the upper and lower portions of the mold, thereby releasing the lead frame and leaving encapsulation material enclosing each attached IC die.
Claim 2
Independent Claim
210 words
A method for molding an integrated circuit (IC) package, comprising steps of: (a) placing a lead frame having a die attach pad and an IC die attached thereto between an upper and a lower portion of a mold having mating mold cavities for forming an encapsulation volume around the lead frame and attached IC die; (b) providing a support element in at least one of the mold cavities for spacing the die attach pad and attached die from an adjacent surface of one of the mold cavities, the support element providing contact to at least one of the IC die and die attach pad and to the adjacent surface in a manner allowing substantially all of the volume between the thusly spaced-apart elements to be filled with encapsulation material; (c) closing the upper and lower portions of the mold on the lead frame such that the die attach pad and attached die is enclosed and spaced apart from the adjacent surface while providing space for encapsulation material to flow into the space created by the support element; (d) injecting encapsulation material into the encapsulation volume; and (e) opening the upper and lower portions of the mold, thereby releasing the lead frame and leaving encapsulation material enclosing each attached IC die.
Claim 3
Dependent Claim
33 words
The method of claim 1 wherein the support element is a single element positioned substantially in the center of the mold cavity in the lower mold portion when the mold portions are closed.
Claim 4
Dependent Claim
22 words
The method of claim 2 wherein the support element is a dimple provided in the die attach pad of the lead frame.
Claim 5
Dependent Claim
20 words
The method of claim 2 wherein the support element is a bead of material affixed to the die attach pad.
Claim 6
Dependent Claim
40 words
The method of claim 2 wherein the support element is a pin engaged in a hole provided for the purpose in the mold cavity in the lower mold portion, the pin having an extended portion extending into the mold cavity.
Claim 7
Dependent Claim
14 words
The method of claim 5 wherein the pin is tapered on the extended portion.
Claim 8
Dependent Claim
11 words
The method of claim 1 wherein plural support elements are provided.
Claim 9
Dependent Claim
22 words
The method of claim 7 wherein the plural support elements are dimples provided in the die attach pad of the lead frame.
Claim 10
Dependent Claim
24 words
The method of claim 7 wherein the plural support elements are beads of material affixed to the die attach pad of the lead frame.
Claim 11
Dependent Claim
37 words
The method of claim 7 wherein the plural support elements are pins engaged in holes provided for the purpose in one of the mold cavities, the pins having each an extended portion extending into the mold cavity.
Claim 12
Dependent Claim
15 words
The method of claim 10 wherein the pins each are tapered on the extended portion.
Claim 13
Dependent Claim
37 words
The method of claim 1 wherein the support element is a retractable support element, and further comprising a step (e) for retracting the support element after the encapsulation material is injected, but before the encapsulation material solidifies.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-03 | 2001-05-05 | 2001-11-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-03 | 2005-05-05 | 2005-11-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-03 | 2009-05-05 | 2009-11-04 | $7700.00 | Window Closed / Lapsed |