Abstract A method for producing a panel of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of coating a circuitized core material that has been cut into panels with a dielectric material and copper cover sheets; forming circuits from the cover sheets by etching; applying an adhesive polymer across the dielectric material covering the entire area of the panel; applying a cover sheet; drilling the panel to form through-holes and vias; seeding and plating the through-holes and vias with joining metal; applying photo-resist to the panels exposed with an image of the area of the panel to be joined and developed; and etching the cover sheet and the photo-resist away in the area of the panel to be joined to expose the adhesive polymer.
An electronic circuit package having: a core material; a dielectric coating on both sides of the core material; an adhesive polymer coated over both sides of the core material covering the entire area of the package; and a cover sheet on both sides of the package selectively etched away to reveal the adhesive polymer in areas to be joined.
Claim 2
Dependent Claim
59 words
An electronic circuit package having: a core material; a dielectric coating on both sides of the core material; an adhesive polymer coated over both sides of the core material covering the entire area of the package; and a cover sheet on both sides of the package selectively etched away to reveal the adhesive polymer in areas to be joined.
Claim 3
Dependent Claim
14 words
The electronic circuit package of claim 1, wherein the adhesive polymer is poly(tetrafluoroethylene-perfluorovinyl ether).
Claim 4
Dependent Claim
17 words
The electronic circuit package of claim 1, wherein the dielectric coating is a silica filled poly(tetrafluoroethylene) composite.
Claim 5
Dependent Claim
15 words
The electronic circuit package of claim 1, wherein the coversheet is of a copper material.
Claim 6
Dependent Claim
13 words
The electronic circuit package of claim 1, wherein the core material is copper-Invar-copper.