Fluorocarbon resin prepreg and multilayer interconnection board prepared by using same

Abstract

Abstract PURPOSE:To obtain the title prepreg which can give a multilayer interconnection board excellent in high-frequency characteristics, dimensional stability, smearing resistance in drilling, and hot peel resistance, by sandwiching a fluorocarbon resin layer between fluorocarbon resin layers of a melting point lower than that of the former and integrating them. CONSTITUTION:The title prepreg is obtained by sandwiching a fluorocarbon resin layer (A) which is, for example, a resin-impregnated base (laminate) formed by impregnating a resin varnish-coated layer, sheet or film with a fluorocarbon resin (e.g., tetrafluoroethylene resin) or by impregnating a base such as a (non) woven fabric or paper with the resin between fluorocarbon resin layers of an m.p. lower than that of component A (e.g., tetrafluoroethylene/perfluorovinyl ether copolymer film) and integrating them. Said prepreg is disposed on the upper and/or lower surfaces of one-side or both-side circuit internal layer material, and an external layer material such as a one-side metal-clad laminate, a metal foil comprising Cu, Al, stainless steel or the like is disposed on its outside. The whole is integrated to obtain a multilayer interconnection board.

Inventors

• 👤 Hideto Misawa
• 👤 英人 三澤
• 👤 Shoji Fujikawa
• 👤 藤川　彰司
• 👤 Katsutoshi Hirakawa
• 👤 勝利 平川

Bibliographic Details