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US5663089A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for producing a laminated thin film capacitor

Assignee: Panasonic Holdings Corp
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Filing: 1995-06-05
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Granted: 1997-09-02
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Expires: 2015-06-05
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Abstract

Abstract A laminated thin film capacitor having a substrate, at least two electrode layers, at least one dielectric layer and a pair of external electrode which are placed on respective side walls of the capacitor, wherein the metal electrode layer and the dielectric layers are laminated alternately on the substrate, and every other metal electrode layers are exposed on each of side walls of the capacitor, which capacitor is excellent in dielectric properties such as a high capacity per unit volume.

Inventors

  • 👤 Atsushi Tomozawa
  • 👤 Eiji Fujii
  • 👤 Hideo Torii
  • 👤 Masumi Hattori
  • 👤 Satoru Fujii
  • 👤 Ryoichi Takayama

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 02:58
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/30; H01G4/306

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 148 words
A method for producing a laminated thin film capacitor comprising steps of: (a) forming a patterned metal electrode layer on a substrate by a method selected from the group consisting of a vacuum deposition method and a sputtering method, (b) forming a dielectric layer oriented in the (100) plane by a plasma CVD method using a vapor of a metal compound and a reaction gas, (c) forming a patterned metal electrode layer in the same way as in the step (a) on the dielectric layer formed in the step (b), (d) repeating the formation of the dielectric layer of the step (b) and the formation of the patterned metal electrode layer of the step (c) at least once in total, (e) cutting the laminate so that every other metal electrode layers are exposed on each of the cut walls, and (f) forming external electrodes on both cut walls.
Claim 2
Independent Claim 148 words
A method for producing a laminated thin film capacitor comprising steps of: (a) forming a patterned metal electrode layer on a substrate by a method selected from the group consisting of a vacuum deposition method and a sputtering method, (b) forming a dielectric layer oriented in the (100) plane by a plasma CVD method using a vapor of a metal compound and a reaction gas, (c) forming a patterned metal electrode layer in the same way as in the step (a) on the dielectric layer formed in the step (b), (d) repeating the formation of the dielectric layer of the step (b) and the formation of the patterned metal electrode layer of the step (c) at least once in total, (e) cutting the laminate so that every other metal electrode layers are exposed on each of the cut walls, and (f) forming external electrodes on both cut walls.
Claim 3
Dependent Claim 26 words
The method according to claim 1, wherein said dielectric layer consists of (Ba 1-x Sr x )TiO 3 in which x is from 0 to 1.0.
Claim 4
Dependent Claim 48 words
The method according to claim 2, wherein said dielectric layer of (Ba 1-x Sr x )TiO 3 is formed by a plasma CVD method from raw materials selected from the group consisting of β-diketone-metal complexes of barium, strontium and titanium and metal alkoxides of barium, strontium and titanium.
Claim 5
Dependent Claim 17 words
The method according to claim 2, wherein a substrate temperature is from 500° C. to 750° C.
Claim 6
Dependent Claim 26 words
The method according to claim 2, wherein said dielectric layer of (Ba 1-x Sr x )TiO 3 has a thickness of 0.05 μm to 3 μm.
Claim 7
Dependent Claim 37 words
The method according to claim 1, wherein said dielectric layer consists of a composite perovskite compound of the formula: Pb[(Mg 1/3 Nb 2/3 ) 1-x Ti x ]O 3 in which x is from 0 to 1.0.
Claim 8
Dependent Claim 54 words
The method according to claim 6, wherein said dielectric layer of Pb[(Mg 1/3 Nb 2/3 ) 1-x Ti x ]O 3 is formed by a plasma CVD method from raw materials selected from the group consisting of β-diketone-metal complexes of lead, magnesium, titanium and niobium and metal alkoxides of lead, magnesium, titanium and niobium.
Claim 9
Dependent Claim 17 words
The method according to claim 6, wherein a substrate temperature is from 450° C. to 750° C.
Claim 10
Dependent Claim 30 words
The method according to claim 6, wherein said dielectric layer of Pb[(Mg 1/3 Nb 2/3 ) 1-x Ti x ]O 3 has a thickness of 0.05 μm to 3 μm.
Claim 11
Dependent Claim 27 words
The method according to claim 1, wherein said reaction gas is a compound selected from the group consisting of oxygen, N 2 O and H 2 O.
Claim 12
Dependent Claim 49 words
The method according to claim 1, wherein said metal electrode layers are formed using a metal mask, and the position of said metal mask is shifted in each step of the formation of electrode layer so that parts at which the laminate is cut are superposed every other layers.
Claim 13
Dependent Claim 22 words
The method according to claim 1, wherein each of said metal electrode layers has a thickness of 0.01 μm to 0.2 μm.

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