US5661901A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for mounting and electrically interconnecting semiconductor dice
Assignee: Round Rock Research LLC
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Filing: 1995-07-10
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Granted: 1997-09-02
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Expires: 2015-07-10
Abstract
Abstract A method for mounting and electrically interconnecting a stack of semiconductor dice on edge to a circuit board is provided. The method forms interconnects adapted to mount each die on edge and establish an electrical connection between contact locations on the die (e.g., bond pads) and corresponding connection points on the circuit board. Each interconnect includes a substrate formed of a material such as silicon or ceramic having a low thermal coefficient of expansion (TCE). Trenches are etched or sawed into the substrate and are then filled with a metal to form conductive traces. Each conductive trace includes contact bump for contacting a contact location on a corresponding die. Z-axis conductive adhesives are used to attach the dice to the interconnects and the interconnects to the circuit board.
Inventors
- 👤 Jerrold L. King
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:04
CPC Classifications
H; H10; H10W; H10W90/00; H05; H05K; H05K3/00; H05K3/36; H05K3/366; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0376; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K3/10; H05K3/107; H05K3/14; H05K3/146; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K3/40; H05K3/403; H10W72/00; H10W72/834; H10W90/20; H10W90/297; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
90 words
A method for mounting an unpackaged semiconductor die to a supporting substrate, said method comprising: forming an interconnect including a substrate having a plurality conductive traces extending to an edge thereof, each said conductive trace including an insulated trench filled with a conductive material; attaching a die to the interconnect with contact locations on the die in electrical communication with the conductive traces; and attaching the interconnect on edge to the supporting substrate with edge portions of the conductive traces in electrical communication with connection points on the supporting substrate.
Claim 2
Independent Claim
90 words
A method for mounting an unpackaged semiconductor die to a supporting substrate, said method comprising: forming an interconnect including a substrate having a plurality conductive traces extending to an edge thereof, each said conductive trace including an insulated trench filled with a conductive material; attaching a die to the interconnect with contact locations on the die in electrical communication with the conductive traces; and attaching the interconnect on edge to the supporting substrate with edge portions of the conductive traces in electrical communication with connection points on the supporting substrate.
Claim 3
Dependent Claim
23 words
The method as claimed in claim 1 and further comprising forming a plurality of interconnects on a wafer and then singulating the wafer.
Claim 4
Dependent Claim
23 words
The method as claimed in claim 2 and wherein the interconnects and dice are attached to the supporting substrate in a stacked array.
Claim 5
Dependent Claim
20 words
The method as claimed in claim 3 and wherein the dice are attached to the interconnects using a conductive material.
Claim 6
Dependent Claim
21 words
The method as claimed in claim 4 and wherein the interconnects are attached to the supporting substrate using the conductive material.
Claim 7
Dependent Claim
25 words
The method as claimed in claim 5 and wherein the wafer is formed of a material selected from the class consisting of silicon and ceramic.
Claim 8
Dependent Claim
17 words
The method as claimed in claim 6 and wherein the trenches are formed by etching the wafer.
Claim 9
Dependent Claim
18 words
The method as claimed in claim 6 and wherein the trenches are formed by saw cutting the wafer.
Claim 10
Dependent Claim
19 words
The method as claimed in claim 6 and wherein the trenches are formed as through openings in the wafer.
Claim 11
Dependent Claim
18 words
The method as claimed in claim 6 and wherein the trenches are insulated using a grown oxide layer.
Claim 12
Independent Claim
130 words
A method for attaching an unpackaged semiconductor die to a circuit board, comprising: forming a wafer including a substrate; forming a pattern of trenches in the substrate; forming conductive traces by filling the trenches with a conductive material, each conductive trace having an edge portion extending to a street of the wafer; forming contact bumps on the conductive traces corresponding to contact locations on the die; singulating the wafer along the streets thereof to form a plurality of interconnects; attaching the die to an interconnect with contact locations on the die in electrical communication with the contact bumps on the conductive traces; and attaching the interconnect on edge to the circuit board with the edge portions of the conductive traces in electrical communication with connection points on the circuit board.
Claim 13
Independent Claim
130 words
A method for attaching an unpackaged semiconductor die to a circuit board, comprising: forming a wafer including a substrate; forming a pattern of trenches in the substrate; forming conductive traces by filling the trenches with a conductive material, each conductive trace having an edge portion extending to a street of the wafer; forming contact bumps on the conductive traces corresponding to contact locations on the die; singulating the wafer along the streets thereof to form a plurality of interconnects; attaching the die to an interconnect with contact locations on the die in electrical communication with the contact bumps on the conductive traces; and attaching the interconnect on edge to the circuit board with the edge portions of the conductive traces in electrical communication with connection points on the circuit board.
Claim 14
Dependent Claim
20 words
The method as claimed in claim 11 and wherein the die is attached to the interconnect using a conductive adhesive.
Claim 15
Dependent Claim
21 words
The method as claimed in claim 11 and wherein the interconnect is attached to the circuit board using a conducive adhesive.
Claim 16
Dependent Claim
17 words
The method as claimed in claim 11 and wherein the trenches are formed using an etching process.
Claim 17
Dependent Claim
16 words
The method as claimed in claim 11 and wherein the trenches are formed by saw cutting.
Claim 18
Dependent Claim
21 words
The method as claimed in claim 11 and further comprising forming a channel stop by implanting a dopant around the trenches.
Claim 19
Dependent Claim
29 words
The method as claimed in claim 11 and wherein a plurality of dice are attached to a plurality of interconnects attached to the circuit board as a stacked array.
Claim 20
Independent Claim
136 words
A method for attaching a plurality of unpackaged semiconductor dice to a circuit board, comprising: forming a plurality of interconnects each including a substrate formed of a material selected from the class consisting of silicon and ceramic; each said substrate including a pattern of conductive traces comprising insulated trenches filled with a conductive material, each said conductive trace extending to an edge of the substrate and including a contact bump corresponding to a contact location on a die; attaching each die to a respective interconnect with the contact locations of the die in electrical communication with the contact bumps on the conductive traces; and attaching the interconnects on edge to the circuit board with the conductive traces in electrical communication with connection points on the circuit board to form a stacked array of dice and interconnects.
Claim 21
Independent Claim
136 words
A method for attaching a plurality of unpackaged semiconductor dice to a circuit board, comprising: forming a plurality of interconnects each including a substrate formed of a material selected from the class consisting of silicon and ceramic; each said substrate including a pattern of conductive traces comprising insulated trenches filled with a conductive material, each said conductive trace extending to an edge of the substrate and including a contact bump corresponding to a contact location on a die; attaching each die to a respective interconnect with the contact locations of the die in electrical communication with the contact bumps on the conductive traces; and attaching the interconnects on edge to the circuit board with the conductive traces in electrical communication with connection points on the circuit board to form a stacked array of dice and interconnects.
Claim 22
Dependent Claim
23 words
The method as claimed in claim 18 and wherein the conductive traces are formed to be co-planar with a surface of the substrates.
Claim 23
Dependent Claim
14 words
The method as claimed in claim 19 and wherein the conductive traces are planarized.
Claim 24
Dependent Claim
30 words
The method as claimed in claim 20 and wherein the dice are attached to the interconnects and the interconnects are attached to the circuit board using a z-axis anisotropic adhesive.
Claim 25
Independent Claim
163 words
A method for attaching a plurality of unpackaged semiconductor dice to a circuit board, comprising: forming a wafer including a substrate having a low thermal coefficient of expansion (TCE); forming a plurality of interconnects on the wafer each interconnect including a pattern of trenches formed in the substrate and extending to streets formed on the wafer; forming conductive traces by filling the trenches with a conductive material, each conductive trace including an edge portion corresponding to a connection point on the circuit board; forming a contact bump on each conductive trace corresponding to a contact location on the die; sawing the wafer along the streets to singulate the interconnects; attaching the die to a singulated interconnect with contact locations on the die in electrical communication with the contact bumps formed on the conductive traces; and attaching the singulated interconnect on edge to the circuit board with the edge portions of the conductive traces in electrical communication with connection points on the circuit board.
Claim 26
Independent Claim
163 words
A method for attaching a plurality of unpackaged semiconductor dice to a circuit board, comprising: forming a wafer including a substrate having a low thermal coefficient of expansion (TCE); forming a plurality of interconnects on the wafer each interconnect including a pattern of trenches formed in the substrate and extending to streets formed on the wafer; forming conductive traces by filling the trenches with a conductive material, each conductive trace including an edge portion corresponding to a connection point on the circuit board; forming a contact bump on each conductive trace corresponding to a contact location on the die; sawing the wafer along the streets to singulate the interconnects; attaching the die to a singulated interconnect with contact locations on the die in electrical communication with the contact bumps formed on the conductive traces; and attaching the singulated interconnect on edge to the circuit board with the edge portions of the conductive traces in electrical communication with connection points on the circuit board.
Claim 27
Dependent Claim
30 words
The method as claimed in claim 22 and wherein the dice are attached to the interconnects and the interconnects are attached to the circuit board using a z-axis anisotropic adhesive.
Claim 28
Dependent Claim
14 words
The method as claimed in claim 23 and wherein the conductive traces are planarized.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-01 | 2001-03-03 | 2001-09-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-01 | 2005-03-03 | 2005-09-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-01 | 2009-03-03 | 2009-09-02 | $7700.00 | Window Closed / Lapsed |