US5654587A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stackable heatsink structure for semiconductor devices
Assignee: LSI Corp
•
Filing: 1995-10-24
•
Granted: 1997-08-05
•
Expires: 2015-10-24
Abstract
Abstract A stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess opening are sized and shaped such that an interference fit is formed when the button-like projection of one fin layer is pressed into the recess of another fin layer. The use of an adaptor to increase or decrease the effective size of the button-like projection of the bottommost fin layer is described. Relieving gases that may be entrapped in the recess during assembly is described. Circular, elliptical and polygonal shapes (outlines) for the fin layers are described.
Inventors
- 👤 Mark Schneider
- 👤 Joseph Joroski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 07:11
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; F; F28; F28F; F28F3/00; F28F3/02; H10W40/01; H10W40/03; H10W40/037; F28F2255/00; F28F2255/18
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
127 words
Self-stackable heatsink structure for a semiconductor device, comprising: a solid, generally planar, first fin assembly having a one surface adapted in use to be mounted on a semiconductor device, and having an other surface opposite the one surface; a recess formed into the other surface of the first fin element, said recess extending only partially through the first fin element; a solid, generally planar, second fin element having a one surface and an other surface opposite the one surface; and a button-like projection formed on the one surface of the second fin element, the button-like projection of the second fin element fitting securely into the recess of the first fin element to form a secure mechanical assembly of the first fin element and the second fin element.
Claim 2
Dependent Claim
127 words
Self-stackable heatsink structure for a semiconductor device, comprising: a solid, generally planar, first fin assembly having a one surface adapted in use to be mounted on a semiconductor device, and having an other surface opposite the one surface; a recess formed into the other surface of the first fin element, said recess extending only partially through the first fin element; a solid, generally planar, second fin element having a one surface and an other surface opposite the one surface; and a button-like projection formed on the one surface of the second fin element, the button-like projection of the second fin element fitting securely into the recess of the first fin element to form a secure mechanical assembly of the first fin element and the second fin element.
Claim 3
Dependent Claim
15 words
Self-stackable heatsink structure, according to claim 1, wherein: the fin layers have a circular outline.
Claim 4
Dependent Claim
13 words
Self-stackable heatsink structure, according to claim 1, wherein: the button-like projection is tapered.
Claim 5
Dependent Claim
12 words
Self-stackable heatsink structure, according to claim 1, wherein: the recess is chamfered.
Claim 6
Dependent Claim
13 words
Self-stackable heatsink structure, according to claim 1, wherein: the button-like projection is chamfered.
Claim 7
Dependent Claim
20 words
Self-stackable heatsink structure, according to claim 1, wherein: the first and the second fin elements are formed of powdered metal.
Claim 8
Dependent Claim
19 words
Self-stackable heatsink structure, according to claim 1, wherein: the first and the second fin elements are formed of copper.
Claim 9
Dependent Claim
21 words
Self-stackable heatsink structure, according to claim 1, further comprising: a gas relief groove formed in a side wall of the recess.
Claim 10
Dependent Claim
22 words
Self-stackable heatsink structure, according to claim 1, further comprising: a gas relief groove formed in a side wall of the button-like projection.
Claim 11
Dependent Claim
25 words
Self-stackable heatsink structure, according to claim 1, further comprising: a gas relief hole extending into the button-like projection and completely through the second fin element.
Claim 12
Dependent Claim
24 words
Self-stackable heatsink structure, according to claim 1, further comprising: a heat conductive substance disposed between the first fin element and the second fin element.
Claim 13
Dependent Claim
52 words
Self-stackable heatsink structure, according to claim 1, wherein: the first fin element has a button-like projection extending from the one surface; and further comprising: an adapter structure having an opening sized and shaped to form an interference fit with the button-like projection extending from the one surface of the first fin element.
Claim 14
Dependent Claim
14 words
Apparatus, according to claim 1, wherein: the fin layers are formed of powdered metal.
Claim 15
Dependent Claim
86 words
Self-stackable heatsink structure for a semiconductor device, according to claim 1, further comprising: a recess formed into the other surface of the second fin element, said recess extending only partially through the second fin element; a solid, generally planar, third fin element having a one surface and an other surface opposite the one surface; and a button-like projection formed on the one surface of the third fin element, the button-like projection of the third fin element fitting securely into the recess of the second fin element.
Claim 16
Dependent Claim
31 words
Self-stackable heatsink structure, according to claim 1, wherein: said button-like projection of the first fin element extends into and forms an interference fit with the recess of the second fin element.
Claim 17
Dependent Claim
26 words
Self-stackable heatsink structure for a semiconductor device, according to claim 1 wherein the button-like projection is press-fit into the recess to form the secure mechanical assembly.
Claim 18
Dependent Claim
28 words
Self-stackable heatsink structure for a semiconductor device, according to claim 16 wherein the button-like projection and the second fin element are formed as a unitary one-piece, single-fin construction.
Claim 19
Dependent Claim
29 words
Self-stackable heatsink structure for a semiconductor device, according to claim 1 wherein the button-like projection and the second fin element are formed as a unitary one-piece, single fin construction.
Claim 20
Dependent Claim
129 words
Self-stackable heatsink structure for a semiconductor device, comprising: a solid, generally planar, first fin assembly having a one surface adapted in use to be mounted on a semiconductor device, and having an other surface opposite the one surface; a button-like projection formed on the other surface of the first fin element; a solid, generally planar, second fin element having a one surface and an other surface opposite the one surface; and a recess formed into the one surface of the second fin element, said recess extending only partially through the second fin element wherein: the button-like projection of the first fin element is received snugly into the recess of the second fin element to form a secure mechanical assembly of the first fin element and the second fin element.
Claim 21
Dependent Claim
129 words
Self-stackable heatsink structure for a semiconductor device, comprising: a solid, generally planar, first fin assembly having a one surface adapted in use to be mounted on a semiconductor device, and having an other surface opposite the one surface; a button-like projection formed on the other surface of the first fin element; a solid, generally planar, second fin element having a one surface and an other surface opposite the one surface; and a recess formed into the one surface of the second fin element, said recess extending only partially through the second fin element wherein: the button-like projection of the first fin element is received snugly into the recess of the second fin element to form a secure mechanical assembly of the first fin element and the second fin element.
Claim 22
Dependent Claim
88 words
Self-stackable heatsink structure for a semiconductor device, according to claim 19, further comprising: a button-like projection extending from the other surface of the second fin element; a solid, generally planar, third fin element having a one surface and an other surface opposite the one surface; and a recess formed into the one surface of the third fin element, said recess extending only partially through the third fin element; wherein: the button-like projection of the second fin element is received snugly into the recess of the third fin element.
Claim 23
Dependent Claim
51 words
Self-stackable heatsink structure, according to claim 19, wherein: the first fin element has a recess extending into the one surface; and further comprising: an adapter structure having an button-like projection sized and shaped to form an interference fit with the recess extending into the one surface of the first fin element.
Claim 24
Dependent Claim
20 words
Self-stackable heatsink structure, according to claim 19, wherein: the first and the second fin elements are formed of powdered metal.
Claim 25
Dependent Claim
15 words
Self-stackable heatsink structure, according to claim 19, wherein: the fin layers have a circular outline.
Claim 26
Dependent Claim
26 words
Self-stackable heatsink structure for a semiconductor device, according to claim 19 wherein the button-like projection is press-fit into the recess to form the secure mechanical assembly.
Claim 27
Dependent Claim
29 words
Self-stackable heatsink structure for a semiconductor device, according to claim 24 wherein the button-like projection and the first fin element are formed as a unitary one-piece, single fin construction.
Claim 28
Dependent Claim
28 words
Self-stackable heatsink structure for a semiconductor device, according to claim 19 wherein the button-like projection and the first fin element are formed as a unitary one-piece, single-fin construction.
Claim 29
Dependent Claim
85 words
A heat sink assembly, comprising: a first fin including a projection extending from a surface thereof; a second fin including a recess formed in a surface thereof for press-fittingly receiving said projection; said first and second fins are identical; said first fin further includes a recess formed in a surface that is opposite to said surface from which said projection extends; and said second fin further includes a projection extending from a surface that is opposite to said surface in which said recess is formed.
Claim 30
Dependent Claim
85 words
A heat sink assembly, comprising: a first fin including a projection extending from a surface thereof; a second fin including a recess formed in a surface thereof for press-fittingly receiving said projection; said first and second fins are identical; said first fin further includes a recess formed in a surface that is opposite to said surface from which said projection extends; and said second fin further includes a projection extending from a surface that is opposite to said surface in which said recess is formed.
Claim 31
Dependent Claim
22 words
A heat sink assembly as in claim 27, further comprising a third fin which is identical to said first and second fins.
Claim 32
Dependent Claim
68 words
A heat sink assembly as in claim 27, further comprising a third fin which includes: a recess that is identical to said recesses of said first and second fins formed in a surface thereof; and a surface that is opposite to said surface in which said recess is formed and which does not have a projection identical to said projections of said first and second fins extending therefrom.
Claim 33
Dependent Claim
65 words
A heat sink assembly is in claim 27, further comprising a third fin which includes: a projection that is identical to said projections of said first and second fins extending from a surface thereof; and a surface that is opposite to said surface from which said projection extends and does not have recess identical to said recesses of said first and second fins formed therein.
References Cited (Backward Citations)
DE525665C
Cited
US2414801A
Cited
US3205936A
Cited
US3372733A
Cited
US3413532A
Cited
US3388739A
Cited
US3457988A
Cited
JPS5425168A
Cited
US4340902A
Cited
US4535384A
Cited
US4345267A
Cited
US4396935A
Cited
US4404582A
Cited
US4620215A
Cited
JPS59117244A
Cited
JPH0273657A
Cited
US5175612A
Cited
US5227663A
Cited
JPH0472747A
Cited
JPH04130759A
Cited
US5172301A
Cited
US5293930A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-08-04 | 2001-02-03 | 2001-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-08-04 | 2005-02-03 | 2005-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-08-04 | 2009-02-03 | 2009-08-05 | $7700.00 | Window Closed / Lapsed |