Heat sink for a semiconductor device

Claim 2

A semiconductor device, comprising: (a) a mother board; (b) a plurality of IC packages mounted in a matrix arrangement on said mother board, each with a first main surface thereof adjacent to said mother board and a second main surface thereof remote from said mother board, each of said plurality of IC packages housing a semiconductor element therein and having electrical connecting means projecting from said first main surface, and being coupled to said mother board by using only said electrical connecting means; and (c) heat sink means including a base board portion being joined only to said second main surface of said plurality of IC packages, a heat conducting shaft portion arranged approximately perpendicular to said base board portion and a plurality of heat dissipating fins disposed on and extending outwardly from and approximately perpendicular to said heat conducting shaft portion in spaced, approximately parallel relationship to each other, wherein said heat sink means includes a common heat sink having at least one slit extending parallel to and through said heat conducting shaft from said base board portion to approximately midway of the height of said heat conducting shaft to define a number of sections of said base board portion respectively corresponding to said plurality of IC packages, and wherein said common heat sink is joined to said plurality of IC packages at said sections of said base board portion.

Claim 3

A semiconductor device as set forth in claim 1, wherein said heat sink includes at least two said slits, and wherein said base board portion is divided by said at least two slits into the same number of said sections as the number of said plurality of said IC packages mounted on said mother board.

Claim 4

A semiconductor device as set forth in claim 1, wherein the thickness of said base board portion is larger than the thickness of each of said plurality of heat dissipating fins.

Claim 5

A semiconductor device as set forth in claim 1, 2 or 3, wherein each of said plurality of IC packages includes a plurality of bonding pads thereon, wherein said mother board includes printed circuit patterns thereon disposed to be contacted by said plurality of bonding pads of said plurality of IC packages when mounted thereon, and wherein said plurality of IC packages is mounted on said mother board with said plurality of bonding pads of said plurality of IC packages bonded to said printed circuit patterns on said mother board.

Claim 6

A semiconductor device as set forth in claim 1, 2 or 3, wherein said heat sink means is joined to said plurality of IC packages by an epoxy adhesive agent.

Claim 7

A semiconductor device as set forth in claim 1, 2 or 3, wherein said heat sink means is joined to said plurality of IC packages by brazing said base board portion to said second main surface of said plurality of IC packages.

Claim 8

A semiconductor device, comprising: (a) a plurality of IC packages, each of said plurality of IC packages having first and second, spaced, main surfaces and housing a semiconductor element therein, and having a plurality of bonding pads on said first main surfaces thereof electrically connected to terminals of said semiconductor element thereof; (b) a plurality of heat sinks respectively mounted only on said second main surfaces of said plurality of IC packages, each said heat sink including a base board portion, a heat conducting shaft portion arranged approximately perpendicular to said base board portion, and a plurality of heat dissipating fins disposed on and extending outwardly from and approximately perpendicular to said heat conducting shaft portion in spaced, approximately parallel relationship to each other, wherein the outer dimension of each of the plurality of heat dissipating fins is smaller than the outer dimension of the corresponding IC package; and (c) a mother board having first and second main surfaces and including electrical contact means disposed in a matrix arrangement on said first main surface thereof contacting only corresponding said bonding pads of said plurality of IC packages, a plurality of pin terminals extending from said second main surface of said mother board, and electrical interconnecting means for interconnecting said contact means and said pin terminals, and said plurality of IC packages being mounted on said mother board with said contact pads of the respective said IC packages contacting said corresponding electrical contact means of said mother board for electrically interconnecting the respective said semiconductor elements of said IC packages through said associated bonding pads and said electrical interconnecting means to said pin terminals of said mother board.

Claim 9

A semiconductor device, comprising: (a) a plurality of IC packages, each of said plurality of IC packages having first and second, spaced, main surfaces and housing a semiconductor element therein, and having a plurality of bonding pads on said first main surfaces thereof electrically connected to terminals of said semiconductor element thereof; (b) a plurality of heat sinks respectively mounted only on said second main surfaces of said plurality of IC packages, each said heat sink including a base board portion, a heat conducting shaft portion arranged approximately perpendicular to said base board portion, and a plurality of heat dissipating fins disposed on and extending outwardly from and approximately perpendicular to said heat conducting shaft portion in spaced, approximately parallel relationship to each other, wherein the outer dimension of each of the plurality of heat dissipating fins is smaller than the outer dimension of the corresponding IC package; and (c) a mother board having first and second main surfaces and including electrical contact means disposed in a matrix arrangement on said first main surface thereof contacting only corresponding said bonding pads of said plurality of IC packages, a plurality of pin terminals extending from said second main surface of said mother board, and electrical interconnecting means for interconnecting said contact means and said pin terminals, and said plurality of IC packages being mounted on said mother board with said contact pads of the respective said IC packages contacting said corresponding electrical contact means of said mother board for electrically interconnecting the respective said semiconductor elements of said IC packages through said associated bonding pads and said electrical interconnecting means to said pin terminals of said mother board.

Claim 10

A semiconductor device as recited in claim 7, wherein said semiconductor device includes four IC packages, wherein said mother board has an approximately square-shaped periphery of four sides, and wherein said plurality of pin terminals of said mother board is secured to and extends from said four sides of said mother board.

Claim 11

A semiconductor device as recited in claim 7, wherein each said heat sink is joined to said corresponding IC package by an epoxy adhesive agent.

Claim 12

A semiconductor device are recited in claim 8, wherein each said heat sink is joined to said corresponding IC package by an epoxy adhesive agent.

Claim 13

A semiconductor device as recited in claim 7, wherein each said heat sink is joined to said corresponding IC package by brazing said base board portion to said second main surface thereof.

Claim 14

A semiconductor device as recited in claim 8, wherein each said heat sink is joined to said corresponding IC package by brazing said base board portion to said second main surface thereof.

Claim 15

A semiconductor device as recited in claim 7, 8, 9, 10, 11 or 12, wherein said heat conducting shaft portion of each said heat sink is of a generally columnar shape and wherein each of said plurality of heat dissipating fins of each of said heat sinks has a generally disk shape.