Optical coupling device and method for manufacturing the same

Claim 1

An optocoupler, comprising: a light-emitting semiconductor transmitter chip; a light-detecting semiconductor receiver chip adjacent to the transmitter chip; a coupling medium comprising a transparent insulating layer for increasing the insulating strength of the optocoupler, a transparent structured spacer layer defining a spacing between the transmitter chip and the receiver chip, and a transparent connecting layer joining the transmitter chip to the receiver chip; said transparent insulating layer being applied on top of the receiver chip completely over the region of the light sensitive surface of the semiconductor receiver chip so that radiation emitted by the transmitter chip passes through the transparent insulating layer to the receiver chip; said transparent structured spacer layer being applied on top of said transparent insulating layer between the light-emitting semiconductor transmitter chip and the light-detecting semiconductor receiver chip having a structure defining interspaces between the light emitting semiconductor transmitter chip and the transparent insulating layer; and said transparent connecting layer being secured to the light-emitting semiconductor transmitter chip and located within the interspaces of the transparent structured spacer layer.