US4888625A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optoelectronic coupling element, and method of making same
Assignee: Siemens AG
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Filing: 1987-09-22
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Granted: 1989-12-19
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Expires: 2007-09-22
Abstract
Abstract An optoelectronic coupling element having a light-emitting semiconductor device serving as transmitter chip, and a light-receiving semiconductor device serving as a receiver chip, and are firmly connected together through an optic coupling medium (3). This compact coupling element is to have a defined degree of coupling largely independent of the housing and is to be suitable for simple conductor tape mounting. To this end, the coupling medium (3) is an insulating transparent intermediate layer, and the light-emitting semiconductor device (1), the coupling element (3) and the light-receiving semiconductor device (2) are directly laminated one on the other. This optoelectronic coupler is used in particular as an optocoupler for signal transmission.
Inventors
- 👤 Ruediger Mueller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 03:14
CPC Classifications
H; H04; H04B; H04B10/00; H04B10/80; H04B10/801; H04B10/802; H10; H10F; H10F55/00; H10F55/20; H10F55/25; H10F55/255
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
132 words
An optoelectronic coupler comprising a light-emitting semiconductor device in the form of a transmitter chip, and a light-receiving semiconductor device in the form of a receiver chip, an optical coupling medium being insulative and transparent and fixedly joining together the two chips, each of said two chips having contact terminals on a surface opposite to the optical coupling medium the optical coupling medium being an intermediate layer and providing the sole mechanical binding between transmitter chip, and said receiver chip, the light-emitting semiconductor device, the coupling medium and the light-receiving semiconductor device being joined together adhesively by stacking directly one on the other wherein the contact terminals are disposed on opposing surfaces of the two chips joined together, and the coupling medium is formed as part of one of the two chips.
Claim 2
Dependent Claim
132 words
An optoelectronic coupler comprising a light-emitting semiconductor device in the form of a transmitter chip, and a light-receiving semiconductor device in the form of a receiver chip, an optical coupling medium being insulative and transparent and fixedly joining together the two chips, each of said two chips having contact terminals on a surface opposite to the optical coupling medium the optical coupling medium being an intermediate layer and providing the sole mechanical binding between transmitter chip, and said receiver chip, the light-emitting semiconductor device, the coupling medium and the light-receiving semiconductor device being joined together adhesively by stacking directly one on the other wherein the contact terminals are disposed on opposing surfaces of the two chips joined together, and the coupling medium is formed as part of one of the two chips.
Claim 3
Dependent Claim
162 words
An optoelectronic coupler comprising a light-emitting semiconductor device in the form of a transmitter chip, a light-receiving semiconductor device in the form of a receiver chip, an optical coupling medium being insulative and transparent and fixedly joining together the two chips, the optical coupling medium being an intermediate layer whose area essentially corresponds to an area coextensive to the two chips, the light-emitting semiconductor device, the coupling medium and the light-receiving semiconductor device being joined together adhesively by stacking directly one on the other and the coupling medium provides the sole mechanical bond between the two chips, each one of the two chips having contact terminals on one surface located away from the coupling medium so that when the two devices are joined the contact terminals are on opposing surfaces of the devices joined together, and the coupling medium has contacting surfaces one glued to a contact surface of the light-emitting semiconductor device and the other glued to the light-receiving semiconductor device.
Claim 4
Dependent Claim
162 words
An optoelectronic coupler comprising a light-emitting semiconductor device in the form of a transmitter chip, a light-receiving semiconductor device in the form of a receiver chip, an optical coupling medium being insulative and transparent and fixedly joining together the two chips, the optical coupling medium being an intermediate layer whose area essentially corresponds to an area coextensive to the two chips, the light-emitting semiconductor device, the coupling medium and the light-receiving semiconductor device being joined together adhesively by stacking directly one on the other and the coupling medium provides the sole mechanical bond between the two chips, each one of the two chips having contact terminals on one surface located away from the coupling medium so that when the two devices are joined the contact terminals are on opposing surfaces of the devices joined together, and the coupling medium has contacting surfaces one glued to a contact surface of the light-emitting semiconductor device and the other glued to the light-receiving semiconductor device.
Claim 5
Dependent Claim
26 words
An optoelectronic coupling element according to claim 1, wherein the coupling medium comprises one of the group consisting of silicon nitride aluminum oxide or silicon dioxide.
Claim 6
Dependent Claim
26 words
An optoelectronic coupling element according to claim 2, wherein the coupling medium comprises one of the group consisting of silicon nitride aluminum oxide or silicon dioxide.
Claim 7
Dependent Claim
30 words
An optoelectronic coupler according to claim 1, wherein a monocrystalline silicon layer is applied on the insulating transparent intermediate layer forming the coupling medium for receiving the light-receiving semiconductor component.
Claim 8
Dependent Claim
30 words
An optoelectronic coupler according to claim 2, wherein a monocrystalline silicon layer is applied on the insulating transparent intermediate layer forming the coupling medium for receiving the light-receiving semiconductor component.
Claim 9
Dependent Claim
29 words
An optoelectronic coupling element according to claim 1, wherein a monocrystalline GaAs layer is applied on the insulating transparent intermediate layer forming the coupling medium for the light-emitting semiconductor.
Claim 10
Dependent Claim
29 words
An optoelectronic coupling element according to claim 2, wherein a monocrystalline GaAs layer is applied on the insulating transparent intermediate layer forming the coupling medium for the light-emitting semiconductor.
Claim 11
Dependent Claim
29 words
An optoelectronic coupling element according to claim 2, wherein a monocrystalline GaAs layer is applied on the insulating transparent intermediate layer forming the coupling medium for the light-emitting semiconductor.
Claim 12
Dependent Claim
30 words
An optoelectronic coupling element according to claim 1, wherein the coupling medium has an active region for the light-emitting semiconductor device of smaller area than for the light-receiving semiconductor device.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-18 | 1993-06-19 | 1993-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-18 | 1997-06-19 | 1997-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-18 | 2001-06-19 | 2001-12-19 | $7700.00 | Window Closed / Lapsed |