US5652693A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate with thin film capacitor and insulating plug
Assignee: Fujitsu Ltd
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Filing: 1995-06-06
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Granted: 1997-07-29
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Expires: 2015-06-06
Abstract
Abstract A thin-film bypass capacitor is fabricated by forming a plurality of through holes through the thickness of a nonconductive base substrate and filling the through holes with a conductive material to form ground vias and power vias. A sequence of back side metalization layers are applied to the back side surface of the base substrate. A sequence of bottom contact layers are applied to the front side surface of the base substrate. A bottom contact power terminal is formed in the bottom contact layer and is electrically isolated from remaining portions of the bottom contact layers by insulating plugs. A bottom contact metalization layer is applied to the surface of the bottom contact layers and the insulating plugs. A dielectric layer is formed on the surface of the bottom contact metalization layer. A ground metalization via and a power metalization via are formed at the surface of the dielectric layer. A sequence of top contact layers are applied to the surface of the dielectric layer and a front side ground terminal and front side power terminal are formed. A back side ground terminal and a back side power terminal are formed at the back side of the base substrate.
Inventors
- 👤 William T. Chou
- 👤 Michael G. Peters
- 👤 Wen-chou Vincent Wang
- 👤 Richard L. Wheeler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 02:35
CPC Classifications
H; H10; H10W; H10W72/00; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H10W44/00; H10W44/601; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/685; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2203/00; H05K2203/03; H05K2203/0315; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
150 words
A thin-film capacitor comprising: a nonconductive substrate having a back side and a front side; a capacitor formed on one side of the substrate, the capacitor having a ground plate, a power plate and a dielectric layer between the ground and power plate; a ground electrical terminal on the back side of the substrate connected to the ground plate; a ground electrical terminal on the front side of the substrate connected to the ground plate; a power electrical terminal on the front side of the substrate connected to the power plate; a trench disposed around the front side power terminal that electrically isolates the front side power terminal from the front side ground terminal; an insulating material filling the trench, wherein the dielectric layer overlies at least a portion of the insulating material, and a power electrical terminal on the back side of the substrate connected to the power plate.
Claim 2
Dependent Claim
150 words
A thin-film capacitor comprising: a nonconductive substrate having a back side and a front side; a capacitor formed on one side of the substrate, the capacitor having a ground plate, a power plate and a dielectric layer between the ground and power plate; a ground electrical terminal on the back side of the substrate connected to the ground plate; a ground electrical terminal on the front side of the substrate connected to the ground plate; a power electrical terminal on the front side of the substrate connected to the power plate; a trench disposed around the front side power terminal that electrically isolates the front side power terminal from the front side ground terminal; an insulating material filling the trench, wherein the dielectric layer overlies at least a portion of the insulating material, and a power electrical terminal on the back side of the substrate connected to the power plate.
Claim 3
Dependent Claim
15 words
The thin-film capacitor as recited in claim 1 wherein the capacitor is a bypass capacitor.
Claim 4
Dependent Claim
275 words
A thin-film capacitor comprising: a nonconductive substrate having at least one electrically conductive ground via and at least one electrically conductive power via, wherein each ground and power via extend through the substrate; a back side ground terminal on a back side surface of the substrate and in electrical connection with a ground via; a back side power terminal on the back side surface of the substrate and in electrical connection with a power via; a bottom contact layer on a front side surface of the substrate; a bottom contact power terminal on the front side surface of the substrate comprising a portion of the bottom contact layer adjacent to and in electrical connection with a power via, wherein the bottom contact power terminal is physically and electrically separated from remaining portions of the bottom contact layer by a a bottom contact trench; an insulating plug disposed within the bottom contact trench to electrically isolate the bottom contact power terminal from remaining portions of the bottom contact layer in electrical contact with a ground via; a bottom contact metalization layer disposed on surface of the bottom contact layer; a dielectric layer on a surface of the bottom contact metalization layer and the insulating plug; a top contact layer on a surface of the dielectric layer; a front side ground terminal comprising a portion of the top contact layer electrically isolated from a power via and adjacent to and in electrical connection with a ground via; and a front side power terminal comprising a portion of the top contact layer adjacent to the bottom contact power terminal and electrically isolated from the front side ground terminal.
Claim 5
Dependent Claim
275 words
A thin-film capacitor comprising: a nonconductive substrate having at least one electrically conductive ground via and at least one electrically conductive power via, wherein each ground and power via extend through the substrate; a back side ground terminal on a back side surface of the substrate and in electrical connection with a ground via; a back side power terminal on the back side surface of the substrate and in electrical connection with a power via; a bottom contact layer on a front side surface of the substrate; a bottom contact power terminal on the front side surface of the substrate comprising a portion of the bottom contact layer adjacent to and in electrical connection with a power via, wherein the bottom contact power terminal is physically and electrically separated from remaining portions of the bottom contact layer by a a bottom contact trench; an insulating plug disposed within the bottom contact trench to electrically isolate the bottom contact power terminal from remaining portions of the bottom contact layer in electrical contact with a ground via; a bottom contact metalization layer disposed on surface of the bottom contact layer; a dielectric layer on a surface of the bottom contact metalization layer and the insulating plug; a top contact layer on a surface of the dielectric layer; a front side ground terminal comprising a portion of the top contact layer electrically isolated from a power via and adjacent to and in electrical connection with a ground via; and a front side power terminal comprising a portion of the top contact layer adjacent to the bottom contact power terminal and electrically isolated from the front side ground terminal.
Claim 6
Dependent Claim
68 words
The thin-film capacitor as recited in claim 3 wherein the back side power terminal and back side ground terminal are each made up of a back side metalization layer comprising: a back side adhesion layer for providing a bonding surface for a subsequent layer; a back side conductive layer for providing electrical conductivity through the metalization layer; and a back side metal layer for protecting the conductive layer.
Claim 7
Dependent Claim
53 words
The thin-film capacitor as recited in claim 4 wherein the bottom contact layer comprises: a bottom contact adhesion layer for providing a bonding surface for a subsequent layer; a bottom contact conductive layer for providing electrical conductivity through the bottom contact layer; and a bottom contact metal layer for protecting the conductive layer.
Claim 8
Dependent Claim
58 words
The thin-film capacitor as recited in claim 5 wherein the dielectric layer is a nonconductive oxide of the bottom contact metalization layer, the dielectric layer serving to electrically isolate a portion of the bottom contact layer in electrical connection with a ground via from a portion of the bottom contact layer in electrical connection with a power via.
Claim 9
Dependent Claim
68 words
The thin-film capacitor as recited in claim 6 wherein the front side ground terminal and front side power terminal are each made up of a top contact layer comprising: a top contact adhesion layer for providing a bonding surface for a subsequent layer; a top contact conductive layer for providing electrical conductivity through the top contact layer; and a top contact metal layer for protecting the conductive layer.
Claim 10
Dependent Claim
190 words
A thin-film capacitor comprising: a substrate having a front side and back side surface; a capacitor disposed on a front side surface of the substrate and comprising a first electrode construction, a second electrode construction, and a dielectric layer interposed therebetween, wherein the first electrode construction includes: a dielectric plug that is used to form an electrically isolated portion of the first electrode, the dielectric plug being filled with an electrically insulating material; a ground terminal disposed at a front side of the thin-film capacitor formed from an electrically isolated portion of the second electrode construction and in electrical connection with the first electrode construction; a power terminal disposed at the front side of the thin-film capacitor formed from a remaining portion of the second electrode construction and in electrical connection with electrically isolated portion of the first electrode construction; a power terminal disposed at the back side surface of the substrate and electrically connected to the electrically isolated portion of the first electrical construction; and a ground terminal disposed at the back side surface of the substrate and electrically connected to a remaining portion of the first electrical construction.
Claim 11
Dependent Claim
190 words
A thin-film capacitor comprising: a substrate having a front side and back side surface; a capacitor disposed on a front side surface of the substrate and comprising a first electrode construction, a second electrode construction, and a dielectric layer interposed therebetween, wherein the first electrode construction includes: a dielectric plug that is used to form an electrically isolated portion of the first electrode, the dielectric plug being filled with an electrically insulating material; a ground terminal disposed at a front side of the thin-film capacitor formed from an electrically isolated portion of the second electrode construction and in electrical connection with the first electrode construction; a power terminal disposed at the front side of the thin-film capacitor formed from a remaining portion of the second electrode construction and in electrical connection with electrically isolated portion of the first electrode construction; a power terminal disposed at the back side surface of the substrate and electrically connected to the electrically isolated portion of the first electrical construction; and a ground terminal disposed at the back side surface of the substrate and electrically connected to a remaining portion of the first electrical construction.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-28 | 2001-01-27 | 2001-07-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-28 | 2005-01-27 | 2005-07-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-28 | 2009-01-27 | 2009-07-29 | $7700.00 | Window Closed / Lapsed |