US5406446A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin film capacitor
Assignee: Fujitsu Ltd
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Filing: 1994-02-25
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Granted: 1995-04-11
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Expires: 2014-02-25
Abstract
Abstract A thin-film bypass capacitor is fabricated by forming a plurality of through holes through the thickness of a nonconductive base substrate and filling the through holes with a conductive material to form ground vias and power vias. A sequence of back side metalization layers are applied to the back side surface of the base substrate. A sequence of bottom contact layers are applied to the front side surface of the base substrate. A bottom contact power terminal is formed and a bottom contact metalization layer is applied to the surface of the bottom contact layers. A portion of the metalization layer is removed and an insulating layer is formed on the surface of the bottom contact metalization layer. A ground metalization feedthrough and a power metalization feedthrough are formed at the surface of the insulating layer. A sequence of top contact layers are applied to the surface of the insulating layer and a front side ground terminal and front side power terminal are formed. A back side ground terminal and a back side power terminal are formed at the back side of the base substrate.
Inventors
- 👤 Michael G. Peters
- 👤 William T. Chou
- 👤 Wen-chou V. Wang
- 👤 Michael G. Lee
- 👤 Solomon I. Beilin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:58
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/228; H01G4/232; H01G4/30; H01G4/306; H05; H05K; H05K1/00; H05K1/16; H05K1/162; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K2203/00; H05K2203/03; H05K2203/0315; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/722; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/43; Y10T29/435; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
99 words
A thin-film capacitor comprising: a nonconductive substrate having a back side and a front side; a capacitor formed on one side of the substrate, the capacitor having a ground plate and a power plate; a ground electrical terminal on the back side of the substrate connected to the ground plate; a ground electrical terminal on the front side of the substrate connected to the ground plate; a power electrical terminal on the back side of the substrate connected to the power plate; and a power electrical terminal on the front side of the substrate connected to the power plate.
Claim 2
Dependent Claim
99 words
A thin-film capacitor comprising: a nonconductive substrate having a back side and a front side; a capacitor formed on one side of the substrate, the capacitor having a ground plate and a power plate; a ground electrical terminal on the back side of the substrate connected to the ground plate; a ground electrical terminal on the front side of the substrate connected to the ground plate; a power electrical terminal on the back side of the substrate connected to the power plate; and a power electrical terminal on the front side of the substrate connected to the power plate.
Claim 3
Dependent Claim
15 words
A thin-film capacitor as recited in claim 1 wherein the capacitor is a bypass capacitor.
Claim 4
Dependent Claim
165 words
A thin-film capacitor comprising: a nonconductive substrate having at least one electrically conductive ground via and at least one electrically conductive power via extending through the substrate; a back side ground terminal on a back side surface of the substrate in electrical connection with the ground via; a back side power terminal on a back side surface of the substrate in electrical connection with the power via; a bottom contact layer on a front side surface of the substrate; a bottom contact metalization layer disposed on the surface of the bottom contact layer; an insulating layer on the surface of the bottom contact metalization layer; a top contact layer on the surface of the insulating layer; a front side ground terminal comprising a portion of the top contact layer in electrical connection with the ground via; and a front side power terminal comprising a portion of the top contact layer electrically isolated from the front side ground terminal in electrical connection with the power via.
Claim 5
Dependent Claim
165 words
A thin-film capacitor comprising: a nonconductive substrate having at least one electrically conductive ground via and at least one electrically conductive power via extending through the substrate; a back side ground terminal on a back side surface of the substrate in electrical connection with the ground via; a back side power terminal on a back side surface of the substrate in electrical connection with the power via; a bottom contact layer on a front side surface of the substrate; a bottom contact metalization layer disposed on the surface of the bottom contact layer; an insulating layer on the surface of the bottom contact metalization layer; a top contact layer on the surface of the insulating layer; a front side ground terminal comprising a portion of the top contact layer in electrical connection with the ground via; and a front side power terminal comprising a portion of the top contact layer electrically isolated from the front side ground terminal in electrical connection with the power via.
Claim 6
Dependent Claim
68 words
A thin-film capacitor as recited in claim 3 wherein the back side power terminal and back side ground terminal are each made up of a back side metalization layer comprising a back side adhesion layer for providing a bonding surface for a subsequent layer, a back side conductive layer for providing electrical conductivity through the metalization layer, and a back side metal layer for protecting the conductive layer.
Claim 7
Dependent Claim
53 words
A thin-film capacitor as recited in claim 4 wherein the bottom contact layer comprises a bottom contact adhesion layer for providing a bonding surface for a subsequent layer, a bottom contact conductive layer for providing electrical conductivity through the bottom contact layer, and a bottom contact metal layer for protecting the conductive layer.
Claim 8
Dependent Claim
58 words
A thin-film capacitor as recited in claim 5 wherein the insulating layer is a nonconductive oxide of the bottom contact metalization layer, the insulating layer serving to electrically isolate a portion of the bottom contact layer in electrical contact with the ground via from a portion of the bottom contact layer in electrical contact with the power via.
Claim 9
Dependent Claim
68 words
A thin-film capacitor as recited in claim 6 wherein the front side ground terminal and front side power terminal are each made Up of a top contact layer comprising a top contact adhesion layer for providing a bonding surface for a subsequent layer, a top contact conductive layer for providing electrical conductivity through the top contact layer, and a top contact metal layer for protecting the conductive layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-04-10 | 1998-10-10 | 1999-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-04-10 | 2002-10-10 | 2003-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-04-10 | 2006-10-10 | 2007-04-11 | $7700.00 | Window Closed / Lapsed |