US5647528A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bondhead lead clamp apparatus and method
Assignee: Micron Technology Inc
•
Filing: 1996-02-06
•
Granted: 1997-07-15
•
Expires: 2016-02-06
Abstract
Abstract An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The present invention includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the present invention also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. The present invention also contemplates the replacement of the fixed clamp with another, or second, independent clamp in addition to the first individual independent lead finger clamp during the wire bonding process.
Inventors
- 👤 Michael B. Ball
- 👤 Rich Fogal
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:32
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/041; H10W70/40; H10W70/411; H10W70/415; B23K2101/00; B23K2101/36; B23K2101/40; H10P; H10P72/00; H10P72/04; H10P72/0444; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07178; H10W72/075; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 66
Claim 1
Independent Claim
95 words
Apparatus for bonding a wire to a bond pad located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad and said lead finger and bonding said wire to said bond pad or said lead finger; an independent clamp for engaging another portion of said lead finger before the bonding of said wire thereto, the independent clamp being movable; and a fixed clamp for engaging a portion of said lead finger.
Claim 2
Dependent Claim
95 words
Apparatus for bonding a wire to a bond pad located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad and said lead finger and bonding said wire to said bond pad or said lead finger; an independent clamp for engaging another portion of said lead finger before the bonding of said wire thereto, the independent clamp being movable; and a fixed clamp for engaging a portion of said lead finger.
Claim 3
Independent Claim
60 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning a resiliently mounted, independently movable and actuated clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto.
Claim 4
Independent Claim
60 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning a resiliently mounted, independently movable and actuated clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto.
Claim 5
Dependent Claim
33 words
The apparatus of claim 1, wherein the independent clamp is located between the bonding apparatus and a fixed clamp engaging a portion of the lead finger during the bonding of said wire thereto.
Claim 6
Dependent Claim
25 words
The apparatus of claim 1, wherein the independent clamp comprises: an independent clamp having the ability to move independently in the x-axis, y-axis and z-axis.
Claim 7
Dependent Claim
22 words
The apparatus of claim 1, wherein the independent clamp is movable independently in any direction of the movement of the bonding apparatus.
Claim 8
Dependent Claim
22 words
The apparatus of claim 1, the bonding apparatus exerts a force of substantially 50 to 100 grams when contacting the lead finger.
Claim 9
Dependent Claim
17 words
The apparatus of claim 1, wherein said apparatus further comprises: heating apparatus located beneath said semiconductor chip.
Claim 10
Dependent Claim
17 words
The apparatus of claim 6, wherein said apparatus further comprises: heating apparatus located beneath said lead finger.
Claim 11
Dependent Claim
20 words
The apparatus of claim 6, wherein the heating apparatus operates at substantially 230 degrees Centigrade to heat said semiconductor chip.
Claim 12
Dependent Claim
17 words
The apparatus of claim 6, wherein said semiconductor chip is heated before a wire is bonded thereto.
Claim 13
Dependent Claim
88 words
Apparatus for bonding a wire to a bond pad located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad and said lead finger and bonding said wire to said bond pad or said lead finger; and an independent, resiliently mounted clamp for engaging another portion of said lead finger before the bonding of said wire thereto, the independent, resiliently mounted clamp being movable.
Claim 14
Dependent Claim
88 words
Apparatus for bonding a wire to a bond pad located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad and said lead finger and bonding said wire to said bond pad or said lead finger; and an independent, resiliently mounted clamp for engaging another portion of said lead finger before the bonding of said wire thereto, the independent, resiliently mounted clamp being movable.
Claim 15
Dependent Claim
25 words
The apparatus of claim 10, wherein the independent clamp is resiliently mounted through the use of a spring engaging a portion of the independent clamp.
Claim 16
Dependent Claim
17 words
The apparatus of claim 1, wherein the independent clamp has an end portion thereof which is insulated.
Claim 17
Dependent Claim
19 words
The apparatus of claim 1, wherein the independent clamp has an end portion thereof which is semicircular in shape.
Claim 18
Dependent Claim
19 words
The apparatus of claim 1, wherein the independent clamp has an end portion thereof which is arcuate in shape.
Claim 19
Dependent Claim
19 words
The apparatus of claim 1, wherein the independent clamp has an end portion thereof which is articulated for movement.
Claim 20
Dependent Claim
33 words
The apparatus of claim 16, wherein the independent clamp is located between the bonding apparatus and the fixed clamp engaging a portion of the lead finger during the bonding of said wire thereto.
Claim 21
Dependent Claim
104 words
Apparatus for bonding a wire to a bond pad or the like located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad or the like and said lead finger and bonding said wire to said bond pad or the like or said lead finger; a fixed clamp for engaging a portion of said lead finger; and an independent clamp for engaging another portion of said lead finger before the bonding of said wire thereto, the independent clamp being movable.
Claim 22
Dependent Claim
104 words
Apparatus for bonding a wire to a bond pad or the like located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad or the like and said lead finger and bonding said wire to said bond pad or the like or said lead finger; a fixed clamp for engaging a portion of said lead finger; and an independent clamp for engaging another portion of said lead finger before the bonding of said wire thereto, the independent clamp being movable.
Claim 23
Dependent Claim
26 words
The apparatus of claim 18, wherein the independent clamp comprises: an independent clamp having the ability to move as desired in the x-axis, y-axis and z-axis.
Claim 24
Dependent Claim
19 words
The apparatus of claim 18, wherein the independent clamp is movable independent of the movement of the bonding apparatus.
Claim 25
Dependent Claim
22 words
The apparatus of claim 18, the bonding apparatus exerts a force of substantially 50 to 100 grams when contacting the lead finger.
Claim 26
Dependent Claim
17 words
The apparatus of claim 18, wherein said apparatus further comprises: heating apparatus located beneath said semiconductor chip.
Claim 27
Dependent Claim
17 words
The apparatus of claim 22, wherein said apparatus further comprises: heating apparatus located beneath said lead finger.
Claim 28
Dependent Claim
20 words
The apparatus of claim 22, wherein the heating apparatus operates at substantially 230 degrees Centigrade to heat said semiconductor chip.
Claim 29
Dependent Claim
17 words
The apparatus of claim 22, wherein said semiconductor chip is heated before a wire is bonded thereto.
Claim 30
Dependent Claim
12 words
The apparatus of claim 18, wherein the independent clamp is resiliently mounted.
Claim 31
Dependent Claim
25 words
The apparatus of claim 26, wherein the independent clamp is resiliently mounted through the use of a spring engaging a portion of the independent clamp.
Claim 32
Dependent Claim
101 words
Apparatus for bonding a wire to a bond pad or the like located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad or the like and said lead finger and bonding said wire to said bond pad or the like or said lead finger; a first independent clamp for engaging a portion of said lead finger; and a second independent clamp for engaging another portion of said lead finger before the bonding of said wire thereto.
Claim 33
Dependent Claim
101 words
Apparatus for bonding a wire to a bond pad or the like located on a semiconductor chip and a lead finger of a lead frame, said apparatus comprising: bonding apparatus having a portion thereof for the dispensing of said wire to be bonded to said bond pad or the like and said lead finger and bonding said wire to said bond pad or the like or said lead finger; a first independent clamp for engaging a portion of said lead finger; and a second independent clamp for engaging another portion of said lead finger before the bonding of said wire thereto.
Claim 34
Dependent Claim
35 words
The apparatus of claim 28, wherein the first independent clamp is located between the bonding apparatus and the second independent clamp engaging a portion of the lead finger during the bonding of said wire thereto.
Claim 35
Dependent Claim
27 words
The apparatus of claim 28, wherein the first independent clamp comprises: an independent clamp having the ability to move as desired in the x-axis, y-axis and z-axis.
Claim 36
Dependent Claim
20 words
The apparatus of claim 28, wherein the first independent clamp is moveable independent of the movement of the bonding apparatus.
Claim 37
Dependent Claim
22 words
The apparatus of claim 28, the bonding apparatus exerts a force of substantially 50 to 100 grams when contacting the lead finger.
Claim 38
Dependent Claim
17 words
The apparatus of claim 28, wherein said apparatus further comprises: heating apparatus located beneath said semiconductor chip.
Claim 39
Dependent Claim
17 words
The apparatus of claim 33, wherein said apparatus further comprises: heating apparatus located beneath said lead finger.
Claim 40
Dependent Claim
20 words
The apparatus of claim 33, wherein the heating apparatus operates at substantially 230 degrees Centigrade to heat said semiconductor chip.
Claim 41
Dependent Claim
17 words
The apparatus of claim 33, wherein said semiconductor chip is heated before a wire is bonded thereto.
Claim 42
Dependent Claim
13 words
The apparatus of claim 33, wherein the first independent clamp is resiliently mounted.
Claim 43
Dependent Claim
26 words
The apparatus of claim 25, wherein the first independent clamp is resiliently mounted through the use of a spring engaging a portion of the independent clamp.
Claim 44
Dependent Claim
36 words
The apparatus of claim 28, wherein the second independent clamp is located aft of the bonding apparatus and the first independent clamp engaging a portion of the lead finger during the bonding of said wire thereto.
Claim 45
Dependent Claim
27 words
The apparatus of claim 28, wherein the second independent clamp comprises: an independent clamp having the ability to move as desired in the x-axis, y-axis and z-axis.
Claim 46
Dependent Claim
20 words
The apparatus of claim 28, wherein the second independent clamp is movable independent of the movement of the bonding apparatus.
Claim 47
Dependent Claim
25 words
The apparatus of claim 28, wherein the first independent clamp is movable independent of the movement of the bonding apparatus and the second independent clamp.
Claim 48
Independent Claim
107 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning an independently movable and actuated clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto; providing a bonding apparatus to bond said wire to said lead frame; actuating the bonding apparatus to bond said wire to said lead finger; and removing the independent clamp from engagement with a portion of said lead finger before the removal of the bonding apparatus from the lead finger.
Claim 49
Independent Claim
107 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning an independently movable and actuated clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto; providing a bonding apparatus to bond said wire to said lead frame; actuating the bonding apparatus to bond said wire to said lead finger; and removing the independent clamp from engagement with a portion of said lead finger before the removal of the bonding apparatus from the lead finger.
Claim 50
Dependent Claim
22 words
The method of claim 43, wherein the independent clamp is movable in the x-axis direction, the y-axis direction, and the z-axis direction.
Claim 51
Independent Claim
81 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning a first clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto; and positioning an independent clamp over another portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto.
Claim 52
Independent Claim
81 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning a first clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto; and positioning an independent clamp over another portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto.
Claim 53
Dependent Claim
22 words
The method of claim 45, further comprising the step of: providing a bonding apparatus to bond said wire to said lead finger.
Claim 54
Dependent Claim
22 words
The method of claim 45, further comprising the step of: actuating the bonding apparatus to bond said wire to said lead finger.
Claim 55
Dependent Claim
34 words
The method of claim 45, further comprising the step of: removing the independent clamp from engagement with a portion of said lead finger before the removal of the bonding apparatus from the lead finger.
Claim 56
Dependent Claim
12 words
The method of claim 45, wherein the independent clamp is resiliently mounted.
Claim 57
Dependent Claim
22 words
The method of claim 45, wherein the independent clamp is movable in the x-axis direction, the y-axis direction, and the z-axis direction.
Claim 58
Independent Claim
83 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning a first independent clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto; and positioning a second independent clamp over another portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto.
Claim 59
Independent Claim
83 words
A method of bonding a wire to a bond pad of a semiconductor chip or the like and lead finger of a lead frame, said method comprising the steps of: positioning a first independent clamp over a portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto; and positioning a second independent clamp over another portion of said lead finger to retain said lead finger in position during the bonding of said wire thereto.
Claim 60
Independent Claim
22 words
The method of clam 51, further comprising the step of: providing a bonding apparatus to bond said wire to said lead finger.
Claim 61
Independent Claim
22 words
The method of clam 51, further comprising the step of: providing a bonding apparatus to bond said wire to said lead finger.
Claim 62
Dependent Claim
22 words
The method of claim 51, further comprising the step of: actuating the bonding apparatus to bond said wire to said lead finger.
Claim 63
Dependent Claim
35 words
The method of claim 51, further comprising the step of: removing the second independent clamp from engagement with another portion of said lead finger before the removal of the bonding apparatus from the lead finger.
Claim 64
Dependent Claim
24 words
The method of claim 51, wherein the second independent clamp is positioned between the first independent clamp and the end of said lead finger.
Claim 65
Dependent Claim
27 words
The method of claim 51, wherein the first independent clamp and the second independent clamp are independently movable with respect to each other and said semiconductor chip.
Claim 66
Dependent Claim
29 words
The method of claim 51, wherein the first independent clamp and the second independent clamp are each movable in the x-axis direction, the y-axis direction, and the z-axis direction.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-14 | 2001-01-13 | 2001-07-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-14 | 2005-01-13 | 2005-07-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-14 | 2009-01-13 | 2009-07-15 | $7700.00 | Window Closed / Lapsed |