US3685137A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing wire bonded integrated circuit devices
Assignee: RCA Corp
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Filing: 1971-05-13
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Granted: 1972-08-22
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Expires: 1991-05-13
Abstract
Abstract A lead frame for a semiconductor device has a semiconductor chip supporting pad and a plurality of lead fingers with terminal bonding portions near the chip supporting pad. The bonding portions of the lead fingers and the chip supporting surface of the pad are non-coplanar. In using this lead frame in fabricating a device, the non-coplanar elements are forced into and held in coplanar relationship, the connector wires are bonded between the lead fingers and the chip, and the frame is then released to permit it to return to its non-coplanar configuration. The connector wires are thus lifted to a greater angle with respect to the semiconductor chip surface and short circuits at the edge of the chip tend to be eliminated.
Inventors
- 👤 Arthur Noel Gardiner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 16:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W72/00; H10W72/071; H10W72/0711; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5449; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
147 words
A method of assembling a semiconductor device which includes a lead assembly of the type formed from a single continuous sheet of resilient material comprising an outer frame, a semiconductor chip supporting pad, and a plurality of lead fingers each having a terminal portion near said chip supporting pad, said lead assembly in its unstressed condition having said chip supporting pad and said terminal portions of said lead fingers in noncoplanar relationship, comprising the steps of, bonding a semiconductor chip to said chip supporting pad, forcing said chip supporting pad and said terminal portions of said lead fingers into coplanar relationship, while maintaining said coplanar relationship, bonding a plurality of connector wires between said semiconductor chip and said terminal portions of said lead fingers, and releasing said lead assembly to establish the non-coplanar relationship of said chip supporting pad and said terminal portions of said lead fingers.
Claim 2
Independent Claim
147 words
A method of assembling a semiconductor device which includes a lead assembly of the type formed from a single continuous sheet of resilient material comprising an outer frame, a semiconductor chip supporting pad, and a plurality of lead fingers each having a terminal portion near said chip supporting pad, said lead assembly in its unstressed condition having said chip supporting pad and said terminal portions of said lead fingers in noncoplanar relationship, comprising the steps of, bonding a semiconductor chip to said chip supporting pad, forcing said chip supporting pad and said terminal portions of said lead fingers into coplanar relationship, while maintaining said coplanar relationship, bonding a plurality of connector wires between said semiconductor chip and said terminal portions of said lead fingers, and releasing said lead assembly to establish the non-coplanar relationship of said chip supporting pad and said terminal portions of said lead fingers.
Claim 3
Dependent Claim
29 words
A method as defined in claim 1 in which each connector wire is bonded first to a terminal portion of a lead finger and then to said semiconductor chip.
Claim 4
Dependent Claim
15 words
A method as defined in claim 2 in which said connector wires are bonded ultrasonically.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-08-22 | 1976-02-21 | 1976-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-08-22 | 1980-02-21 | 1980-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-08-22 | 1984-02-21 | 1984-08-22 | $7700.00 | Window Closed / Lapsed |