US5465899A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for fine pitch wire bonding using a shaved capillary
Assignee: Texas Instruments Inc
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Filing: 1994-10-14
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Granted: 1995-11-14
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Expires: 2014-10-14
Abstract
Abstract An wire bonding apparatus for forming ball and stitch bonds includes a bond head (42) having a shaved capillary (20), a carrier (43) for holding the bond head (42), a bearing (44) on which the carrier (43) is mounted, and a bearing table (46) on which the bearing (44) is mounted. The bearing table (46) and bearing (44) provide rotary movement about a z axis for the capillary (20). An x-y table (48) on which the carrier bearing table (46) is mounted provides movement in x and y directions for the capillary (20). A fixed work holder (50) supports a semiconductor die (11) and a leadframe (52) adjacent the capillary (20). The relative rotation provided between shaved capillary (20) and work holder (50) provides proper orientation of the capillary (20) with respect to leadframe (52) to form high quality stitch bonds on leadframe (52) while permitting fine pitch ball bonds to be formed on the semiconductor die (11).
Inventors
- 👤 Roderick L. Quick
- 👤 John W. Orcutt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/465; H10W72/00; H10W72/071; H10W72/0711; H10W72/075; H10W72/01; H10W72/015; H10W72/01551; H10W72/07141; H10W72/07173; H10W72/07511; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07554; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
169 words
A method for wire bonding using a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension, comprising the steps of: forming a ball bond with a first end of a wire on a first surface at a first location with said capillary; moving said capillary to a second surface at a second location so that said wire extends from said first location to said second location; performing relative rotation of said capillary with respect to said second surface so that said wire extends from beneath one of said third and fourth side walls; forming a stitch bond on said second surface at said second location.
Claim 2
Independent Claim
169 words
A method for wire bonding using a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension, comprising the steps of: forming a ball bond with a first end of a wire on a first surface at a first location with said capillary; moving said capillary to a second surface at a second location so that said wire extends from said first location to said second location; performing relative rotation of said capillary with respect to said second surface so that said wire extends from beneath one of said third and fourth side walls; forming a stitch bond on said second surface at said second location.
Claim 3
Dependent Claim
23 words
The method of claim 1 in which said step of performing relative rotation includes rotating said capillary while said second surface remains fixed.
Claim 4
Dependent Claim
23 words
The method of claim 1 in which said step of performing relative rotation includes rotating said second surface while said capillary remains fixed.
Claim 5
Dependent Claim
31 words
The method of claim 1 in which said first surface is a surface of a bond pad on a semiconductor die and said second surface is a surface of a lead.
Claim 6
Dependent Claim
16 words
The method of claim 1 in which said first and second opposed side walls are planar.
Claim 7
Dependent Claim
16 words
The method of claim 5 in which said first and second opposed side walls are parallel.
Claim 8
Dependent Claim
120 words
A wire bonding apparatus for forming ball bonds and stitch bonds, comprising: a bond head including a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension; a work holder for supporting a semiconductor die and a leadframe adjacent said capillary; means for providing relative rotation about a z axis between said capillary and said work holder.
Claim 9
Dependent Claim
120 words
A wire bonding apparatus for forming ball bonds and stitch bonds, comprising: a bond head including a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension; a work holder for supporting a semiconductor die and a leadframe adjacent said capillary; means for providing relative rotation about a z axis between said capillary and said work holder.
Claim 10
Dependent Claim
16 words
The apparatus of claim 7 in which said first and second opposed side walls are planar.
Claim 11
Dependent Claim
16 words
The apparatus of claim 8 in which said first and second opposed side walls are parallel.
Claim 12
Dependent Claim
17 words
The apparatus of claim 7 further comprising: means for moving said capillary in x and y directions.
Claim 13
Dependent Claim
35 words
The apparatus of claim 10 in which said means for moving said capillary in x and y directions includes: a carrier for holding said bond head; an x-y table on which said carrier is mounted.
Claim 14
Dependent Claim
64 words
The apparatus of claim 7 in which said means for providing relative rotation about a z axis between said capillary and said work holder includes: a carrier for holding said bond head; a bearing on which said carrier is mounted; a bearing table on which said bearing is mounted, said bearing table and bearing providing rotary movement about a z axis for said carrier.
Claim 15
Dependent Claim
45 words
The apparatus of claim 7 in which said means for providing relative rotation about a z axis between said capillary and said work holder includes: a bearing mounted in a support, said bearing supporting and permitting rotation about a z axis of said work holder.
Claim 16
Dependent Claim
168 words
A wire bonding apparatus for forming ball bonds and stitch bonds, comprising: a bond head including a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension; a carrier for holding said bond head; a bearing on which said carrier is mounted; a bearing table on which said bearing is mounted, said bearing table and bearing providing rotary movement about a z axis for said capillary; an x-y table on which said carrier bearing table is mounted, said x-y table providing movement in x and y directions for said capillary; a fixed work holder for supporting a semiconductor die and a leadframe adjacent said capillary.
Claim 17
Dependent Claim
168 words
A wire bonding apparatus for forming ball bonds and stitch bonds, comprising: a bond head including a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension; a carrier for holding said bond head; a bearing on which said carrier is mounted; a bearing table on which said bearing is mounted, said bearing table and bearing providing rotary movement about a z axis for said capillary; an x-y table on which said carrier bearing table is mounted, said x-y table providing movement in x and y directions for said capillary; a fixed work holder for supporting a semiconductor die and a leadframe adjacent said capillary.
Claim 18
Dependent Claim
16 words
The apparatus of claim 14 in which said first and second opposed side walls are planar.
Claim 19
Dependent Claim
16 words
The apparatus of claim 15 in which said first and second opposed side walls are parallel.
Claim 20
Dependent Claim
164 words
A wire bonding apparatus for forming ball bonds and stitch bonds, comprising: a bond head including a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension; a carrier for holding said bond head; an x-y table on which said carrier is mounted, said x-y table providing movement in x and y directions for said capillary; a work holder for holding a semiconductor die and a leadframe adjacent said capillary; a bearing mounted in a support, said bearing supporting and permitting rotation about a z axis of said work holder to rotate said semiconductor die and leadframe relative to said capillary.
Claim 21
Dependent Claim
164 words
A wire bonding apparatus for forming ball bonds and stitch bonds, comprising: a bond head including a capillary having a bore and first and second opposed side walls and third and fourth opposed side walls, said third and fourth side walls being curved and spaced apart by a longitudinal dimension along a first axis through said bore, said first and second side walls spaced apart by a lateral dimension along a second axis through said bore perpendicular to said first axis, said lateral dimension being less than said longitudinal dimension; a carrier for holding said bond head; an x-y table on which said carrier is mounted, said x-y table providing movement in x and y directions for said capillary; a work holder for holding a semiconductor die and a leadframe adjacent said capillary; a bearing mounted in a support, said bearing supporting and permitting rotation about a z axis of said work holder to rotate said semiconductor die and leadframe relative to said capillary.
Claim 22
Dependent Claim
16 words
The apparatus of claim 17 in which said first and second opposed side walls are planar.
Claim 23
Dependent Claim
16 words
The apparatus of claim 18 in which said first and second opposed side walls are parallel.
References Cited (Backward Citations)
JPH0587842A
Cited
US5269452A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-11-13 | 1999-05-15 | 1999-11-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-11-13 | 2003-05-15 | 2003-11-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-11-13 | 2007-05-15 | 2007-11-14 | $7700.00 | Window Closed / Lapsed |