Microelectronic module having optical and electrical interconnects

Claim 2

A microelectronic module comprising: an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip; a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein at least one of said optical transmitting means and said optical detecting means is formed in one of said integrated circuit chips.

Claim 3

The microelectronic module of claim 1 wherein at least one of said optical transmitting means and said optical detecting means is on said substrate.

Claim 4

The microelectronic module of claim 1 wherein said hologram directs said first optical beam to produce said second optical beam therefrom.

Claim 5

The microelectronic module of claim 1 further comprising a heat sink positioned on said array of integrated circuit chips on a surface thereof opposite said predetermined surface.

Claim 6

A microelectronic module comprising: an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip; a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said first optical beam emerges from said microelectronic module in a position which is determined by the hologram and solder bumps and wherein said second optical beam originates from external to said microelectronic module and is aligned to the microelectronic module by the hologram and solder bumps.

Claim 7

A microelectronic module comprising: an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip; a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said first optical beam emerges from said microelectronic module in a position which is determined by the hologram and solder bumps and wherein said second optical beam originates from external to said microelectronic module and is aligned to the microelectronic module by the hologram and solder bumps.

Claim 8

A microelectronic module comprising: an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip; a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said optical transmitting means comprises an edge-emitting laser.

Claim 9

A microelectronic module comprising: an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip; a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said optical transmitting means comprises an edge-emitting laser.

Claim 10

The microelectronic module according to claim 6 further comprising a mirror positioned opposite said edge-emitting laser for directing the first optical beam from said edge-emitting laser through said substrate.

Claim 11

A microelectronic module comprising: a substrate; an array of integrated circuit chips each having a predetermined surface positioned on said substrate, each of said integrated circuit chips including an array of electrical contact pads on the predetermined surface thereof; optical transmitting means for generating a first optical beam through said substrate, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam through said substrate, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on respective integrated circuit chips; a pattern of electrical interconnection lines on said substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on the substrate and the electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said first optical beam emerges from said microelectronic module in a position which is determined by the hologram and solder bumps and wherein said second optical beam originates from external to said microelectronic module and is aligned to the microelectronic module by the hologram and solder bumps.

Claim 12

A microelectronic module comprising: a substrate; an array of integrated circuit chips each having a predetermined surface positioned on said substrate, each of said integrated circuit chips including an array of electrical contact pads on the predetermined surface thereof; optical transmitting means for generating a first optical beam through said substrate, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam through said substrate, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on respective integrated circuit chips; a pattern of electrical interconnection lines on said substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on the substrate and the electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said first optical beam emerges from said microelectronic module in a position which is determined by the hologram and solder bumps and wherein said second optical beam originates from external to said microelectronic module and is aligned to the microelectronic module by the hologram and solder bumps.

Claim 13

The microelectronic module according to claim 8 further comprising a heat sink positioned on said array of integrated circuit chips on a surface thereof opposite said predetermined surface.

Claim 14

The microelectronic module of claim 8 wherein at least one of said optical transmitting means and said optical detecting means is on said substrate.

Claim 15

The microelectronic module of claim 8 wherein at least one of said optical transmitting means and said optical detecting means is formed in one of said integrated circuit chips.

Claim 16

A microelectronic module comprising: a substrate; an array of integrated circuit chips each having a predetermined surface positioned on said substrate, each of said integrated circuit chips including an array of electrical contact pads on the predetermined surface thereof; optical transmitting means for generating a first optical beam through said substrate, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam through said substrate, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on respective integrated circuit chips; a pattern of electrical interconnection lines on said substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on the substrate and the electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said optical transmitting means comprises an edge-emitting laser.

Claim 17

A microelectronic module comprising: a substrate; an array of integrated circuit chips each having a predetermined surface positioned on said substrate, each of said integrated circuit chips including an array of electrical contact pads on the predetermined surface thereof; optical transmitting means for generating a first optical beam through said substrate, said optical transmitting means being electrically connected to at least one of said integrated circuit chips; optical detecting means for receiving a second optical beam through said substrate, said optical detecting means being electrically connected to at least one of said integrated circuit chips; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on respective integrated circuit chips; a pattern of electrical interconnection lines on said substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on the substrate and the electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means; wherein said optical transmitting means comprises an edge-emitting laser.

Claim 18

The microelectronic module according to claim 12 further comprising a mirror positioned opposite said edge-emitting laser for directing the optical beam from said edge-emitting laser through said substrate.

Claim 19

A microelectronic module comprising: a first substrate; an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips; a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip; a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means; wherein at least one of said optical transmitting means and said optical detecting means is formed in at least one of said first and second integrated circuit chips.

Claim 20

A microelectronic module comprising: a first substrate; an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips; a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip; a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means; wherein at least one of said optical transmitting means and said optical detecting means is formed in at least one of said first and second integrated circuit chips.

Claim 21

The microelectronic module of claim 14 wherein at least one of said optical transmitting means and said optical detecting means is on at least one of said second and said third substrates.

Claim 22

The microelectronic module of claim 14 wherein said hologram directs said first optical beam to produce said second optical beam therefrom.

Claim 23

The microelectronic module of claim 14 wherein said first optical beam emerges from said microelectronic module and wherein said second optical beam originates from external to said microelectronic module.

Claim 24

A microelectronic module comprising: a first substrate; an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips; a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip; a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means; wherein said hologram is integrated into at least one of said second and third substrates.

Claim 25

A microelectronic module comprising: a first substrate; an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips; a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip; a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means; wherein said hologram is integrated into at least one of said second and third substrates.

Claim 26

A microelectronic module comprising: a first substrate; an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips; a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip; a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means; wherein said optical transmitting means comprises an edge-emitting laser.

Claim 27

A microelectronic module comprising: a first substrate; an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface; optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips; optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips; a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means; a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams; an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip; a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means; wherein said optical transmitting means comprises an edge-emitting laser.

Claim 28

The microelectronic module according to claim 19 further comprising a mirror positioned opposite said edge-emitting laser for directing the optical beam from said edge-emitting laser through said second substrate.

Claim 29

An interconnect chip for facilitating interconnections with at least one optoelectronic transducer, said optoelectronic transducer being one of the group consisting of optical emitting means for generating a first optical beam and optical detecting means for receiving a second optical beam, said at least one optoelectronic transducer having a first surface adjacent a mounting substrate and including an array of electrical contact pads on a second surface thereof, the mounting substrate having an array of electrical contact pads thereon adjacent the periphery of the at least one optoelectronic transducer, said interconnect chip comprising: a substrate for permitting at least one of said beams to pass therethrough to establish an optical interconnection with said at least one optoelectronic transducer, said substrate adapted to overlie said at least one optoelectronic transducer and a portion of the mounting substrate; an array of electrical contact pads on said substrate adapted for electrically contacting respective underlying electrical contact pads of said at least one optoelectronic transducer and electrical contact pads of the mounting substrate to establish electrical interconnections with said at least one optoelectronic transducer; and a solder bump on each electrical contact pad of said array of electrical contact pads to establish an electrical connection with the corresponding electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to the at least one optoelectronic transducer such that at least one of said optical beams is optically aligned with said optoelectronic transducer.

Claim 30

An interconnect chip for facilitating interconnections with at least one optoelectronic transducer, said optoelectronic transducer being one of the group consisting of optical emitting means for generating a first optical beam and optical detecting means for receiving a second optical beam, said at least one optoelectronic transducer having a first surface adjacent a mounting substrate and including an array of electrical contact pads on a second surface thereof, the mounting substrate having an array of electrical contact pads thereon adjacent the periphery of the at least one optoelectronic transducer, said interconnect chip comprising: a substrate for permitting at least one of said beams to pass therethrough to establish an optical interconnection with said at least one optoelectronic transducer, said substrate adapted to overlie said at least one optoelectronic transducer and a portion of the mounting substrate; an array of electrical contact pads on said substrate adapted for electrically contacting respective underlying electrical contact pads of said at least one optoelectronic transducer and electrical contact pads of the mounting substrate to establish electrical interconnections with said at least one optoelectronic transducer; and a solder bump on each electrical contact pad of said array of electrical contact pads to establish an electrical connection with the corresponding electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to the at least one optoelectronic transducer such that at least one of said optical beams is optically aligned with said optoelectronic transducer.

Claim 31

The interconnect chip of claim 21 further comprising at least one hologram on said substrate, opposite said at least one of optical emitting means and optical detecting means.

Claim 32

The interconnect chip of claim 22 wherein said hologram directs said first optical beam to produce said second optical beam therefrom.

Claim 33

The interconnect chip of claim 22 wherein said first optical beam emerges from said interconnect chip and wherein said second beam originates from external to said interconnect chip.

Claim 34

The interconnect chip of claim 21 wherein said optical transmitting means comprises an edge-emitting laser.

Claim 35

The interconnect chip of claim 25 further comprising a mirror positioned opposite said edge-emitting laser for directing the first optical beam from said edge-emitting laser through said substrate.

Claim 36

The interconnection chip of claim 24, in combination with a second substrate for directing said first optical beam from said interconnect chip and for directing said second beam to said interconnect chip.

Claim 37

An interconnect chip for facilitating connections with at least one optoelectronic transducer having an array of electrical contact pads on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical beam and optical transmitting means for generating an optical beam, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough; an array of electrical contact pads on said substrate adapted for electrically contacting respective electrical contact pads of the underlying at least one optoelectronic transducer; and a solder bump on each electrical contact pad of said array of electrical contact pads to establish an electrical connection with the corresponding electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to said at least one optoelectronic transducer such that the optical beams which pass through said substrate are optically aligned with said optoelectronic transducer.

Claim 38

An interconnect chip for facilitating connections with at least one optoelectronic transducer having an array of electrical contact pads on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical beam and optical transmitting means for generating an optical beam, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough; an array of electrical contact pads on said substrate adapted for electrically contacting respective electrical contact pads of the underlying at least one optoelectronic transducer; and a solder bump on each electrical contact pad of said array of electrical contact pads to establish an electrical connection with the corresponding electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to said at least one optoelectronic transducer such that the optical beams which pass through said substrate are optically aligned with said optoelectronic transducer.

Claim 39

The interconnect chip of claim 28 further comprising at least one hologram on said substrate, opposite said at least one of optical emitting means and optical detecting means.

Claim 40

The interconnect chip of claim 29 wherein said hologram directs said optical beams.

Claim 41

The interconnect chip of claim 28 wherein said optical transmitting means comprises an edge-emitting laser.

Claim 42

The interconnect chip of claim 31 further comprising a mirror positioned opposite said edge-emitting laser for directing the first optical beam from said edge-emitting laser through said substrate.

Claim 43

The interconnect chip of claim 30 in combination with a second substrate for directing said at least a first optical beam from said interconnect chip and for directing said at least a second beam to said interconnect chip.

Claim 44

An interconnect chip for facilitating connections with at least one optoelectronic transducer having an array of electrical contact pads on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical beam and optical transmitting means for generating an optical beam, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough; an array of electrical contact pads on said substrate adapted for electrically contacting respective electrical contact pads of the underlying at least one optoelectronic transducer; and a solder bump on each electrical contact pad of said array of electrical contact pads to establish an electrical connection with the corresponding electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to said at least one optoelectronic transducer such that the optical beams which pass through said substrate are optically aligned with said optoelectronic transducer; wherein at least a first of said optical beams emerges from said interconnect chip in a position which is determined by the solder bumps and wherein at least a second of said optical beams originates from external to said interconnect chip and is aligned to the interconnect chip by the solder bumps.

Claim 45

An interconnect chip for facilitating connections with at least one optoelectronic transducer having an array of electrical contact pads on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical beam and optical transmitting means for generating an optical beam, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough; an array of electrical contact pads on said substrate adapted for electrically contacting respective electrical contact pads of the underlying at least one optoelectronic transducer; and a solder bump on each electrical contact pad of said array of electrical contact pads to establish an electrical connection with the corresponding electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to said at least one optoelectronic transducer such that the optical beams which pass through said substrate are optically aligned with said optoelectronic transducer; wherein at least a first of said optical beams emerges from said interconnect chip in a position which is determined by the solder bumps and wherein at least a second of said optical beams originates from external to said interconnect chip and is aligned to the interconnect chip by the solder bumps.

Claim 46

An interconnect chip for facilitating optical interconnections to at least one optoelectronic transducer having a first array of contact pads on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical beam and optical transmitting means for generating an optical beam, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough to establish an optical interconnection with the at least one optoelectronic transducer; a second array of contact pads on said substrate at locations which overlie said first array of contact pads; a hologram on said substrate for directing an optical beam to establish an optical interconnection to the at least one optoelectronic transducer; and a solder bump between a respective contact pad of said first array and said second array, to optically align said interconnect chip with respect to the at least one optoelectronic transducer such that the optical beams of said optoelectronic transducer which pass through said substrate are optically aligned with said optoelectronic transducer.

Claim 47

An interconnect chip for facilitating optical interconnections to at least one optoelectronic transducer having a first array of contact pads on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical beam and optical transmitting means for generating an optical beam, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough to establish an optical interconnection with the at least one optoelectronic transducer; a second array of contact pads on said substrate at locations which overlie said first array of contact pads; a hologram on said substrate for directing an optical beam to establish an optical interconnection to the at least one optoelectronic transducer; and a solder bump between a respective contact pad of said first array and said second array, to optically align said interconnect chip with respect to the at least one optoelectronic transducer such that the optical beams of said optoelectronic transducer which pass through said substrate are optically aligned with said optoelectronic transducer.

Claim 48

The interconnect chip of claim 35 wherein said hologram is on said substrate, opposite said at least one of optical emitting means and optical detecting means.

Claim 49

The interconnect chip of claim 35 wherein said optical transmitting means comprises an edge-emitting laser.

Claim 50

The interconnect chip of claim 37 further comprising a mirror positioned opposite said edge-emitting laser for directing the optical beams from said edge-emitting laser through said substrate.

Claim 51

The interconnect chip of claim 34 in combination with a second substrate for directing said at least a first optical beam from said interconnect chip and for directing said at least a second beam to said interconnect chip.

Claim 52

An interconnect chip for facilitating optical interconnections to at least one optoelectronic transducer having a first array of contact pads on a surface thereof, said optoelectronic transducer being of the group consisting of optical detecting means for receiving an optical signal and optical transmitting means for generating an optical signal, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough to establish an optical interconnection with the at least one optoelectronic transducer; a second array of contact pads on said substrate at locations which overlie said first array of contact pads; a hologram on said substrate for directing an optical beam to establish an optical interconnection to the at least one optoelectronic transducer; and a solder bump between a respective contact pad of said first array and said second array, to optically align said interconnect chip with respect to the at least one optoelectronic transducer such that the optical beams of said optoelectronic transducer which pass through said substrate are optically aligned with said optoelectronic transducer; wherein at least a first of said optical beams emerges from said interconnect chip in a position which is determined by the hologram and solder bumps and wherein at least a second of said beams originates from external to said interconnect chip and is aligned to the interconnect chip by the hologram and solder bumps.

Claim 53

An interconnect chip for facilitating optical interconnections to at least one optoelectronic transducer having a first array of contact pads on a surface thereof, said optoelectronic transducer being of the group consisting of optical detecting means for receiving an optical signal and optical transmitting means for generating an optical signal, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer, said substrate permitting optical beams to pass therethrough to establish an optical interconnection with the at least one optoelectronic transducer; a second array of contact pads on said substrate at locations which overlie said first array of contact pads; a hologram on said substrate for directing an optical beam to establish an optical interconnection to the at least one optoelectronic transducer; and a solder bump between a respective contact pad of said first array and said second array, to optically align said interconnect chip with respect to the at least one optoelectronic transducer such that the optical beams of said optoelectronic transducer which pass through said substrate are optically aligned with said optoelectronic transducer; wherein at least a first of said optical beams emerges from said interconnect chip in a position which is determined by the hologram and solder bumps and wherein at least a second of said beams originates from external to said interconnect chip and is aligned to the interconnect chip by the hologram and solder bumps.

Claim 54

A microelectronic module comprising: a substrate having a pair of opposing faces; edge emitting optical transmitting means on said substrate, for generating an optical beam in a path which is parallel to said pair of opposing faces; a mirror on said substrate and positioned in said path, for redirecting said optical beam, wherein said mirror is positioned to redirect said optical beam through said substrate; a first array of pads on said edge emitting optical transmitting means; a second array of pads on said mirror; a third array of pads on said substrate corresponding to the first and second arrays of pads; and a solder bump between each pad in said third array and the corresponding pad in the first and second arrays, to facilitate alignment of said edge emitting optical transmitting means and said mirror to said substrate.

Claim 55

A microelectronic module comprising: a substrate having a pair of opposing faces; edge emitting optical transmitting means on said substrate, for generating an optical beam in a path which is parallel to said pair of opposing faces; a mirror on said substrate and positioned in said path, for redirecting said optical beam, wherein said mirror is positioned to redirect said optical beam through said substrate; a first array of pads on said edge emitting optical transmitting means; a second array of pads on said mirror; a third array of pads on said substrate corresponding to the first and second arrays of pads; and a solder bump between each pad in said third array and the corresponding pad in the first and second arrays, to facilitate alignment of said edge emitting optical transmitting means and said mirror to said substrate.

Claim 56

The microelectronic module of claim 41 wherein said mirror is a crystallographic plane of a silicon chip.

Claim 57

A microelectronic module comprising: a substrate having a pair of opposing faces; edge emitting optical transmitting means on said substrate, for generating an optical beam in a path which is parallel to said pair of opposing faces; a mirror on said substrate and positioned in said path, for redirecting said optical beam; at least a first pad on said mirror; at least a second pad on said substrate corresponding to the at least a first pad; and a solder bump between the at least a first pad and the at least a second pad to facilitate alignment of said mirror to said substrate.

Claim 58

A microelectronic module comprising: a substrate having a pair of opposing faces; edge emitting optical transmitting means on said substrate, for generating an optical beam in a path which is parallel to said pair of opposing faces; a mirror on said substrate and positioned in said path, for redirecting said optical beam; at least a first pad on said mirror; at least a second pad on said substrate corresponding to the at least a first pad; and a solder bump between the at least a first pad and the at least a second pad to facilitate alignment of said mirror to said substrate.

Claim 59

The microelectronic module of claim 43 wherein said mirror is a crystallographic plane of a silicon chip.

Claim 60

A microelectronic module comprising: a substrate having a pair of opposing faces; edge emitting optical transmitting means on said substrate, for generating an optical beam in a path which is parallel to said pair of opposing faces; a mirror on said substrate and positioned in said path, for redirecting said optical beam, wherein said mirror is a crystallographic plane of a silicon chip; at least a first pad on said edge emitting optical transmitting means; at least a second pad on said mirror; a plurality of pads on said substrate corresponding to the at least a first pad and the at least a second pad; and a solder bump between each of said plurality of pads and the corresponding at least a first pad and at least a second pad, to facilitate alignment of said edge emitting optical transmitting means and said mirror to said substrate.

Claim 61

A microelectronic module comprising: a substrate having a pair of opposing faces; edge emitting optical transmitting means on said substrate, for generating an optical beam in a path which is parallel to said pair of opposing faces; a mirror on said substrate and positioned in said path, for redirecting said optical beam, wherein said mirror is a crystallographic plane of a silicon chip; at least a first pad on said edge emitting optical transmitting means; at least a second pad on said mirror; a plurality of pads on said substrate corresponding to the at least a first pad and the at least a second pad; and a solder bump between each of said plurality of pads and the corresponding at least a first pad and at least a second pad, to facilitate alignment of said edge emitting optical transmitting means and said mirror to said substrate.

Claim 62

An interconnect chip for facilitating connections with at least one optoelectronic transducer having at least one electrical contact pad on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical signal and optical transmitting means for generating an optical signal, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer; at least one electrical contact pad on said substrate adapted for electrically contacting a respective at least one electrical contact pad of the underlying at least one optoelectronic transducer; and a solder bump on each of said at least one electrical contact pad on said substrate to establish an electrical connection with the corresponding at least one electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to said at least one optoelectronic transducer such that optical beams of said optoelectronic transducer which pass through said substrate are optically aligned with said optoelectronic transducer.

Claim 63

An interconnect chip for facilitating connections with at least one optoelectronic transducer having at least one electrical contact pad on a surface thereof, said optoelectronic transducer being one of the group consisting of optical detecting means for receiving an optical signal and optical transmitting means for generating an optical signal, said interconnect chip comprising: a substrate adapted to be positioned overlying the at least one optoelectronic transducer; at least one electrical contact pad on said substrate adapted for electrically contacting a respective at least one electrical contact pad of the underlying at least one optoelectronic transducer; and a solder bump on each of said at least one electrical contact pad on said substrate to establish an electrical connection with the corresponding at least one electrical contact pad of the underlying at least one optoelectronic transducer and to optically align said interconnect chip with respect to said at least one optoelectronic transducer such that optical beams of said optoelectronic transducer which pass through said substrate are optically aligned with said optoelectronic transducer.

Claim 64

The interconnect chip of claim 46 further comprising at least one hologram opposite said at least one of optical emitting means and optical detecting means.

Claim 65

The interconnect chip of claim 47 wherein at least a first optical beam emerges from said interconnect chip into free space and wherein at least a second optical beam originates from free space external to said interconnect chip.

Claim 66

The interconnect chip of claim 48 wherein said optical transmitting means comprises an edge-emitting laser.

Claim 67

The interconnect chip of claim 49 further comprising a mirror positioned opposite said edge-emitting laser for directing the at least a first optical beam from said edge-emitting laser.