US5198684A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor integrated circuit device with optical transmit-receive means
Assignee: Toshiba Corp
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Filing: 1991-08-14
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Granted: 1993-03-30
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Expires: 2011-08-14
Abstract
Abstract A semiconductor integrated circuit device comprising a plurality of semiconductor packaging substrates arranged parallel to one another, a plurality of semiconductor integrated circuits mounted on each of the semiconductor packaging substrates, a circuit for electrically connecting the semiconductor integrated circuits, an optical signal transmitting circuit, electrically connected to the semiconductor integrated circuits, for converting an electric signal input by the semiconductor integrated circuits to an optical signal and outputting it to another semiconductor packaging substrate, and an optical signal receiving circuit, electrically connected to the semiconductor integrated circuits, for receiving the optical signal output from the semiconductor packaging substrate, converting the optical signal to an electric signal, and outputting the electric signal to the semiconductor integrated circuits.
Inventors
- 👤 Toshio Sudo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 17:48
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/43; H; H04; H04B; H04B10/00; H04B10/80; H04B10/801; H04B10/803; H10; H10F; H10F55/00; H10F55/18; H10W; H10W90/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
189 words
A semiconductor integrated circuit device comprising: a plurality of semiconductor packaging substrates arranged parallel to one another; at least one opening selectively formed on each of said semiconductor packaging substrates; a plurality of semiconductor integrated circuits mounted on a portion of each of said semiconductor packaging substrates which excludes said opening; light transmit-receive means having at least one light emitting element and at least one light receiving element which are formed integral with each other on each opening, for performing optical signal transmission between said semiconductor packaging substrates, said light transmit-receive means converting electric signals output from a semiconductor integrated circuit on one semiconductor packaging substrate to an optical signal and outputting the optical signal to another semiconductor packaging substrate, and converting an optical signal received from another semiconductor packaging substrate to electric signals and outputting the electric signal to said semiconductor integrated circuit; and wires for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other and connecting said semiconductor integrated circuits on each thereof to said light transmit-receive means, wherein said semiconductor integrated circuits perform predetermined batch-process of electric signals, respectively.
Claim 2
Dependent Claim
189 words
A semiconductor integrated circuit device comprising: a plurality of semiconductor packaging substrates arranged parallel to one another; at least one opening selectively formed on each of said semiconductor packaging substrates; a plurality of semiconductor integrated circuits mounted on a portion of each of said semiconductor packaging substrates which excludes said opening; light transmit-receive means having at least one light emitting element and at least one light receiving element which are formed integral with each other on each opening, for performing optical signal transmission between said semiconductor packaging substrates, said light transmit-receive means converting electric signals output from a semiconductor integrated circuit on one semiconductor packaging substrate to an optical signal and outputting the optical signal to another semiconductor packaging substrate, and converting an optical signal received from another semiconductor packaging substrate to electric signals and outputting the electric signal to said semiconductor integrated circuit; and wires for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other and connecting said semiconductor integrated circuits on each thereof to said light transmit-receive means, wherein said semiconductor integrated circuits perform predetermined batch-process of electric signals, respectively.
Claim 3
Dependent Claim
18 words
A semiconductor integrated circuit device according to claim 1, wherein said semiconductor packaging substrate is made of silicon.
Claim 4
Dependent Claim
19 words
A semiconductor integrated circuit device according to claim 1, wherein said semiconductor packaging substrate is made of non-transparent Al.
Claim 5
Dependent Claim
43 words
A semiconductor integrated circuit device according to claim 1, wherein said light transmit-receive means includes a photodiode chip for receiving an optical signal from another semiconductor packaging substrate and a semiconductor laser chip for transmitting an optical signal to another semiconductor packaging substrate.
Claim 6
Dependent Claim
16 words
A semiconductor integrated circuit device according to claim 4, further comprising a lens for converging light.
Claim 7
Dependent Claim
39 words
A semiconductor integrated circuit device according to claim 1, wherein each of said semiconductor packaging substrates has at least one opening and said light transmit-receive means is constituted by light transmit-receive elements which are respectively provided on said openings.
Claim 8
Dependent Claim
146 words
A semiconductor integrated circuit device comprising: at least two semiconductor packaging substrates superposed on one another, each of said semiconductor packaging substrates having at least one opening at a position corresponding to that of another semiconductor packaging substrate; a plurality of semiconductor integrated circuits selectively mounted on a portion of the exposed surface of each of said semiconductor packaging substrates which excludes said opening; a lens provided in each opening; light transmit-receive elements each having at least one light emitting element and at least one light receiving element which are formed integral with each other and covering ends of each opening; and wires for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other and connecting said semiconductor integrated circuits on each thereof to said light transmit-receive means, wherein said semiconductor integrated circuits perform predetermined batch-process of electric signals, respectively.
Claim 9
Dependent Claim
146 words
A semiconductor integrated circuit device comprising: at least two semiconductor packaging substrates superposed on one another, each of said semiconductor packaging substrates having at least one opening at a position corresponding to that of another semiconductor packaging substrate; a plurality of semiconductor integrated circuits selectively mounted on a portion of the exposed surface of each of said semiconductor packaging substrates which excludes said opening; a lens provided in each opening; light transmit-receive elements each having at least one light emitting element and at least one light receiving element which are formed integral with each other and covering ends of each opening; and wires for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other and connecting said semiconductor integrated circuits on each thereof to said light transmit-receive means, wherein said semiconductor integrated circuits perform predetermined batch-process of electric signals, respectively.
Claim 10
Dependent Claim
17 words
A semiconductor integrated circuit according to claim 7, wherein said light transmit-receive elements constitute light transmit-receive means.
Claim 11
Dependent Claim
179 words
A semiconductor integrated circuit device comprising: a plurality of semiconductor packaging substrates arranged parallel to one another; a plurality of semiconductor integrated circuits mounted one each of said semiconductor packaging substrates; connecting means for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other; optical signal transmitting means, electrically connected to at least one of said semiconductor integrated circuits on each of said semiconductor packaging substrates, for converting electric signals input by said semiconductor integrated circuits on one semiconductor packaging substrate to an optical signal and outputting the optical signal to another semiconductor packaging substrate; and optical signal receiving means, electrically connected to at least one of said semiconductor integrated circuits on each of said semiconductor integrated circuit substrates, for receiving an optical signal output from one semiconductor packaging substrate, converting the optical signal to electric signals, and outputting the electric signals to said semiconductor integrated circuits, wherein said semiconductor integrated circuits batch-process electric signals and said optical signal transmitting means and said optical signal receiving means are formed integral with each other.
Claim 12
Dependent Claim
179 words
A semiconductor integrated circuit device comprising: a plurality of semiconductor packaging substrates arranged parallel to one another; a plurality of semiconductor integrated circuits mounted one each of said semiconductor packaging substrates; connecting means for electrically connecting said semiconductor integrated circuits on each of said semiconductor packaging substrates with each other; optical signal transmitting means, electrically connected to at least one of said semiconductor integrated circuits on each of said semiconductor packaging substrates, for converting electric signals input by said semiconductor integrated circuits on one semiconductor packaging substrate to an optical signal and outputting the optical signal to another semiconductor packaging substrate; and optical signal receiving means, electrically connected to at least one of said semiconductor integrated circuits on each of said semiconductor integrated circuit substrates, for receiving an optical signal output from one semiconductor packaging substrate, converting the optical signal to electric signals, and outputting the electric signals to said semiconductor integrated circuits, wherein said semiconductor integrated circuits batch-process electric signals and said optical signal transmitting means and said optical signal receiving means are formed integral with each other.
Claim 13
Dependent Claim
26 words
A semiconductor integrated circuit device according to claim 9, wherein said semiconductor packaging substrate is transparent for light signals emitted by said optical signal transmitting means.
Claim 14
Dependent Claim
19 words
A semiconductor integrated circuit device according to claim 9, wherein said semiconductor packaging substrates are formed of transparent AlN.
Claim 15
Dependent Claim
29 words
A semiconductor integrated circuit device according to claim 9, wherein said optical signal transmitting means is constituted by one of a light emitting diode and a semiconductor laser chip.
Claim 16
Dependent Claim
21 words
A semiconductor integrated circuit device according to claim 9, wherein said optical signal receiving means is constituted by a photodiode chip.
Claim 17
Dependent Claim
21 words
A semiconductor integrated circuit device according to claim 9, wherein said receiving and transmitting means includes a lens for converging light.
Claim 18
Dependent Claim
23 words
A semiconductor integrated circuit device according to claim 9, wherein said receiving and transmitting means is constituted by a plurality of transmit-receive elements.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1996-03-29 | 1996-09-28 | 1997-03-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-03-29 | 2000-09-28 | 2001-03-30 | $3760.00 | Window Closed / Lapsed |
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