Semiconductor device

Abstract

Abstract PURPOSE:To simplify the structure and allow a sure transmission, by connecting two laminated IC layers by photo-coupling elements and using light for signal transmission means of two layers. CONSTITUTION:After forming the IC 1, on the surface thereof light receiving elements 12a are formed at the position of junction between the circuit 1. Next, after forming a layer insulation film 4, an IC 2 is formed thereon. Also in this case, if the junction between the upper layer circuit is necessary, a light receiving element 12b is formed at the position. After a layer insulation film 5 is formed again, an IC 3 is formed thereon. Thereafter, after the part wherein the junction between the lower circuits 1 and 2 is necessary is opened, insulation layers 10a and 10b which transmit light are buried into the aperatures 6a, 6b. Next, light emitting elements 11a, 11b which convert electric signal into the light are formed on the apertures 6a, 6b. When constituted in this manner, a signal transmission becomes high-speed and positive.

Inventors

• 👤 Hideaki Itakura
• 👤 秀明 板倉

Bibliographic Details