Patent US5633206A successfully refreshed from Google Patents.
US5633206A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for manufacturing lead frame for semiconductor package
Assignee: Samsung Electronics Co Ltd
•
Filing: 1995-11-14
•
Granted: 1997-05-27
•
Expires: 2015-11-14
Abstract
Abstract A process for manufacturing a lead frame having a pad, inner leads, outer leads and dambars, the lead frame being coated with a film on the back surface of the pad, which includes the steps of preparing a lead frame having a pad, inner leads and outer leads; placing a polyamic acid film on the back surface of the pad without using adhesive; and thermally compressing the polyamic acid film by using a heat; generator, to form polyimide film and simultaneously adhere that to the polyimide film the back surface of the pad.
Inventors
- 👤 Sang H. Kim
- 👤 Sung M. Sim
- 👤 In P. Hong
- 👤 Sang G. Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:58
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W72/00; H10W72/30; H10W70/40; H10W70/411; H10W70/417; H10W90/00; H10W90/811; H10W74/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
98 words
A process for manufacturing lead frame, which comprises the steps of: providing a lead frame comprising a pad having a back surface, inner leads, outer leads and dambars; placing a layer of polyamic acid film on said back surface of said pad so that the polyamic acid film adheres to the back surface of the pad without using any other adhesive; and thermally compressing said film by using a heat-generator to form polyimide film from said polyamic acid film and at the same time to cause the polyimide film to adhere to said back surface of said pad.
Claim 2
Dependent Claim
98 words
A process for manufacturing lead frame, which comprises the steps of: providing a lead frame comprising a pad having a back surface, inner leads, outer leads and dambars; placing a layer of polyamic acid film on said back surface of said pad so that the polyamic acid film adheres to the back surface of the pad without using any other adhesive; and thermally compressing said film by using a heat-generator to form polyimide film from said polyamic acid film and at the same time to cause the polyimide film to adhere to said back surface of said pad.
Claim 3
Dependent Claim
21 words
The process of claim 1, wherein the thermal compression of polyamic acid film is carried out at temperature of 350°-420° C.
Claim 4
Dependent Claim
123 words
A process for manufacturing a semiconductor chip package, which comprises the steps of: providing a lead frame comprising a pad having a back surface, inner leads, and outer leads; placing a layer of polyamic acid film on said back surface of said pad so that the polyamic acid film adheres to the back surface of the pad without using any other adhesive; thermally compressing said polyamic acid film by using a heat-generator to form polyimide film from said polyamic acid film and simultaneously cause it to adhere to said back surface of said pad; mounting a semiconductor chip on the pad; electrically connecting the chip to the inner leads through wires; and encapsulating the chip and the lead frame by a molding resin.
Claim 5
Dependent Claim
123 words
A process for manufacturing a semiconductor chip package, which comprises the steps of: providing a lead frame comprising a pad having a back surface, inner leads, and outer leads; placing a layer of polyamic acid film on said back surface of said pad so that the polyamic acid film adheres to the back surface of the pad without using any other adhesive; thermally compressing said polyamic acid film by using a heat-generator to form polyimide film from said polyamic acid film and simultaneously cause it to adhere to said back surface of said pad; mounting a semiconductor chip on the pad; electrically connecting the chip to the inner leads through wires; and encapsulating the chip and the lead frame by a molding resin.
Claim 6
Dependent Claim
21 words
The process of claim 3, wherein the thermal compression of polyamic acid film is carried out at temperature of 350°-420° C.
Claim 7
Dependent Claim
16 words
The process of claim 3, wherein the polyamic acid film has at least one through hole.
References Cited (Backward Citations)
US4369090A
Cited
US4709468A
Cited
US4890157A
Cited
US5070039A
Cited
US4916519A
Cited
US5208188A
Cited
US4965654A
Cited
US5313102A
Cited
US5434106A
Cited
US5384690A
Cited
US5429992A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-26 | 2000-11-25 | 2001-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-26 | 2004-11-25 | 2005-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-26 | 2008-11-25 | 2009-05-27 | $7700.00 | Window Closed / Lapsed |