Patent US5627112A successfully refreshed from Google Patents.
US5627112A
Expired / Lapsed
US
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Method of making suspended microstructures
Assignee: DRS Network and Imaging Systems LLC
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Filing: 1995-11-13
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Granted: 1997-05-06
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Expires: 2015-11-13
Abstract
Abstract A suspended microstructure process assembly includes a first microstructure assembly, with a temporary substrate having a first surface and a first microstructure fabricated on the first surface; a second microstructure assembly, including a final substrate having a second surface and a second microstructure fabricated on the second surface; connecting elements for joining the first microstructure assembly to the second microstructure assembly with a predetermined separation and alignment; and a removable bond temporarily securing the first microstructure assembly to the second microstructure assembly until the temporary substrate is removed. The connecting elements may be electrically conductive contacts or electrically nonconductive spacers. Electrically conductive contacts may be supplied to the first microstructure from a back side of the first microstructure assembly. The first microstructure fabricated on the first surface may incorporate a removable layer to enable multiple level suspended structures.
Inventors
- 👤 William E. Tennant
- 👤 Isoris S. Gergis
- 👤 Charles W. Seabury
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 14:21
CPC Classifications
G; G01; G01J; G01J5/00; G01J5/10; G01J5/20; G03; G03F; G03F7/00; H; H10; H10W; H10W72/00; H10W72/01; H10W72/012
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
156 words
A method of making a suspended microstructure, comprising the steps of: providing a temporary substrate having a first surface; fabricating a first microstructure on the first surface to form a first microstructure assembly; providing a final substrate having a second surface; fabricating a second microstructure on the second surface to form a second microstructure assembly; forming at least one connecting element joining the first microstructure assembly and the second microstructure assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures; introducing a removable bonding medium into the separation between the first and second microstructures to temporarily secure the first microstructure assembly to the second microstructure assembly; removing the temporary substrate after introducing the removable bonding medium; and removing the bonding medium, thereby leaving; the first micro, structure affixed to the final substrate while preserving the separation and alignment between the first and second microstructures.
Claim 2
Independent Claim
156 words
A method of making a suspended microstructure, comprising the steps of: providing a temporary substrate having a first surface; fabricating a first microstructure on the first surface to form a first microstructure assembly; providing a final substrate having a second surface; fabricating a second microstructure on the second surface to form a second microstructure assembly; forming at least one connecting element joining the first microstructure assembly and the second microstructure assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures; introducing a removable bonding medium into the separation between the first and second microstructures to temporarily secure the first microstructure assembly to the second microstructure assembly; removing the temporary substrate after introducing the removable bonding medium; and removing the bonding medium, thereby leaving; the first micro, structure affixed to the final substrate while preserving the separation and alignment between the first and second microstructures.
Claim 3
Dependent Claim
71 words
The method of claim 1, wherein the step of forming at least one connecting element comprises the step of: attaching at least one electrically conductive contact between the first microstructure assembly and the second microstructure assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures and such that an electrical connection is established between the first and second microstructures.
Claim 4
Dependent Claim
88 words
The method of claim 2, wherein the step of attaching at least one electrically conductive contact comprises the step of: attaching at least one electrically conductive contact of material selected from the group consisting of alloys of indium, tin, lead, bismuth, and gallium between the first microstructure assembly and the second microstructure, assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures and such that an electrical connection is established between the first and second microstructures.
Claim 5
Dependent Claim
57 words
The method of claim 1, wherein the step of forming at least one connecting element comprises the step of: attaching at least one electrically nonconductive spacer between the first microstructure assembly and the second microstructure assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures.
Claim 6
Dependent Claim
52 words
The method of claim 4, further comprising, after the step of removing the temporary substrate, the step of: forming at least one electrically conductive contact to the first microstructure from a back side of the first microstructure assembly opposite the connecting element between the first microstructure assembly and the second microstructure assembly.
Claim 7
Dependent Claim
41 words
The method of claim 1, wherein the step of fabricating a first microstructure comprises the step of: fabricating a first microstructure, including a removable layer to enable multiple level suspended structures, on the first surface to form a first microstructure assembly.
Claim 8
Dependent Claim
42 words
The method of claim 1, wherein the step of introducing a removable bonding medium further comprises the step of: injecting an organic bonding medium between the first and second microstructures to temporarily secure the first microstructure assembly to the second microstructure assembly.
Claim 9
Dependent Claim
53 words
The method of claim 7, wherein the step of removing the bonding medium further comprises the step of: removing the organic bonding medium by dry etching with an oxygen plasma, thereby leaving the first micro structure affixed to the final substrate while preserving the separation and alignment between the first and second microstructures.
Claim 10
Dependent Claim
50 words
The method of claim 1, further comprising, prior to the step of removing the bonding medium, the step of: dicing the affixed first microstructure, second microstructure, and final substrate assembly to facilitate, after the step of removing the bonding medium, separating the assembly into a plurality of suspended microstructure devices.
Claim 11
Dependent Claim
40 words
The method of claim 1, further comprising, after the step of removing the bonding medium, the step of: dicing the affixed first microstructure, second microstructure, and final substrate assembly to separate the assembly into a plurality of suspended microstructure devices.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-05 | 2000-11-04 | 2001-05-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-05 | 2004-11-04 | 2005-05-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-05 | 2008-11-04 | 2009-05-06 | $7700.00 | Window Closed / Lapsed |