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Method for hydrogenating a polycrystal silicon layer of a thin film transistor

Assignee: Sony Corp
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Filing: 1995-06-07
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Granted: 1997-05-06
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Expires: 2015-06-07
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Abstract

Abstract The present invention improves a current--voltage characteristic by perfectly eliminating defects in the polycrystal silicon layer of TFT by hydrogenation. In the first process, hydrogen is doped into the polycrystal silicon layer 16 of TFT 1 by the hydrogen plasma doping method to eliminate a greater part of the defects in the polycrystal silicon layer 16. Thereafter, in the second process, after an amorphous silicon nitride film 23 including hydrogen is formed on the polycrystal silicon layer 16 or on the stopper layer 17 provided on the polycrystal silicon layer 16, hydrogen is released from the amorphous silicon nitride film 23 including hydrogen by the annealing process and such released hydrogen is then diffused into the polycrystal silicon layer 16 in order to eliminate remaining defects in the polycrystal silicon layer 16.

Inventors

  • 👤 Dharam P. Gosain
  • 👤 Jonathan Westwater
  • 👤 Setsuo Usui

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 14:36
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/031; H10D30/0312; H10D30/0316; H10D30/0321; H10P; H10P95/00; H10P95/94

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 84 words
A method of hydrogenating a polycrystal silicon layer of a thin film transistor comprising: providing a thin film transistor including a polycrystal silicon layer on a substrate; doping hydrogen into the polycrystal silicon layer by exposing the thin film transistor to a hydrogen plasma processing; forming an amorphous silicon nitride film including hydrogen oil the thin film transistor; and annealing to release and diffuse hydrogen from the amorphous silicon nitride film into the doped polycrystal silicon layer to provide a hydrogenated polycrystal silicon layer.
Claim 2
Independent Claim 84 words
A method of hydrogenating a polycrystal silicon layer of a thin film transistor comprising: providing a thin film transistor including a polycrystal silicon layer on a substrate; doping hydrogen into the polycrystal silicon layer by exposing the thin film transistor to a hydrogen plasma processing; forming an amorphous silicon nitride film including hydrogen oil the thin film transistor; and annealing to release and diffuse hydrogen from the amorphous silicon nitride film into the doped polycrystal silicon layer to provide a hydrogenated polycrystal silicon layer.
Claim 3
Dependent Claim 37 words
A method as defined in claim 1, wherein said thin film transistor further includes a stopper layer on the polycrystal silicon layer and hydrogen is doped and diffused through the stopper layer into the polycrystal silicon layer.
Claim 4
Dependent Claim 20 words
A method as defined in claim 1, wherein the thin film transistor is a bottom gate type thin film transistor.
Claim 5
Dependent Claim 20 words
A method as defined in claim 1, wherein said annealing step is performed by furnace annealing or by laser annealing.

References Cited (Backward Citations)

US5053347A Cited
US5150181A Cited
US5455182A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-05-05 2000-11-04 2001-05-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-05-05 2004-11-04 2005-05-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-05-05 2008-11-04 2009-05-06 $7700.00 Window Closed / Lapsed

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