Patent US5621313A successfully refreshed from Google Patents.
US5621313A
Expired / Lapsed
US
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Wafer probing system and method that stores reference pattern and movement value data for different kinds of wafers
Assignee: Tokyo Seimitsu Co Ltd
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Filing: 1995-09-28
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Granted: 1997-04-15
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Expires: 2015-09-28
Abstract
Abstract A method for aligning a wafer probing system includes securing a wafer to a movable table; moving the table a predetermined reference position below an image sensing device for sensing a wafer circuit pattern of the wafer; transmitting the sensed wafer circuit pattern to an alignment adjustment device; bringing the table to a correlated reference position; moving the table to a first movement amount below a probing device; comparing the first movement amount to a first stored movement amount data; and moving the table a second stored movement amount such that at least one electrode pad of the wafer contacts a probe of the probing device, wherein the second stored movement amount is determined by comparison of the first movement value with the first stored movement amount data.
Inventors
- 👤 Kiyoaki Tsuta
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 14:15
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2832; G01R31/2834; G01R31/282; G01R31/2831; G01R31/2851; G01R31/2886; G01R31/2887
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
135 words
A method for aligning a wafer probing system comprising: securing a wafer to a movable table; moving the table to a predetermined reference position below an image sensing device for sensing a wafer circuit pattern of the wafer; transmitting the wafer circuit pattern sensed by the image sensing device to an alignment adjustment device; bringing the table to a correlated reference position; moving the table a first movement amount below a probing device; comparing the first movement amount to a first stored movement amount data; and moving the table a second stored movement amount such that at least one electrode pad of the wafer contacts a probe of the probing device, said stored, second movement amount being determined by results of the comparison of the first movement amount with the first stored movement amount data.
Claim 2
Independent Claim
135 words
A method for aligning a wafer probing system comprising: securing a wafer to a movable table; moving the table to a predetermined reference position below an image sensing device for sensing a wafer circuit pattern of the wafer; transmitting the wafer circuit pattern sensed by the image sensing device to an alignment adjustment device; bringing the table to a correlated reference position; moving the table a first movement amount below a probing device; comparing the first movement amount to a first stored movement amount data; and moving the table a second stored movement amount such that at least one electrode pad of the wafer contacts a probe of the probing device, said stored, second movement amount being determined by results of the comparison of the first movement amount with the first stored movement amount data.
Claim 3
Dependent Claim
33 words
The method of claim 1, wherein the second stored movement amount is calculated by using a difference amount when said first movement amount is not equal to the first stored movement amount data.
Claim 4
Dependent Claim
23 words
The method of claim 1, further comprising: electrically retrieving data used to determine the correlated reference position from a first temporary memory device.
Claim 5
Dependent Claim
20 words
The method of claim 1, further comprising: electrically retrieving the second stored movement amount from a second temporary memory device.
Claim 6
Dependent Claim
21 words
The method of claim 1, further comprising: electrically retrieving the first stored movement amount data from a third temporary memory device.
Claim 7
Dependent Claim
278 words
A wafer probing system comprising: a movable table for moving at least one wafer; an image sensing device for sensing a wafer circuit pattern of the at least one wafer when the table moves the wafer below the image sensing device and for transmitting the wafer circuit pattern to other parts of the system; an alignment adjusting device for receiving the wafer circuit pattern and for aligning the at least one wafer for probing, said alignment adjustment device comprising a first temporary memory device for storing data used to determine correlated reference positions for the at least one wafer, a second temporary memory device for storing a movement amount used to align the at least one electrode pad of the at least one wafer with a probe, and a third temporary memory device for storing movement data used in aligning the at least one wafer, wherein said alignment adjustment device compares a first movement amount of said movable table moving to a reference position of said probe with a second movement amount stored in said third temporary memory device and, if said first and second compared movement amounts are equal, said table is moved by said movement amount stored in said second temporary memory device and, if said first and second compared movement amounts are not equal, said table is moved by a movement amount that is found by compensating said movement amount in said second temporary memory device by a difference between said first movement amount of said movable table moving to said reference position of said probe and said second movement amount stored in said third temporary memory device; and a probe for probing the wafer.
Claim 8
Dependent Claim
278 words
A wafer probing system comprising: a movable table for moving at least one wafer; an image sensing device for sensing a wafer circuit pattern of the at least one wafer when the table moves the wafer below the image sensing device and for transmitting the wafer circuit pattern to other parts of the system; an alignment adjusting device for receiving the wafer circuit pattern and for aligning the at least one wafer for probing, said alignment adjustment device comprising a first temporary memory device for storing data used to determine correlated reference positions for the at least one wafer, a second temporary memory device for storing a movement amount used to align the at least one electrode pad of the at least one wafer with a probe, and a third temporary memory device for storing movement data used in aligning the at least one wafer, wherein said alignment adjustment device compares a first movement amount of said movable table moving to a reference position of said probe with a second movement amount stored in said third temporary memory device and, if said first and second compared movement amounts are equal, said table is moved by said movement amount stored in said second temporary memory device and, if said first and second compared movement amounts are not equal, said table is moved by a movement amount that is found by compensating said movement amount in said second temporary memory device by a difference between said first movement amount of said movable table moving to said reference position of said probe and said second movement amount stored in said third temporary memory device; and a probe for probing the wafer.
Claim 9
Independent Claim
154 words
A method for aligning a wafer probing system for probing a plurality of wafers having different circuit patterns, comprising: securing a wafer having a specific circuit pattern to a movable table; moving the table a predetermined reference position below an image sensing device for sensing the circuit pattern of the wafer; transmitting the circuit pattern sensed by the image sensing device to an alignment adjustment device; bringing the table to a correlated reference position; moving the table a first movement value below a probing device; comparing the first movement value to a first stored movement value data for a previous wafer having the same circuit pattern; and moving the table a second stored movement amount such that at least one electrode pad of the wafer contacts a probe of the probing device, wherein the second stored movement amount is determined by comparison of the first movement value with the first stored movement value data.
Claim 10
Independent Claim
154 words
A method for aligning a wafer probing system for probing a plurality of wafers having different circuit patterns, comprising: securing a wafer having a specific circuit pattern to a movable table; moving the table a predetermined reference position below an image sensing device for sensing the circuit pattern of the wafer; transmitting the circuit pattern sensed by the image sensing device to an alignment adjustment device; bringing the table to a correlated reference position; moving the table a first movement value below a probing device; comparing the first movement value to a first stored movement value data for a previous wafer having the same circuit pattern; and moving the table a second stored movement amount such that at least one electrode pad of the wafer contacts a probe of the probing device, wherein the second stored movement amount is determined by comparison of the first movement value with the first stored movement value data.
Claim 11
Dependent Claim
22 words
The method for aligning a wafer probing system recited in claim 7, further comprising electrically retrieving said first stored movement value data.
Claim 12
Dependent Claim
21 words
The method for aligning a wafer probing system recited in claim 7, further comprising electrically retrieving said second stored movement amount.
Claim 13
Dependent Claim
24 words
The method for aligning a wafer probing system recited in claim 7, further comprising electrically retrieving data used to determine said correlated reference position.
Claim 14
Dependent Claim
20 words
The method for aligning a wafer probing system recited in claim 7, further comprising a plurality of temporary memory devices.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-04-14 | 2000-10-14 | 2001-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-04-14 | 2004-10-14 | 2005-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-04-14 | 2008-10-14 | 2009-04-15 | $7700.00 | Window Closed / Lapsed |