US4934064A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Alignment method in a wafer prober
Assignee: Canon Inc
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Filing: 1988-09-02
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Granted: 1990-06-19
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Expires: 2008-09-02
Abstract
Abstract A wafer prober for contacting probe needles of a probe card to bonding pads of a chip formed on a wafer, for allowing examination of characteristics of the chip, is disclosed. The wafer prober includes a wafer holder for holding a wafer and moving the same in X and Y directions. By the wafer holder, the wafer can be moved from an alignment information detecting station whereat alignment information can be detected by use of a TV camera, to an examining station whereat the probe needles of the probe card are used for the examination. The position of the wafer in a Z direction at the time when the alignment information is detected by the TV camera, can be made substantially coincident with the position of the wafer in the Z direction at the time when the probe needles contact the bonding pads. By this, an error caused by the movement of the wafer holder in the Z direction does not affect against the alignment accuracy of the wafer in the X and Y directions, such that the probe needles can correctly contact the bonding pads.
Inventors
- 👤 Nobuhito Yamaguchi
- 👤 Mitsuya Sato
- 👤 Takao Ukaji
- 👤 Taro Ohmori
- 👤 Eiichi Murakami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:55
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/06; H10P72/0606; G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R1/07307; G01R1/07314; H10P72/50; H10P72/53
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
161 words
A method for aligning a probe needle of a probe card with a bonding pad of a wafer, said method comprising the steps of: moving a wafer holder for holding said wafer in a Z direction so that, at an alignment information detecting station different from an inspection station at which the probe card is provided, the position of a reference plane related to the wafer in the Z direction becomes substantially equal to the position of the reference plane in the Z direction when the probe needle contacts the bonding pad at the inspection station; moving a photoelectric detector provided at the alignment information detecting station in the Z direction so that the photoelectric detector and the reference plane are brought into a predetermined positional relationship with respect to the Z direction; and photoelectrically detecting the surface of the wafer to obtain alignment information for aligning the bonding pad with the probe needle with respect to X and Y directions.
Claim 2
Independent Claim
161 words
A method for aligning a probe needle of a probe card with a bonding pad of a wafer, said method comprising the steps of: moving a wafer holder for holding said wafer in a Z direction so that, at an alignment information detecting station different from an inspection station at which the probe card is provided, the position of a reference plane related to the wafer in the Z direction becomes substantially equal to the position of the reference plane in the Z direction when the probe needle contacts the bonding pad at the inspection station; moving a photoelectric detector provided at the alignment information detecting station in the Z direction so that the photoelectric detector and the reference plane are brought into a predetermined positional relationship with respect to the Z direction; and photoelectrically detecting the surface of the wafer to obtain alignment information for aligning the bonding pad with the probe needle with respect to X and Y directions.
Claim 3
Independent Claim
162 words
A method for aligning a probe needle of a probe card with a bonding pad of a wafer, said method comprising the steps of: moving a wafer holder for holding said wafer in a Z direction so that, at an alignment information detecting station different from an inspection station at which the probe card is provided, the position of a reference plane related to the wafer holder in the Z direction becomes substantially equal to the position of the reference plane in the Z direction when the probe needle contacts the bonding pad at the inspection station; moving a photoelectric detector provided at the alignment information detecting station in the Z direction so that the photoelectric detector and the reference plane are brought into a predetermined positional relationship with respect to the Z direction; and photoelectrically detecting the surface of the wafer to obtain alignment information for aligning the bonding pad with the probe needle with respect to X and Y directions.
Claim 4
Independent Claim
162 words
A method for aligning a probe needle of a probe card with a bonding pad of a wafer, said method comprising the steps of: moving a wafer holder for holding said wafer in a Z direction so that, at an alignment information detecting station different from an inspection station at which the probe card is provided, the position of a reference plane related to the wafer holder in the Z direction becomes substantially equal to the position of the reference plane in the Z direction when the probe needle contacts the bonding pad at the inspection station; moving a photoelectric detector provided at the alignment information detecting station in the Z direction so that the photoelectric detector and the reference plane are brought into a predetermined positional relationship with respect to the Z direction; and photoelectrically detecting the surface of the wafer to obtain alignment information for aligning the bonding pad with the probe needle with respect to X and Y directions.
Claim 5
Dependent Claim
175 words
A wafer prober for aligning a bonding pad of a wafer with a probe needle of a probe card, comprising: a wafer holder for holding the wafer; a photoelectric detector for photoelectrically detecting the surface of the wafer to obtain alignment information for aligning the bonding pad with the probe needle in X and Y directions, said photoelectric detector being provided at an alignment information detecting station different from an inspection station at which the probe card is provided; control means for controlling movement of the wafer holder in a Z direction so that, at the alignment information detecting station, the position of a reference plane related to the wafer or wafer holder in the Z direction becomes substantially equal to the position of the reference plane in the Z direction to be assumed when the probe needle contacts the bonding pad at the inspection station; and Z drive means for moving said photoelectric detector in the Z direction so as to bring said photoelectric detector into a predetermined positional relationship with the reference plane.
Claim 6
Dependent Claim
175 words
A wafer prober for aligning a bonding pad of a wafer with a probe needle of a probe card, comprising: a wafer holder for holding the wafer; a photoelectric detector for photoelectrically detecting the surface of the wafer to obtain alignment information for aligning the bonding pad with the probe needle in X and Y directions, said photoelectric detector being provided at an alignment information detecting station different from an inspection station at which the probe card is provided; control means for controlling movement of the wafer holder in a Z direction so that, at the alignment information detecting station, the position of a reference plane related to the wafer or wafer holder in the Z direction becomes substantially equal to the position of the reference plane in the Z direction to be assumed when the probe needle contacts the bonding pad at the inspection station; and Z drive means for moving said photoelectric detector in the Z direction so as to bring said photoelectric detector into a predetermined positional relationship with the reference plane.
Claim 7
Dependent Claim
49 words
A wafer prober according to claim 3, further comprising a measurement device for measuring the position of a free end of the probe needle, wherein said control means controls the movement of the wafer holder in the Z direction on the basis of an output of said measurement device.
Claim 8
Dependent Claim
48 words
A wafer prober according to claim 4, further comprising an X-Y stage for moving the wafer holder in X and Y directions between the inspection station and the alignment information detecting station, wherein said measurement device is moved by said X-Y stage in the X and Y directions.
References Cited (Backward Citations)
US4052793A
Cited
US4786867A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-18 | 1993-12-18 | 1994-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-18 | 1997-12-18 | 1998-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-18 | 2001-12-18 | 2002-06-19 | $7700.00 | Window Closed / Lapsed |