Patent US5611140A successfully refreshed from Google Patents.
US5611140A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming electrically conductive polymer interconnects on electrical substrates
Assignee: Adeia Semiconductor Technologies LLC
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Filing: 1995-02-10
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Granted: 1997-03-18
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Expires: 2015-02-10
Abstract
Abstract A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least one electrically conductive polymer bump is then formed on each of a second set of the bond pads of the substrate. The circuit is formed by selectively forming an organic protective layer around the bond pads of a second substrate by laser ablation of an organic protective coating polymer bumps on the first and second portions of the bond pads of the first substrate are then contacted with the bond pads of the second substrate, thereby forming the electrical circuit.
Inventors
- 👤 Frank W. Kulesza
- 👤 Richard H. Estes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 11:09
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/12; H05K3/1216; H05K3/30; H05K3/32; H05K3/321; H10; H10W; H10W20/00; H10W20/40; H10W20/41; H10W20/44; H10W20/4473; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H10W70/099; H10W72/00; H10W72/01; H10W72/012; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K1/00; H05K1/18; H05K1/181; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10954; H05K2201/10977; H05K2201/10984; H05K2203/00; H05K2203/11; H05K2203/1189; H05K2203/14; H05K2203/1476; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0032; H05K3/0035; H05K3/22; H05K3/28; H05K3/303; H05K3/305; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07237; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/20; H10W72/221; H10W72/225; H10W72/241; H10W72/251; H10W72/252; H10W72/253; H10W72/30; H10W72/331; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/1092; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
88 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: stencilling conductive polymer bumps onto the contact pads of one of the substrates; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the conductive bumps being disposed between the aligned contact pads; and electrically connecting the contacts of the first substrate to the electrical contacts of the second substrate through the conductive bumps.
Claim 2
Independent Claim
88 words
A method of electrically connecting conductive contact pads of a first substrate to conductive contact pads of a second substrate, comprising the steps of: stencilling conductive polymer bumps onto the contact pads of one of the substrates; positioning the contact pads of the first substrate in alignment with the contact pads of the second substrate and with the conductive bumps being disposed between the aligned contact pads; and electrically connecting the contacts of the first substrate to the electrical contacts of the second substrate through the conductive bumps.
Claim 3
Dependent Claim
15 words
The method recited in claim 1 wherein one of the substrates comprises a flip chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-17 | 2000-09-16 | 2001-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-17 | 2004-09-16 | 2005-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-17 | 2008-09-16 | 2009-03-18 | $7700.00 | Window Closed / Lapsed |