Patent US364693A successfully refreshed from Google Patents.
Patent US5607883A successfully refreshed from Google Patents.
US5607883A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High performance and high capacitance package with improved thermal dissipation
Assignee: Intel Corp
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Filing: 1996-04-16
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Granted: 1997-03-04
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Expires: 2016-04-16
Abstract
Abstract A thermally dissipative IC package which can accommodate large discrete capacitors. The package substrate incorporates a recessed region on one of its surfaces which is separate from the region in which the IC device is placed. Inside this recessed region is placed a discrete capacitor such that the entire capacitor resides below the surface of the substrate within the recessed region. Finally, a metal plate is attached to the surface of the substrate, unencumbered by the discrete capacitor.
Inventors
- 👤 Bidyut K. Bhattacharyya
- 👤 Shigeo Tanahashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:08
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W40/00; H10W40/20; H10W40/22; H10W44/00; H10W44/601; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
89 words
A method of housing an integrated circuit, said method comprising: providing a recessed region in a surface of a package substrate; placing a discrete capacitor within said recessed region such that said capacitor is disposed below said surface of said substrate; placing a metal plate over said surface of said substrate such that said metal plate covers said recessed region; and exposing said substrate, said discrete capacitor, and said metal plate to an elevated temperature such that said discrete capacitor and said metal plate are fused to said substrate.
Claim 2
Independent Claim
89 words
A method of housing an integrated circuit, said method comprising: providing a recessed region in a surface of a package substrate; placing a discrete capacitor within said recessed region such that said capacitor is disposed below said surface of said substrate; placing a metal plate over said surface of said substrate such that said metal plate covers said recessed region; and exposing said substrate, said discrete capacitor, and said metal plate to an elevated temperature such that said discrete capacitor and said metal plate are fused to said substrate.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein said metal plate hermetically seals said capacitor within said recessed region.
Claim 4
Dependent Claim
42 words
The method of claim 1 further comprising the step of electrically coupling a ground plane to both a first terminal end of said capacitor and to said metal plate, and coupling a power plane to a second terminal end of said capacitor.
Claim 5
Dependent Claim
13 words
The method of claim 1 wherein said metal plate primarily comprises pure copper.
Claim 6
Dependent Claim
14 words
The method of claim 1 wherein said package is a ball grid array package.
Claim 7
Independent Claim
94 words
A method of assembling an integrated circuit within a package, said method comprising: providing a package substrate having a through hole and a recessed region in a surface; placing a discrete capacitor within said recessed region such that said capacitor is disposed below said surface of said substrate; attaching a metal plate to said surface of said substrate such that said metal plate hermetically seals said recessed region and one side of said through hole; and attaching said integrated circuit to a portion of said metal plate which is exposed within said through hole.
Claim 8
Independent Claim
94 words
A method of assembling an integrated circuit within a package, said method comprising: providing a package substrate having a through hole and a recessed region in a surface; placing a discrete capacitor within said recessed region such that said capacitor is disposed below said surface of said substrate; attaching a metal plate to said surface of said substrate such that said metal plate hermetically seals said recessed region and one side of said through hole; and attaching said integrated circuit to a portion of said metal plate which is exposed within said through hole.
Claim 9
Dependent Claim
22 words
The method of claim 6 further comprising the step of wire bonding said integrated circuit to conductive pads on said package substrate.
Claim 10
Dependent Claim
30 words
The assembly method of claim 6 wherein said metal plate comprises copper and said capacitor is electrically coupled between a ground supply and a power supply of said integrated circuit.
Claim 11
Independent Claim
117 words
A method of manufacturing a package for an integrated circuit, said method comprising: punching holes in a series of ceramic layers while still in green tape form to create a package substrate having a through hole and a recessed region in a surface; attaching a discrete capacitor using a first conductive paste to electrical vias coupled to power and ground planes within said package substrate, said capacitor disposed within said recessed region; and attaching a metal plate using a second conductive paste to a seal ring formed on said surface of said package substrate, said seal ring being coupled to a ground plane within said package substrate and encompassing both said through hold and said recessed region.
Claim 12
Independent Claim
117 words
A method of manufacturing a package for an integrated circuit, said method comprising: punching holes in a series of ceramic layers while still in green tape form to create a package substrate having a through hole and a recessed region in a surface; attaching a discrete capacitor using a first conductive paste to electrical vias coupled to power and ground planes within said package substrate, said capacitor disposed within said recessed region; and attaching a metal plate using a second conductive paste to a seal ring formed on said surface of said package substrate, said seal ring being coupled to a ground plane within said package substrate and encompassing both said through hold and said recessed region.
Claim 13
Dependent Claim
31 words
The manufacturing method of claim 9 wherein said first and said second conductive pastes have a melting point above a temperature used to subsequently couple said integrated circuit to said plate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-03-03 | 2000-09-02 | 2001-03-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-03-03 | 2004-09-02 | 2005-03-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-03-03 | 2008-09-02 | 2009-03-04 | $7700.00 | Window Closed / Lapsed |