US4635346A
Expired / Lapsed
US
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Method for producing hybrid integrated circuit
Assignee: Toshiba Corp
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Filing: 1984-11-08
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Granted: 1987-01-13
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Expires: 2004-11-08
Abstract
Abstract A method for producing a hybrid integrated circuit includes steps of: applying an adhesive to an electronic part mounting conductor on an insulating substrate; adhering an electronic part to the applied adhesive and hardening the adhesive to temporarily fix the electronic part; fixing the temporarily fixed electronic part on the conductor with solder; and dissolving the hardened adhesive in a solvent and removing it. Upon being hardened, the adhesive can withstand the heat of molten solder and can be dissolved in a solvent and removed therewith.
Inventors
- 👤 Kazuhiro Matsuzaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 22:22
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H10; H10W; H10W72/00; H10W72/01; H10W72/013; H10W90/00; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0158; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/0779; H05K2203/0783; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/751; H10W90/754; H10W99/00; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
136 words
A method for producing a hybrid integrated circuit, comprising the steps of: applying an adhesive to lead wire connecting conductors and to an electronic part mounting portion of a conductor on an insulating substrate, the adhesive containing a polymer or a copolymer of a substituted or non-substituted styrene dissolved in a solvent consisting essentially of substituted or non-substituted Carbitol acetate, and a silica powder dispersed in the solvent and upon being hardened being capable of withstanding a temperature of molten solder and of being dissolved in a solvent; adhering an electronic part on the applied adhesive and hardening the adhesive to temporarily fix the electronic part in position; fixing with solder the temporarily fixed electronic part on the conductor on the insulating substrate; and dissolving the hardened adhesive in a solvent and removing the dissolved adhesive.
Claim 2
Independent Claim
136 words
A method for producing a hybrid integrated circuit, comprising the steps of: applying an adhesive to lead wire connecting conductors and to an electronic part mounting portion of a conductor on an insulating substrate, the adhesive containing a polymer or a copolymer of a substituted or non-substituted styrene dissolved in a solvent consisting essentially of substituted or non-substituted Carbitol acetate, and a silica powder dispersed in the solvent and upon being hardened being capable of withstanding a temperature of molten solder and of being dissolved in a solvent; adhering an electronic part on the applied adhesive and hardening the adhesive to temporarily fix the electronic part in position; fixing with solder the temporarily fixed electronic part on the conductor on the insulating substrate; and dissolving the hardened adhesive in a solvent and removing the dissolved adhesive.
Claim 3
Dependent Claim
52 words
A method according to claim 1, wherein the polymer or copolymer of the substituted or non-substituted styrene is at least a compound selected from the group consisting of a polymer of styrene, methylstyrene or ethylstyrene; a copolymer of styrene with a styrene derivative; and a copolymer of styrene with acrylonitrile or butadiene.
Claim 4
Dependent Claim
34 words
A method according to claim 1, wherein the substituted or non-substituted Carbitol acetate is at least one, member selected from the group consisting of acetates of Carbitol, methyl Carbitol, mono-n-butyl Carbitol, and mono-iso-butyl Carbitol.
Claim 5
Dependent Claim
38 words
A method according to claim 1, wherein the silica powder is one member selected from the group consisting of a fumed silica powder, a precipitated silica powder, a molten silica powder, a sintered silica powder and silica aerogel.
Claim 6
Dependent Claim
38 words
A method according to claim 1, wherein the solvent for dissolving and removing the hardened adhesive is at least one compound selected from the group consisting of an aromatic hydrocarbon, a halogenated hydrocarbon, methyl ethyl ketone, and cyclohexane.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-01-12 | 1990-07-14 | 1991-01-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-01-12 | 1994-07-14 | 1995-01-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-01-12 | 1998-07-14 | 1999-01-13 | $7700.00 | Window Closed / Lapsed |