US5603847A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Annular circuit components coupled with printed circuit board through-hole
Assignee: Hadco Santa Clara Inc
•
Filing: 1994-04-05
•
Granted: 1997-02-18
•
Expires: 2014-04-05
Abstract
Abstract A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a trough-hole or via and a surrounding conductive layer in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors, inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.
Inventors
- 👤 James R. Howard
- 👤 Gregory L. Lucas
- 👤 Scott K. Bryan
- 👤 Jin S. Choe
- 👤 Nicholas Biunno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 21:42
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K1/162; H05K1/165; H05K1/02; H05K1/0296; H05K1/0298; H05K1/11; H05K1/115; H05K1/116; H05K2201/00; H05K2201/08; H05K2201/083; H05K2201/086; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/093; H05K2201/09309; H05K2201/09654; H05K2201/09809; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0545; H05K3/00; H05K3/40; H05K3/42; H05K3/429
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
93 words
A method of forming a circuit component assembly in a conductive layer of a printed circuit board (PCB), comprising the steps of: forming an annular recess in the conductive layer about a conductive element comprising one of (a) a through-hole and (b) a central conductor in the PCB; forming a circuit component assembly in the annular recess, the circuit component assembly including at least one circuit component body and having an outer perimeter interconnected with the conductive layer; and operatively interconnecting the conductive element with an inner perimeter of the circuit component assembly.
Claim 2
Independent Claim
93 words
A method of forming a circuit component assembly in a conductive layer of a printed circuit board (PCB), comprising the steps of: forming an annular recess in the conductive layer about a conductive element comprising one of (a) a through-hole and (b) a central conductor in the PCB; forming a circuit component assembly in the annular recess, the circuit component assembly including at least one circuit component body and having an outer perimeter interconnected with the conductive layer; and operatively interconnecting the conductive element with an inner perimeter of the circuit component assembly.
Claim 3
Dependent Claim
71 words
The method of claim 1 further comprising the step of forming the outer and inner perimeters of the circuit component assembly with substantially constant radii and forming the circuit component assembly to be generally coextensive with the annular recess whereby the outer perimeter of the circuit component assembly is connected with the conductive layer and the inner perimeter of the circuit component assembly is operatively connected with the central conductive element.
Claim 4
Dependent Claim
28 words
The method of claim 1 further comprising the step of forming a conductive pad interconnected between the conductive through-hole and the inner perimeter of the circuit component assembly.
Claim 5
Dependent Claim
73 words
The method of claim 3 further comprising the step of forming the outer and inner perimeters of the circuit component assembly with substantially constant radii and forming the circuit component assembly to be generally coextensive with the annular recess whereby the outer perimeter of the circuit component assembly is in full register with the conductive layer and the inner perimeter of the circuit component assembly is in full register with the conductive pad.
Claim 6
Dependent Claim
40 words
The method of claim 4 further comprising the step of forming the conductive layer and conductive pad with generally equal thicknesses at their respective interconnections with the circuit component assembly for establishing the effective thickness of the circuit component assembly.
Claim 7
Dependent Claim
19 words
The method of claim 5 further comprising the step of forming the circuit component body from a liquid precursor.
Claim 8
Dependent Claim
19 words
The method of claim 1 wherein the conductive layer is a portion of a capacitive laminate in the PCB.
Claim 9
Dependent Claim
20 words
The method of claim 1 further comprising the step of forming the circuit component assembly body from a liquid precursor.
Claim 10
Independent Claim
119 words
A method of forming a circuit component assembly in a conductive layer of a PCB laminate comprising the steps of: applying a protective layer onto the conductive layer of the laminate to expose an annular portion of the conductive layer; removing the exposed portion of the conductive layer by a subtractive step to form an annular recess in the conductive layer around a conductive center portion; depositing a liquid precursor into the annular recess; removing the protective layer from the conductive layer of the laminate; and curing the liquid precursor to form the annular circuit component assembly with its outer periphery connected to the conductive layer of the laminate and its inner perimeter connected to the conductive center portion.
Claim 11
Independent Claim
119 words
A method of forming a circuit component assembly in a conductive layer of a PCB laminate comprising the steps of: applying a protective layer onto the conductive layer of the laminate to expose an annular portion of the conductive layer; removing the exposed portion of the conductive layer by a subtractive step to form an annular recess in the conductive layer around a conductive center portion; depositing a liquid precursor into the annular recess; removing the protective layer from the conductive layer of the laminate; and curing the liquid precursor to form the annular circuit component assembly with its outer periphery connected to the conductive layer of the laminate and its inner perimeter connected to the conductive center portion.
Claim 12
Dependent Claim
27 words
The method of claim 9 wherein the liquid precursor comprises a circuit component material selected from the group consisting of conductive/resistive materials, inductive materials and dielectric/capacitive materials.
Claim 13
Dependent Claim
67 words
The method of claim 9 further comprising the step of forming a conductive element comprising one of (a) a through-hole, and (b) a central conductor in the conductive center portion of the circuit component assembly and the underlying laminate structure whereby the central conductive element is operative connected with the inner perimeter of the circuit component assembly wherein the conductive laminate forms a portion of a CB.
Claim 14
Dependent Claim
22 words
The method of claim 9 further comprising the step of partially curing the liquid precursor prior to removal of the protective layer.
Claim 15
Dependent Claim
79 words
The method of claim 9 further comprising the steps of: arranging a screen or stencil above the disposable contact layer after the subtractive step has been performed, the screen or stencil having an annular opening therein in register with the annular recess formed in the conductive layer by the subtractive step; and depositing the liquid precursor in the annular recess of the conductive layer of the laminate through the corresponding annular opening or openings in the screen or stencil.
Claim 16
Dependent Claim
24 words
The method of claim 12 wherein the circuit component material is selected from the group consisting of conductive/resistive materials, inductive materials and dielectric/capacitive materials.
Claim 17
Dependent Claim
22 words
The method of claim 13 further comprising the step of partially curing the liquid precursor prior to removal of the protective layer.
Claim 18
Dependent Claim
174 words
The method of claim 9 for forming a compound circuit component assembly and further comprising the steps of: arranging a first screen or stencil above the disposable contact layer after the subtractive step has been performed, the first screen or stencil having an annular opening therein in register with a first portion of the annular recess formed in the conductive layer by the subtractive step; depositing a first liquid precursor in the first portion of the annular recess in the conductive layer of the laminate through the corresponding annular opening in the first screen or stencil; removing the first screen or stencil; arranging a second screen or stencil above the disposable contact layer, the second screen or stencil having an annular opening therein in register with a second portion of the annular recess formed in the conductive layer by the subtractive step; and depositing a second liquid precursor in the second portion of the annular recess in the conductive layer of the laminate through the corresponding annular opening in the second screen or stencil.
Claim 19
Dependent Claim
29 words
The method of claim 16 wherein the first and second liquid precursors comprise materials selected from the group consisting of conductive/resistive materials, inductive materials, dielectric/capacitive materials and combinations thereof.
References Cited (Backward Citations)
US2811621A
Cited
US3554877A
Cited
US3582842A
Cited
US4045636A
Cited
US4130857A
Cited
US4404059A
Cited
US4911796A
Cited
US4964948A
Cited
US4808967A
Cited
US4888574A
Cited
US4735676A
Cited
US4825536A
Cited
US4892776A
Cited
US4870746A
Cited
US5100695A
Cited
US5039570A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-02-18 | 2000-08-19 | 2001-02-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-02-18 | 2004-08-19 | 2005-02-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-02-18 | 2008-08-19 | 2009-02-18 | $7700.00 | Window Closed / Lapsed |