Method for forming electric circuits on a base board

Claim 1

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching copper laminations on both sides of said base board to provide a copper laminated base board; (b) processing said copper laminated base board to provide a through-hole extending all through the thickness of said copper laminated base board; (c) performing a catalyst treatment of said copper laminated base board; (d) washing said copper laminated base board; (e) etching both sides of said copper laminated base board to form thereon a plurality of circuits of first lamination including a circuit formed around said through-hole on each side of said copper laminated base board; (f) coating a plating-resistant resist on both sides of said copper laminated base board except the circuits of first lamination; (g) heating said copper laminated base board to harden said plating-resistant resist; (h) coating an electrically conductive copper paste on both sides of said copper laminated base board in a manner as to electrically connect at least two circuits of first lamination on each side of said copper laminated base board; (i) heating said copper laminated base board to harden said electrically conductive copper paste; (j) making a pre-plating treatment to said copper laminated base board (k) performing a chemical copper plating on the surface of said electrically conductive paste of said copper laminated base board to provide thereat a circuit of second lamination on each side of said copper laminated base board; (l) coating said plating-resistant resist on both sides of said copper laminated base board except a part of said circuits of first lamination formed around said through-hole; (m) heating said copper laminated base board to harden said plating-resistant resist; periphery of said through-hole; and (n) performing an activation treatment to the inner periphery of said through-hole; and (o) performing a non-electrolytic copper plating on said inner periphery of said through-hole to provide thereat a copper plating layer to electrically connect said circuits of first lamination on both sides of said copper laminated base board.

Claim 2

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching copper laminations on both sides of said base board to provide a copper laminated base board; (b) processing said copper laminated base board to provide a through-hole extending all through the thickness of said copper laminated base board; (c) performing a catalyst treatment of said copper laminated base board; (d) washing said copper laminated base board; (e) etching both sides of said copper laminated base board to form thereon a plurality of circuits of first lamination including a circuit formed around said through-hole on each side of said copper laminated base board; (f) coating a plating-resistant resist on both sides of said copper laminated base board except the circuits of first lamination; (g) heating said copper laminated base board to harden said plating-resistant resist; (h) coating an electrically conductive copper paste on both sides of said copper laminated base board in a manner as to electrically connect at least two circuits of first lamination on each side of said copper laminated base board; (i) heating said copper laminated base board to harden said electrically conductive copper paste; (j) making a pre-plating treatment to said copper laminated base board (k) performing a chemical copper plating on the surface of said electrically conductive paste of said copper laminated base board to provide thereat a circuit of second lamination on each side of said copper laminated base board; (l) coating said plating-resistant resist on both sides of said copper laminated base board except a part of said circuits of first lamination formed around said through-hole; (m) heating said copper laminated base board to harden said plating-resistant resist; periphery of said through-hole; and (n) performing an activation treatment to the inner periphery of said through-hole; and (o) performing a non-electrolytic copper plating on said inner periphery of said through-hole to provide thereat a copper plating layer to electrically connect said circuits of first lamination on both sides of said copper laminated base board.

Claim 3

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching copper laminations on both sides of said base board to provide a copper laminated base board; (b) processing said copper laminated base board to provide a through-hole extending all through the thickness of said copper laminated base board; (c) performing a catalyst treatment of said copper laminated base board; (d) washing said copper laminated base board; (e) etching both sides of said copper laminated base board to form thereon a plurality of circuits of first lamination including a circuit formed around said through-hole on each side of said copper laminated base board; (f) coating a plating-resistant resist on both sides of said copper laminated base board except said circuits of first lamination; (g) heating said copper laminated base board to harden said plating-resistant resist; (h) coating an electrically conductive copper paste on both sides of said copper laminated base board in a manner as to electrically connect at least two circuits of first lamination on each side of said coppe laminated base board; (i) heating said copper laminated base board to harden said electrically conductive copper paste; (j) making a pre-plating treatment to said copper laminated base board; (k) performing a chemical copper plating on the surface of said electrically conductive copper paste of said copper laminated base board to provide thereat a circuit of second lamination on each side of said copper laminated base board; (l) coating a resistor paste on said plating-resistant resist of a predetermined electric resistance value on both sides of said copper laminated base board; (m) heating said copper laminated base board to harden said resistor paste; (n) coating an electrically conductive paste on both sides of said copper laminated base board in a manner as to electrically connect to said resistor paste at least two of said circuits of first lamination located on both sides of said resistor paste or said circuit of second lamination located on one side of said resistor paste on each side of said copper laminated base board; (o) heating said copper laminated base board to harden said electrically conductive paste to form thereat a resistor circuit on each side of said copper laminated base board; (p) coating said plating-resistant resist on both sides of said copper laminated base board except a part of said circuits of first lamination formed around said through-hole; (q) heating said copper laminated base board to harden said plating-resistant resist; (r) performing an activation treatment to the inner periphery of said through-hole; and (s) performing a non-electrolytic copper plating on said inner periphery of said through-hole to provide thereat a copper plating layer to electrically connect said circuits of first lamination on both sides of said copper laminated base board.

Claim 4

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching copper laminations on both sides of said base board to provide a copper laminated base board; (b) processing said copper laminated base board to provide a through-hole extending all through the thickness of said copper laminated base board; (c) performing a catalyst treatment of said copper laminated base board; (d) washing said copper laminated base board; (e) etching both sides of said copper laminated base board to form thereon a plurality of circuits of first lamination including a circuit formed around said through-hole on each side of said copper laminated base board; (f) coating a plating-resistant resist on both sides of said copper laminated base board except said circuits of first lamination; (g) heating said copper laminated base board to harden said plating-resistant resist; (h) coating an electrically conductive copper paste on both sides of said copper laminated base board in a manner as to electrically connect at least two circuits of first lamination on each side of said coppe laminated base board; (i) heating said copper laminated base board to harden said electrically conductive copper paste; (j) making a pre-plating treatment to said copper laminated base board; (k) performing a chemical copper plating on the surface of said electrically conductive copper paste of said copper laminated base board to provide thereat a circuit of second lamination on each side of said copper laminated base board; (l) coating a resistor paste on said plating-resistant resist of a predetermined electric resistance value on both sides of said copper laminated base board; (m) heating said copper laminated base board to harden said resistor paste; (n) coating an electrically conductive paste on both sides of said copper laminated base board in a manner as to electrically connect to said resistor paste at least two of said circuits of first lamination located on both sides of said resistor paste or said circuit of second lamination located on one side of said resistor paste on each side of said copper laminated base board; (o) heating said copper laminated base board to harden said electrically conductive paste to form thereat a resistor circuit on each side of said copper laminated base board; (p) coating said plating-resistant resist on both sides of said copper laminated base board except a part of said circuits of first lamination formed around said through-hole; (q) heating said copper laminated base board to harden said plating-resistant resist; (r) performing an activation treatment to the inner periphery of said through-hole; and (s) performing a non-electrolytic copper plating on said inner periphery of said through-hole to provide thereat a copper plating layer to electrically connect said circuits of first lamination on both sides of said copper laminated base board.

Claim 5

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching copper laminations on both sides of said base board to provide a copper laminated base board; (b) processing said copper laminated base board to provide a through-hole extending all through the thickness of said copper laminated base board; (c) performing a catalyst treatment of said copper laminated base board; (d) washing said copper laminated base board; (e) etching both side of said copper laminated base board to form thereon a plurality of circuits of first lamination including a circuit formed around said through-hole on each side of said copper laminated base board; (f) coating a plating-resistant resist on both sides of said copper laminated base board except said circuits of first lamination; (g) heating said copper laminated base board to harden said plating-resistant resist; (h) coating an electrically conductive copper paste on both sides of said copper laminated base board in a manner as to electrically connect at least two circuits of first lamination on each side of said copper laminated base board; (i) heating said copper laminated base board to harden said electrically conductive copper paste; (j) making a pre-plating treatment to said copper laminated base board; (k) performing a chemical copper plating on the surface of said electrically conductive copper paste of said copper laminated base board to provide thereat a circuit of second lamination on each side of said copper laminated base board; (l) coating a dielectric paste having a property of storing electricity on a part of one of said circuits of first lamination or of second lamination on each side of said copper laminated base board; (m) heating said copper laminated base board to harden said dielectric paste; (n) coating an electrically conductive paste on both sides of said copper laminated base board in a manner as to electrically connect to said dielectric paste one of said circuits of first lamination located adjacent thereto or said circuit of second lamination on each side of said copper laminated base board; (o) heating said copper laminated base board to harden said electrically conductive paste to form thereat an electricity storing circuit on each side of said copper laminated base board; (p) coating said plating-resistant resist on both sides of said copper laminated base board except a part of said circuits of first lamination formed around said through-hole; (q) heating said copper laminated base board to harden said plating-resistant resist; (r) performing an activation treatment to the inner periphery of said through-hole; and (s) performing a non-electrolytic copper plating on said inner periphery of said through-hole to provide thereat a copper plating layer to electrically connect said circuits of first lamination on both sides of said copper laminated base board.

Claim 6

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) attaching copper laminations on both sides of said base board to provide a copper laminated base board; (b) processing said copper laminated base board to provide a through-hole extending all through the thickness of said copper laminated base board; (c) performing a catalyst treatment of said copper laminated base board; (d) washing said copper laminated base board; (e) etching both side of said copper laminated base board to form thereon a plurality of circuits of first lamination including a circuit formed around said through-hole on each side of said copper laminated base board; (f) coating a plating-resistant resist on both sides of said copper laminated base board except said circuits of first lamination; (g) heating said copper laminated base board to harden said plating-resistant resist; (h) coating an electrically conductive copper paste on both sides of said copper laminated base board in a manner as to electrically connect at least two circuits of first lamination on each side of said copper laminated base board; (i) heating said copper laminated base board to harden said electrically conductive copper paste; (j) making a pre-plating treatment to said copper laminated base board; (k) performing a chemical copper plating on the surface of said electrically conductive copper paste of said copper laminated base board to provide thereat a circuit of second lamination on each side of said copper laminated base board; (l) coating a dielectric paste having a property of storing electricity on a part of one of said circuits of first lamination or of second lamination on each side of said copper laminated base board; (m) heating said copper laminated base board to harden said dielectric paste; (n) coating an electrically conductive paste on both sides of said copper laminated base board in a manner as to electrically connect to said dielectric paste one of said circuits of first lamination located adjacent thereto or said circuit of second lamination on each side of said copper laminated base board; (o) heating said copper laminated base board to harden said electrically conductive paste to form thereat an electricity storing circuit on each side of said copper laminated base board; (p) coating said plating-resistant resist on both sides of said copper laminated base board except a part of said circuits of first lamination formed around said through-hole; (q) heating said copper laminated base board to harden said plating-resistant resist; (r) performing an activation treatment to the inner periphery of said through-hole; and (s) performing a non-electrolytic copper plating on said inner periphery of said through-hole to provide thereat a copper plating layer to electrically connect said circuits of first lamination on both sides of said copper laminated base board.

Claim 7

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) applying an adhesive on both sides of said base board to provide an adhesive-applied base board; (b) processing said adhesive-applied base board to provide a through-hole extending all through the thickness of said base board; (c) performing a catalyst treatment of said base board; (d) coating a plating-resistant resist on predetermined portions on both sides of said base board; (e) heating said base board to harden said plating-resistant resist; (f) performing a non-electrolytic copper plating on the portions having no plating-resistant resist coated thereon on both sides of said base board, and on the inner periphery of said through-hole, to hereby provide thereat a copper plating layer in formation of a plurality of circuits of first lamination which are electrically connected to each other on both sides of said base board; (g) coating said plating-resistant resist on at least the portions having said plating-resistant resist coated thereon on both sides of said base board; (h) heating said base board to harden said plating-resistant resist; (i) coating an electrically conductive copper paste on said portions having said plating-resistant resist repeatedly coated thereon; (j) heating said base board to harden said electrically conductive copper paste; (k) performing a pre-plating treatment of said base board; and (l) performing a chemical copper plating on the surface of said electrically conductive copper paste to provide therat a plurality of circuits of second lamination on both sides of said base board.

Claim 8

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) applying an adhesive on both sides of said base board to provide an adhesive-applied base board; (b) processing said adhesive-applied base board to provide a through-hole extending all through the thickness of said base board; (c) performing a catalyst treatment of said base board; (d) coating a plating-resistant resist on predetermined portions on both sides of said base board; (e) heating said base board to harden said plating-resistant resist; (f) performing a non-electrolytic copper plating on the portions having no plating-resistant resist coated thereon on both sides of said base board, and on the inner periphery of said through-hole, to hereby provide thereat a copper plating layer in formation of a plurality of circuits of first lamination which are electrically connected to each other on both sides of said base board; (g) coating said plating-resistant resist on at least the portions having said plating-resistant resist coated thereon on both sides of said base board; (h) heating said base board to harden said plating-resistant resist; (i) coating an electrically conductive copper paste on said portions having said plating-resistant resist repeatedly coated thereon; (j) heating said base board to harden said electrically conductive copper paste; (k) performing a pre-plating treatment of said base board; and (l) performing a chemical copper plating on the surface of said electrically conductive copper paste to provide therat a plurality of circuits of second lamination on both sides of said base board.

Claim 9

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) applying an adhesive on both sides of said base board to provide an adhesive-applied base board; (b) processing said adhesive-applied base board to provide a through-hole extending all through the thickness of said base board; (c) performing a catalyst treatment of said base board; (d) coating a plating-resistant resist on predetermined portions on both sides of said base board; (e) heating said base board to harden said plating-resistant resist; (f) performing a non-electrolytic copper plating on the poritons having no plating-resistant resist coated thereon on both sides of said base board, and on the inner periphery of said through-hole, to thereby provide thereat a copper plating layer in formation of a plurality of circuits of first lamination which are electrically connected to eah other on both sides of said base board; (g) coating said plating-resistant resist on at least the portions having said plating-resistant coated thereon on both sides of said base board; (h) heating said base board to harden said plating-resistant resist; (i) coating an electrically conductive copper paste on said portions having said plating-resistant resist repeatedly coated thereon; (j) heating said base board to harden said electrically conductive copper paste; (k) performing a pre-plating treatment of said base board; (l) performing a chemical copper plating on the surface of said electrically conductive copper paste to provide thereat a plurality of circuits of second lamination on both sides of said base board; (m) coating a resistor paste having a predetermined value of electric resistance on at least one of the portions having said plating-resistant resist coated thereon on each side of said base board; (n) heating said base board to harden said resistor paste; (o) coating an electrically conductive paste on both sides of said base board in a manner as to electrically connect to said resistor paste the circuits of first or second lamination located on both sides of said resistor paste on each side of said base board; and (p) heating said base board to harden said electrically conductive paste to form a resistor circuit on each side of said base board.

Claim 10

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) applying an adhesive on both sides of said base board to provide an adhesive-applied base board; (b) processing said adhesive-applied base board to provide a through-hole extending all through the thickness of said base board; (c) performing a catalyst treatment of said base board; (d) coating a plating-resistant resist on predetermined portions on both sides of said base board; (e) heating said base board to harden said plating-resistant resist; (f) performing a non-electrolytic copper plating on the poritons having no plating-resistant resist coated thereon on both sides of said base board, and on the inner periphery of said through-hole, to thereby provide thereat a copper plating layer in formation of a plurality of circuits of first lamination which are electrically connected to eah other on both sides of said base board; (g) coating said plating-resistant resist on at least the portions having said plating-resistant coated thereon on both sides of said base board; (h) heating said base board to harden said plating-resistant resist; (i) coating an electrically conductive copper paste on said portions having said plating-resistant resist repeatedly coated thereon; (j) heating said base board to harden said electrically conductive copper paste; (k) performing a pre-plating treatment of said base board; (l) performing a chemical copper plating on the surface of said electrically conductive copper paste to provide thereat a plurality of circuits of second lamination on both sides of said base board; (m) coating a resistor paste having a predetermined value of electric resistance on at least one of the portions having said plating-resistant resist coated thereon on each side of said base board; (n) heating said base board to harden said resistor paste; (o) coating an electrically conductive paste on both sides of said base board in a manner as to electrically connect to said resistor paste the circuits of first or second lamination located on both sides of said resistor paste on each side of said base board; and (p) heating said base board to harden said electrically conductive paste to form a resistor circuit on each side of said base board.

Claim 11

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) applying an adhesive on both sides of said base board to provide an adhesive-applied base board; (b) processing said adhesive-applied base board to provide a through-hole extending all through the thickness of said base board; (c) performing a catalyst treatment of said base board; (d) coating a plating-resistant resist on predetermined portions on both sides of said base board; (e) heating said base board to harden said plating-resistant resist; (f) performing a non-electrolytic copper plating on the portions having no plating-resistant resist coated thereon on both sides of said base board, and on the inner periphery of said through-hole, to thereby provide therat a copper plating layer in formation of a plurality of circuits of first lamination which are electrically connected to each other on both sides of said base board; (g) coating said plating-resistant resist on at least the portions having said plating-resistant resist coated thereon on both sides of said base board; (h) heating said base board to harden said plating-resistant resist; (i) coating an electrically conductive copper paste on said portions having said plating-resistant resist repeatedly coating thereon; (j) heating said base board to harden said electrically conductive copper paste; (k) performing a pre-plating treatment of said base board; (l) performing a chemical copper plating on the surface of said electrically conductive copper paste to provide thereat a plurality of circuits of second lamination on both sides of said base board; (m) coating a dielectric paste having a property of storing electricity on a part of one of said circuits of first or second lamination on each side of said bse board; (n) heating said base board to harden said dielectric paste; (o) coating an electrically conductive paste on both sides of said base board in a manner as to electrically connect to said dielectric paste at least one of said circuits of first or second lamination located adjacent to said dielectric paste; and (p) heating said base board to harden said electrically conductive paste to form thereat an electricity storing circuit on each side of said base board.

Claim 12

A method for forming electrically conductive circuits on a base board comprising the steps of: (a) applying an adhesive on both sides of said base board to provide an adhesive-applied base board; (b) processing said adhesive-applied base board to provide a through-hole extending all through the thickness of said base board; (c) performing a catalyst treatment of said base board; (d) coating a plating-resistant resist on predetermined portions on both sides of said base board; (e) heating said base board to harden said plating-resistant resist; (f) performing a non-electrolytic copper plating on the portions having no plating-resistant resist coated thereon on both sides of said base board, and on the inner periphery of said through-hole, to thereby provide therat a copper plating layer in formation of a plurality of circuits of first lamination which are electrically connected to each other on both sides of said base board; (g) coating said plating-resistant resist on at least the portions having said plating-resistant resist coated thereon on both sides of said base board; (h) heating said base board to harden said plating-resistant resist; (i) coating an electrically conductive copper paste on said portions having said plating-resistant resist repeatedly coating thereon; (j) heating said base board to harden said electrically conductive copper paste; (k) performing a pre-plating treatment of said base board; (l) performing a chemical copper plating on the surface of said electrically conductive copper paste to provide thereat a plurality of circuits of second lamination on both sides of said base board; (m) coating a dielectric paste having a property of storing electricity on a part of one of said circuits of first or second lamination on each side of said bse board; (n) heating said base board to harden said dielectric paste; (o) coating an electrically conductive paste on both sides of said base board in a manner as to electrically connect to said dielectric paste at least one of said circuits of first or second lamination located adjacent to said dielectric paste; and (p) heating said base board to harden said electrically conductive paste to form thereat an electricity storing circuit on each side of said base board.