US5100695A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a printed circuit board
Assignee: Nippon CMK Corp
•
Filing: 1989-11-29
•
Granted: 1992-03-31
•
Expires: 2009-11-29
Abstract
Abstract A method of manufacturing a printed circuit board for use in an electronic circuit is disclosed. The method comprises steps of forming a printed circuit on an insulating base board, of forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and of adhering the conductive ink through an uneven surface formed on a terminal portion to be connected to the printed circuit.
Inventors
- 👤 Shin Kawakami
- 👤 Satoshi Haruyama
- 👤 Hirotaka Okonogi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 14:19
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/245; H05K3/46; H05K3/4644; H05K3/4664; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0373; H05K3/4685
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
90 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a printed circuit on an insulating base board having an even surface and having a terminal portion with an uneven surface, forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and adhering the conductive ink on the uneven surface of the terminal portion of the printed circuit, wherein the uneven surface of the terminal portion comprises a plurality of concave portions formed on the terminal portion.
Claim 2
Independent Claim
90 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a printed circuit on an insulating base board having an even surface and having a terminal portion with an uneven surface, forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and adhering the conductive ink on the uneven surface of the terminal portion of the printed circuit, wherein the uneven surface of the terminal portion comprises a plurality of concave portions formed on the terminal portion.
Claim 3
Independent Claim
91 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a printed circuit on an insulating base board having an even surface and having a terminal portion with an uneven surface, forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and adhering the conductive ink on the uneven surface of the terminal portion of the printed circuit, wherein the uneven surface of the terminal portion comprises a plurality of column shaped projections formed on the terminal surface.
Claim 4
Independent Claim
91 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a printed circuit on an insulating base board having an even surface and having a terminal portion with an uneven surface, forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and adhering the conductive ink on the uneven surface of the terminal portion of the printed circuit, wherein the uneven surface of the terminal portion comprises a plurality of column shaped projections formed on the terminal surface.
Claim 5
Independent Claim
90 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a printed circuit on an insulating base board having an even surface and having a terminal portion with an uneven surface, forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and adhering the conductive ink on the uneven surface of the terminal portion of the printed circuit, wherein the uneven surface of the terminal portion comprises a plurality of projecting strips placed on the terminal surface.
Claim 6
Independent Claim
90 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a printed circuit on an insulating base board having an even surface and having a terminal portion with an uneven surface, forming a circuit portion to be connected to the printed circuit by adhering a conductive ink on the base board, and adhering the conductive ink on the uneven surface of the terminal portion of the printed circuit, wherein the uneven surface of the terminal portion comprises a plurality of projecting strips placed on the terminal surface.
Claim 7
Independent Claim
116 words
A method of manufacturing a printed circuit board, comprising the steps of: forming on an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the step of forming the printed circuit includes forming a plurality of depressions in the surface of the at least one terminal portion; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 8
Independent Claim
116 words
A method of manufacturing a printed circuit board, comprising the steps of: forming on an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the step of forming the printed circuit includes forming a plurality of depressions in the surface of the at least one terminal portion; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 9
Independent Claim
118 words
A method of manufacturing a printed circuit board, comprising the steps of: forming on an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the step of forming the printed circuit includes forming a plurality of projections extending outwardly from the surface of the at least one terminal portion; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 10
Independent Claim
118 words
A method of manufacturing a printed circuit board, comprising the steps of: forming on an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the step of forming the printed circuit includes forming a plurality of projections extending outwardly from the surface of the at least one terminal portion; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 11
Independent Claim
120 words
A method of manufacturing a printed circuit board, comprising the steps of: forming on an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the step of forming the printed circuit includes forming a plurality of strips on the surface of the at least one terminal portion and projecting upwardly therefrom; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 12
Independent Claim
120 words
A method of manufacturing a printed circuit board, comprising the steps of: forming on an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the step of forming the printed circuit includes forming a plurality of strips on the surface of the at least one terminal portion and projecting upwardly therefrom; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 13
Independent Claim
124 words
A method of manufacturing a printed circuit board, comprising the steps of: forming of an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the uneven surface of the at least one terminal portion is formed at the same time as the forming of the even surface of the main portion of the printed circuit; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 14
Independent Claim
124 words
A method of manufacturing a printed circuit board, comprising the steps of: forming of an insulating base a printed circuit having a main portion with an even surface and at least one terminal portion with an uneven surface for providing a connection to another printed circuit, wherein the uneven surface of the at least one terminal portion is formed at the same time as the forming of the even surface of the main portion of the printed circuit; and connecting the at least one terminal portion of the printed circuit to another printed circuit by applying a conductive ink on the insulating base and on the uneven surface of the at least one terminal portion to increase the adhesion between the two printed circuits.
Claim 15
Dependent Claim
25 words
A method of manufacturing a printed circuit board as claimed in claim 2, wherein the conductive ink is a copper paste or a silver paste.
Claim 16
Dependent Claim
30 words
The method according to claim 7, wherein the step of applying a conductive ink comprises silk screening a conductive ink on the surface of the at least one terminal portion.
Claim 17
Dependent Claim
13 words
The method according to claim 7, wherein the conductive ink comprises copper paste.
Claim 18
Dependent Claim
13 words
The method according to claim 7, wherein the conductive ink comprises silver paste.
References Cited (Backward Citations)
US4486466A
Cited
JPS57143475A
Cited
US4569902A
Cited
US4678529A
Cited
US4814040A
Cited
US4808434A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-31 | 1995-09-30 | 1996-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-31 | 1999-09-30 | 2000-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-31 | 2003-09-30 | 2004-03-31 | $7700.00 | Window Closed / Lapsed |