US5595241A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer heating chuck with dual zone backplane heating and segmented clamping member
Assignee: Tokyo Electron Ltd
•
Filing: 1994-10-07
•
Granted: 1997-01-21
•
Expires: 2014-10-07
Abstract
Abstract A wafer heating chuck includes a backplane for mounting the wafer thereon. A rear surface of the backplane includes an outer annular recess with an outer angled wall. An outer annular heater is located within the recess and has an outer surface complementarily angled with respect to the wall. An inner annular heater resides inside the outer heater, adjacent the rear surface. A clamping member secured to the backplane includes inner and outer retainers which separately clamp the inner and outer heaters, respectively, to the backplane to assure solid to solid contact for optimum heat transfer therebetween. Each inner retainer is held by a radially cantilevered segment so that tightening of one inner retainer does not affect clamping force applied by adjacent inner retainers. Similarly, the outer retainers operate on cantilevered segments to yield independent clamping forces. Sensors sense backplane temperature at the inner and outer regions. Sensors are mounted to the backplane proximate the inner and outer heaters to measure the temperature of the backplane. Coolant is directed through channels in the backplane and through channels in a cooling ring secured to a backplane to influence the temperature of the backplane. A controller connects to the heaters, the sensors and coolant supplies for temperature profiling to achieve temperature uniformity during processing for a wafer mounted to the backplane of the heating chuck.
Inventors
- 👤 Vaclav Jelinek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:21
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0434; H10P72/70; H10P72/76; H10P72/7604; H10P72/7624
Claims Analysis
Total Claims: 46
Claim 1
Independent Claim
81 words
A wafer heating chuck comprising: a backplane having a first surface for mounting a wafer thereon and a second surface with an annular recess formed therein, the annular recess located adjacent an outer edge of the backplane and having an outer angled wall; and an outer annular backplane heater residing in the annular recess, the heater including an angled surface in engagement with the outer angled wall to promote heat transfer from the heater to the outer edge of the backplane.
Claim 2
Dependent Claim
81 words
A wafer heating chuck comprising: a backplane having a first surface for mounting a wafer thereon and a second surface with an annular recess formed therein, the annular recess located adjacent an outer edge of the backplane and having an outer angled wall; and an outer annular backplane heater residing in the annular recess, the heater including an angled surface in engagement with the outer angled wall to promote heat transfer from the heater to the outer edge of the backplane.
Claim 3
Dependent Claim
22 words
The wafer heating chuck of claim 1 wherein the annular recess and the annular backplane heater are wedge-shaped in transverse cross section.
Claim 4
Dependent Claim
82 words
The wafer heating chuck of claim 1 further comprising: a clamping member secured to the second surface of the backplane; and an outer clamping device carried by the clamping member and engaging the outer annular backplane heater, the outer clamping device being movable with respect to the secured clamping member and backplane to clamp the angled surface of the outer annular backplane heater into intimate contact with the outer angled wall of the annular recess around the outer edge of the backplane.
Claim 5
Dependent Claim
47 words
The wafer heating chuck of claim 3 wherein the outer clamping device further comprises: a plurality of retainers threadably received within the clamping member and rotatable into and out of engagement with the outer annular backplane heater to clamp the outer heater at a plurality of positions.
Claim 6
Dependent Claim
91 words
The wafer heating chuck of claim 3 wherein the outer clamping device includes a plurality of outer cantilevered segments arranged around the periphery of the clamping member and proximate the outer annular heater, the outer cantilevered segments flexing generally independently of one another and of the clamping member and coupled to the outer segments so that clamping a portion of the outer annular heater at one of the flexing segments does not adversely affect a clamping force applied at the other flexing segments to other portions of the outer annular heater.
Claim 7
Dependent Claim
52 words
The wafer heating chuck of claim 5 wherein the outer clamping device further comprises: a plurality of retainers, at least one retainer threadably received into each flexing outer cantilevered segment and rotatable into and out of engagement with the outer annular backplane heater to flex the segment and clamp the outer heater.
Claim 8
Dependent Claim
27 words
The wafer heating chuck of claim 5 wherein each outer cantilevered segment is one of circumferentially cantilevered and tangentially cantilevered around the periphery of the clamping member.
Claim 9
Dependent Claim
83 words
The wafer heating chuck of claim 3, further comprising: an inner annular backplane heater located radially inside of said outer annular backplane heater, the inner annular backplane heater engaging the backplane for heating an inner annular portion of the backplane; an inner clamping device carried by the clamping member and engaging the inner annular backplane heater, the inner clamping device being movable with respect to the secured clamping member and backplane to clamp the inner annular heater into intimate contact with the backplane.
Claim 10
Dependent Claim
88 words
The wafer heating chuck of claim 8 wherein the outer clamping device includes a plurality of inner cantilevered segments arranged radially around the clamping member proximate the inner annular heater, the inner cantilevered segments flexing generally independently of one another and of the clamping member and coupled to the inner segments so that clamping a portion of the inner annular heater at one of the flexing segments does not adversely affect a clamping force applied at the other flexing segments to other portions of the inner annular heater.
Claim 11
Dependent Claim
52 words
The wafer heating chuck of claim 9 wherein the inner clamping device further comprises: a plurality of retainers, at least one retainer threadably received into each flexing inner cantilevered segment and rotatable into and out of engagement with the inner annular backplane heater to flex the segment and clamp the inner heater.
Claim 12
Dependent Claim
17 words
The wafer heating chuck of claim 9 wherein each inner cantilevered segment is trapezoid-shaped in longitudinal cross-section.
Claim 13
Dependent Claim
82 words
The wafer heating chuck of claim 8 and further comprising: an inner temperature sensor for sensing the backplane temperature at an inner region thereof; an outer temperature sensor for sensing the backplane temperature at an outer region thereof; and controls operatively connected to each temperature sensor and to each annular backplane heater for controlling heating of the inner and outer portions of the backplane, thereby to achieve uniformity in surface temperature for a wafer mounted on the first surface of the backplane.
Claim 14
Dependent Claim
52 words
The wafer heating chuck of claim 1 further comprising: a recess formed in a first surface of the backplane; and a gas inlet in fluid communication with the recess, whereby, with a wafer supported on the backplane, gas supplied to the recess between the backplane and the wafer facilitates heat transfer therebetween.
Claim 15
Dependent Claim
33 words
The wafer heating chuck of claim 1 wherein the backplane has at least one channel formed therein to distribute coolant around the backplane for enhanced uniformity in the surface temperature of the backplane.
Claim 16
Dependent Claim
43 words
The wafer heating chuck of claim 1 further comprising a cooling ring coupled to the second surface of the backplane, the cooling ring including a channel to distribute coolant around the ring for containing heat generated by the heater within a backplane area.
Claim 17
Dependent Claim
146 words
A wafer heating chuck comprising: a backplane having a first surface for supporting a wafer thereon during wafer processing and a second surface with an outer annular recess formed therein, the recess having an outer angled wall; an outer annular heater located in the recess and including an outer angled surface in engagement with the angled wall, the outer annual heater engaging the angled wall for heating an outer annular portion of the backplane; an inner annular heater located adjacent the second surface of the backplane radially inside of the outer annular heater, the inner annular heater engaging the backplane for heating an inner annular portion of the backplane; and a clamping structure secured to the backplane and clamping the inner annular heater and the outer annular heater into intimate surface contact with the backplane for efficient transfer of heat between the backplane and the heaters.
Claim 18
Dependent Claim
146 words
A wafer heating chuck comprising: a backplane having a first surface for supporting a wafer thereon during wafer processing and a second surface with an outer annular recess formed therein, the recess having an outer angled wall; an outer annular heater located in the recess and including an outer angled surface in engagement with the angled wall, the outer annual heater engaging the angled wall for heating an outer annular portion of the backplane; an inner annular heater located adjacent the second surface of the backplane radially inside of the outer annular heater, the inner annular heater engaging the backplane for heating an inner annular portion of the backplane; and a clamping structure secured to the backplane and clamping the inner annular heater and the outer annular heater into intimate surface contact with the backplane for efficient transfer of heat between the backplane and the heaters.
Claim 19
Dependent Claim
84 words
The wafer heating chuck of claim 16 wherein the clamping structure comprises: a clamping member; outer clamping segments carried by the clamping member and clamping the outer annular heater in intimate surface contact with the backplane, the outer clamping segments being generally independently clampable with respect to each other; and inner clamping segments carried by the clamping member and clamping the inner annular heater in intimate surface contact with the backplane, the inner clamping segments being generally independently clampable with respect to each other.
Claim 20
Dependent Claim
58 words
The wafer heating chuck of claim 17, the inner clamping segments including cantilevered tabs which flex and force portions of the inner annular heater against the backplane, the tabs flexing generally independently of each other such that clamping a portion of the inner annular heater at one tab does not adversely affect a clamping force at another tab.
Claim 21
Dependent Claim
59 words
The wafer heating chuck of claim 17, the outer clamping segments including cantilevered tabs operable to flex and force portions of the outer annular heater against the backplane, the tabs flexing generally independently of each other such that clamping a portion of the outer annular heater at one tab does not adversely affect a clamping force at another tab.
Claim 22
Dependent Claim
73 words
The wafer holder of claim 16 and further comprising: an inner temperature sensor for sensing the backplane temperature at an inner region thereof; an outer temperature sensor for sensing the backplane temperature at an outer region thereof; and controls connected to each temperature sensor and to each annular heater for controlling heating of the backplane to achieve uniformity in the surface temperature of a wafer supported on the first surface of the backplane.
Claim 23
Dependent Claim
53 words
The wafer heating chuck of claim 16 and further comprising: a recess formed in the first surface of the backplane, and a gas inlet in fluid communication with the recess, whereby, with a wafer supported on the backplane, gas supplied to the recess between the backplane and the wafer facilitates heat transfer therebetween.
Claim 24
Dependent Claim
33 words
The wafer heating chuck of claim 16 wherein the backplane has at least one channel formed therein to distribute coolant around the backplane for enhanced uniformity in the surface temperature of the backplane.
Claim 25
Dependent Claim
251 words
A wafer heating chuck comprising: a backplane having a first surface for supporting a wafer during wafer processing and a second surface opposite the first surface; an outer annular heater engaging the second surface of the backplane at an outer annular region and heating an outer annular portion of the backplane; an inner annular heater engaging the second surface of the backplane at an inner annular region and heating an inner annular portion of the backplane; a clamping member secured to the second surface of the backplane; a plurality of outer cantilevered segments carried by the clamping member and clamping the outer annular heater into intimate contact with the outer annular region of the backplane, each segment carrying a retainer engaging the outer annular heater to be tightened thereagainst to apply clamping force thereto, the segments operating generally independently one from the other such that tightening of a retainer of one segment does not affect the clamping force applied to the outer annular heater by adjacent retainers and segments; a plurality of inner cantilevered segments carried by the clamping member and clamping the inner annular heater into intimate contact with the inner annular region of the backplane, each segment carrying a retainer engaging the outer annular heater to be tightened thereagainst to apply clamping force thereto, the segments operating generally independently one from the other such that tightening of a retainer of one segment does not affect the clamping force applied to the inner annular heater by adjacent retainers and segments.
Claim 26
Dependent Claim
251 words
A wafer heating chuck comprising: a backplane having a first surface for supporting a wafer during wafer processing and a second surface opposite the first surface; an outer annular heater engaging the second surface of the backplane at an outer annular region and heating an outer annular portion of the backplane; an inner annular heater engaging the second surface of the backplane at an inner annular region and heating an inner annular portion of the backplane; a clamping member secured to the second surface of the backplane; a plurality of outer cantilevered segments carried by the clamping member and clamping the outer annular heater into intimate contact with the outer annular region of the backplane, each segment carrying a retainer engaging the outer annular heater to be tightened thereagainst to apply clamping force thereto, the segments operating generally independently one from the other such that tightening of a retainer of one segment does not affect the clamping force applied to the outer annular heater by adjacent retainers and segments; a plurality of inner cantilevered segments carried by the clamping member and clamping the inner annular heater into intimate contact with the inner annular region of the backplane, each segment carrying a retainer engaging the outer annular heater to be tightened thereagainst to apply clamping force thereto, the segments operating generally independently one from the other such that tightening of a retainer of one segment does not affect the clamping force applied to the inner annular heater by adjacent retainers and segments.
Claim 27
Dependent Claim
51 words
The wafer heating chuck of claim 23 wherein the outer annular region of the second surface has a recess formed in the backplane, the recess having an outer angled wall and the outer annular heater being located in the recess and having an outer angled surface contacting the outer angled wall.
Claim 28
Dependent Claim
74 words
The wafer heating chuck of claim 23 and further comprising: an inner temperature sensor for sensing the backplane temperature at the inner region thereof; an outer temperature sensor for sensing the backplane temperature at the outer region thereof; and controls connected to each temperature sensor and to each annular heater for controlling heating of the backplane to achieve uniformity in the surface temperature of a wafer mounted on the first surface of the backplane.
Claim 29
Dependent Claim
52 words
The wafer heating chuck of claim 23 further comprising: a recess formed in a first surface of the backplane; and a gas inlet in fluid communication with the recess, whereby, with a wafer supported on the backplane, gas supplied to the recess between the backplane and the wafer facilitates heat transfer therebetween.
Claim 30
Dependent Claim
33 words
The wafer heating chuck of claim 23 wherein the backplane has at least one channel formed therein to distribute coolant around the backplane for enhanced uniformity in the surface temperature of the backplane.
Claim 31
Dependent Claim
43 words
The wafer heating chuck of claim 23 further comprising a cooling ring coupled to the second surface of the backplane, the cooling ring including a channel to distribute coolant around the ring for containing heat generated by the heaters within a backplane area.
Claim 32
Dependent Claim
117 words
A wafer heating chuck comprising: a backplane having a first surface for supporting a wafer during wafer processing and a second surface opposite the first surface; a heater located adjacent the second surface of the backplane and engaging the backplane for heating a corresponding portion of the backplane; a clamping member mounted to the second surface of the backplane; and a plurality of flexible clamping segments carried by the clamping member and engaging and clamping the heater into intimate contact with the backplane, the clamping segments being independently movable such that each segment engages and clamps the heater into contact with the backplane without adversely affecting a clamping force applied to the heater by adjacently located segments.
Claim 33
Dependent Claim
117 words
A wafer heating chuck comprising: a backplane having a first surface for supporting a wafer during wafer processing and a second surface opposite the first surface; a heater located adjacent the second surface of the backplane and engaging the backplane for heating a corresponding portion of the backplane; a clamping member mounted to the second surface of the backplane; and a plurality of flexible clamping segments carried by the clamping member and engaging and clamping the heater into intimate contact with the backplane, the clamping segments being independently movable such that each segment engages and clamps the heater into contact with the backplane without adversely affecting a clamping force applied to the heater by adjacently located segments.
Claim 34
Dependent Claim
53 words
The wafer heating chuck of claim 29, the clamping segments including cantilevered tabs which flex and force portions of the heater against the backplane, the tabs flexing generally independently of each other such that clamping a portion of the heater at one tab does not adversely affect a clamping force at another tab.
Claim 35
Dependent Claim
42 words
The wafer heating chuck of claim 30 further comprising of a plurality of retainers, at least one retainer threadably received into each flexing tab and rotatable into and out of engagement with the heater to flex the tab and clamp the heater.
Claim 36
Dependent Claim
27 words
The wafer heating chuck of claim 29 wherein the clamping segments are arranged annularly around the heater to clamp annular portions of the heater to the backplane.
Claim 37
Independent Claim
118 words
A method of uniformly heating a wafer with a wafer heating chuck having a backplane with a first and a second surface comprising: positioning the wafer on the first surface of the backplane; directing a heater against the backplane second surface with a clamping member to heat the backplane and wafer, the clamping member including a plurality of clamping segments positioned around the heater which are separately adjustable to clamp the heater against the backplane; and adjusting one clamping segment to clamp one portion of the heater to a portion of the backplane with a greater force than an adjacent clamping segment whereby to selectively heat various portions of the backplane and produce uniform heating of the wafer.
Claim 38
Independent Claim
118 words
A method of uniformly heating a wafer with a wafer heating chuck having a backplane with a first and a second surface comprising: positioning the wafer on the first surface of the backplane; directing a heater against the backplane second surface with a clamping member to heat the backplane and wafer, the clamping member including a plurality of clamping segments positioned around the heater which are separately adjustable to clamp the heater against the backplane; and adjusting one clamping segment to clamp one portion of the heater to a portion of the backplane with a greater force than an adjacent clamping segment whereby to selectively heat various portions of the backplane and produce uniform heating of the wafer.
Claim 39
Dependent Claim
125 words
The method of claim 33 wherein the heater is an inner annular heater which is directed against an inner portion of the backplane with inner clamping segments the method further comprising the steps of: directing an outer annular heater against an outer portion of the backplane with the clamping member, the clamping member further including outer clamping segments positioned around the outer annular heater which are separately adjustable to clamp the outer annular heater against the backplane; and adjusting one outer clamping segment to clamp one portion of the outer annular heater to a portion of the backplane with a greater force than an adjacent outer clamping segment whereby to selectively heat various portions of the backplane and further produce uniform heating of the wafer.
Claim 40
Dependent Claim
77 words
The method of claim 33 wherein the clamping segments include cantilevered tabs which flex independently from one another and retainers carried by the tabs and contacting the heater and which are movable against the heater to flex the tabs and clamp the heater, the method further comprising the step of moving a retainer of one tab such that the tab flexes to provide a greater clamping force than adjacent tabs to selectively heat portions of the backplane.
Claim 41
Dependent Claim
140 words
The method of claim 34 wherein the inner and outer clamping segments include inner and outer cantilevered tabs, respectively, which flex independently from one another, and inner and outer retainers carried by the inner and outer tabs, respectively, and contacting the respective heaters, the retainers being movable against their respective tabs to flex the tabs and clamp the heaters, the method further comprising the steps of: moving a retainer of one inner tab such that the tab flexes to provide a greater clamping force than adjacent inner tabs to selectively heat inner portions of the backplane; and moving a retainer of one outer tab such that the tab flexes to provide a greater clamping force than adjacent outer tabs to selectively heat outer portions of the backplane; whereby to selectively heat the backplane to provide uniform heating of the wafer.
Claim 42
Dependent Claim
34 words
The method of claim 33 further comprising the step of circulating a coolant medium through a channel in the backplane to selectively cool portions of the backplane and provide uniform heating of the wafer.
Claim 43
Dependent Claim
40 words
The method of claim 33 further comprising the step of circulating a coolant medium through a cooling ring secured to the backplane second surface to contain and dissipate heat generated by the heater for further uniform heating of the wafer.
Claim 44
Dependent Claim
64 words
The method of claim 33 wherein the heater is an outer annular heater having an angled surface, the method further comprising the step of directing the outer annular heater into a recess in the backplane second surface having an outer angled wall such that the surface and wall are engaged to promote heat transfer form the heater to an outer edge of the backplane.
Claim 45
Dependent Claim
57 words
The method of claim 34 further comprising the steps of: sensing the temperature of the inner region of the backplane; sensing the temperature of the outer region of the backplane; controlling the temperature of the inner and outer annular heaters respectively with the sensed inner and outer region temperatures to further achieve temperature uniformity of the wafer.
Claim 46
Dependent Claim
30 words
The method of claim 33 further comprising the step of directing gas into a recess in the backplane first surface to facilitate heat transfer between the backplane and the wafer.
References Cited (Backward Citations)
US3369989A
Cited
US3633537A
Cited
US4909314A
Cited
US4680061A
Cited
US4396640A
Cited
US4470369A
Cited
US4535227A
Cited
US4777022A
Cited
US4680451A
Cited
US4647361A
Cited
US4724621A
Cited
US4771730A
Cited
US4821674A
Cited
US4996942A
Cited
US4810342A
Cited
US4933063A
Cited
US4949783A
Cited
US5133286A
Cited
US4987856A
Cited
US5063031A
Cited
US4971653A
Cited
US5113929A
Cited
EP0452779A2
Cited
JPH0410528A
Cited
US5230741A
Cited
US5267607A
Cited
US5294778A
Cited
US5425812A
Cited
US5460684A
Cited
US5467220A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-01-21 | 2000-07-22 | 2001-01-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-01-21 | 2004-07-22 | 2005-01-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-01-21 | 2008-07-22 | 2009-01-21 | $7700.00 | Window Closed / Lapsed |