Patent US5590144A successfully refreshed from Google Patents.
US5590144A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor laser device
Assignee: Fuji Electric Co Ltd
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Filing: 1994-08-12
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Granted: 1996-12-31
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Expires: 2014-08-12
Abstract
Abstract A semiconductor laser device includes a lead frame for electrically controlling a laser diode element having at least one end face for emitting a laser beam and for mechanically supporting the laser diode element on a planar major surface thereof with a support member interposed therebetween. A sealing resin layer, transparent to the passage of the laser beam, covers at least the laser diode element on the lead frame in a sealing manner. To improve the light emitting point stability of the laser diode element, when the cross section of the planar major surface of the lead frame is parallel to the light emitting end face, a horizontal direction is the longitudinal direction of the cross section of the lead frame, a horizontal center line defines the center of the cross section of the lead frame, and a vertical center line defines the center as viewed in the vertical direction, the sealing resin layer is shaped symmetrically with respect to the vertical center line.
Inventors
- 👤 Shoji Kitamura
- 👤 Yoichi Shindo
- 👤 Akira Amano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 04:49
CPC Classifications
G; G11; G11B; G11B7/00; G11B7/12; G11B7/22; G11B7/125; G11B7/127; H; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/023; H01S5/0232; G11B7/08; G11B7/09; G11B7/0908; H01S5/02208; H01S5/02212; H01S5/02218; H01S5/02234; H01S5/028; H01S5/06; H01S5/062; H01S5/06209; H01S5/06216; H01S5/068; H01S5/0683; H10; H10W; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
105 words
In a semiconductor laser device having a lead frame for electrically controlling a laser diode element having at least one end face for emitting a laser beam and for mechanically supporting the laser diode element on a planar major surface thereof with a support member interposed therebetween, a sealing resin layer allowing the laser beam to pass therethrough and covering at least the laser diode element on the lead frame in a sealing manner, a portion of the lead frame, devoid of the sealing resin layer, being placed against an external fixing board, and means for fixing the lead frame to the external fixing board.
Claim 2
Dependent Claim
105 words
In a semiconductor laser device having a lead frame for electrically controlling a laser diode element having at least one end face for emitting a laser beam and for mechanically supporting the laser diode element on a planar major surface thereof with a support member interposed therebetween, a sealing resin layer allowing the laser beam to pass therethrough and covering at least the laser diode element on the lead frame in a sealing manner, a portion of the lead frame, devoid of the sealing resin layer, being placed against an external fixing board, and means for fixing the lead frame to the external fixing board.
Claim 3
Dependent Claim
50 words
The semiconductor laser device according to claim 1, wherein the lead frame portion includes a first surface of the lead frame, which is opposed to the lead frame planar major surface having the laser diode element mounted thereon and serves as a mounting surface placed against the external fixing board.
Claim 4
Dependent Claim
25 words
The semiconductor laser device according to claim 2, wherein the fixing means fixes the first surface of the lead frame to the external fixing board.
Claim 5
Dependent Claim
31 words
The semiconductor laser device according to claim 1, wherein the fixing means includes at least one through-hole formed in the portion of the lead frame devoid of the sealing resin layer.
Claim 6
Dependent Claim
29 words
The semiconductor laser device according to claim 3, wherein the fixing means includes at least one through-hole formed in the portion of the lead frame including the first surface.
Claim 7
Dependent Claim
15 words
The semiconductor laser device according to claim 1, wherein the fixing means includes an adhesive.
Claim 8
Dependent Claim
15 words
The semiconductor laser device according to claim 3, wherein the fixing means includes an adhesive.
Claim 9
Dependent Claim
19 words
The semiconductor laser device according to claim 4, wherein the fixing means includes connecting means passing through the through-hole.
Claim 10
Dependent Claim
19 words
The semiconductor laser device according to claim 5, wherein the fixing means includes connecting means passing through the through-hole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-31 | 2000-07-01 | 2000-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-31 | 2004-07-01 | 2004-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-31 | 2008-07-01 | 2008-12-31 | $7700.00 | Window Closed / Lapsed |