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EP0366472A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Semiconductor laser apparatus

Assignee: Panasonic Holdings Corp
•
Filing: 1989-10-26
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Granted: —
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Expires: 2009-10-26
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Abstract

Abstract In this invention, a laser chip (3) is directly disposed on a support member through mounting means, and the support member, the laser chip (3), and peripheral parts thereof are integrally sealed with transparent plastic resin. In this structure, without requiring expensive materials and parts, a semiconductor laser apparatus may be manufactured by using the same materials and process as in the ordinary plastic-sealed LED, so that the cost may be reduced significantly.

Inventors

  • 👤 Masaru Wada
  • 👤 Kunio Itoh

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-08 04:46
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/02; H01S5/028; H01S5/022; H01S5/023; H01S5/0232; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; H01S5/02208; H01S5/02212; H01S5/02218; H01S5/02234; H01S5/02325; H01S5/06; H01S5/068; H01S5/0683; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 53 words
A semiconductor laser apparatus comprising; a laser chip in which a high reflectivity film is formed on at least one end surface of the cavity, a support member for supporting said laser chip through a mount member. a transparent plastic resin for sealing said laser chip, said support member and said mount member.
Claim 2
Dependent Claim 53 words
A semiconductor laser apparatus comprising; a laser chip in which a high reflectivity film is formed on at least one end surface of the cavity, a support member for supporting said laser chip through a mount member. a transparent plastic resin for sealing said laser chip, said support member and said mount member.
Claim 3
Dependent Claim 23 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is made of a dielectric film or a metal film.
Claim 4
Dependent Claim 34 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is formed on both end surfaces of said cavity, and the reflectivities of the high reflectivity films are different each other.
Claim 5
Dependent Claim 51 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is formed on both end surfaces of said cavity, and one high reflectivity film is made of a dielectric monolayer film and the other high reflectivity film is made of a dielectric multilayer film or a metal film.
Claim 6
Dependent Claim 23 words
A semiconductor laser apparatus according to claim 1, wherein said high reflectivity film is formed only at one end surface of said cavity.
Claim 7
Dependent Claim 20 words
A semiconductor laser apparatus according to claim 1, wherein said support member is an end portion of a metal lead.
Claim 8
Dependent Claim 18 words
A semiconductor laser apparatus according to claim 1, wherein the refractive index of said plastic resin is 1.54.
Claim 9
Dependent Claim 83 words
A semiconductor laser apparatus comprising; a laser chip in which a high reflectivity film is formed on at least one end surface of the cavity, a photo diode chip, a support member for supporting said laser chip through a mount member and for supporting said diode chip so as to receive a laser beam radiated from said laser chip to the backword direction, a transparent plastic resin for sealing said laser chip, said support member, said mount member and said photo diode chip.
Claim 10
Dependent Claim 83 words
A semiconductor laser apparatus comprising; a laser chip in which a high reflectivity film is formed on at least one end surface of the cavity, a photo diode chip, a support member for supporting said laser chip through a mount member and for supporting said diode chip so as to receive a laser beam radiated from said laser chip to the backword direction, a transparent plastic resin for sealing said laser chip, said support member, said mount member and said photo diode chip.
Claim 11
Dependent Claim 23 words
A semiconductor laser apparatus according to claim 8, wherein said high reflectivity film is made of a dielectric film or a metal film.
Claim 12
Dependent Claim 34 words
A semiconductor laser apparatus according to claim 8, wherein said high reflectivity film is formed on both end surfaces of said cavity, and the reflectivities of the high reflectivity films are different each other.
Claim 13
Dependent Claim 51 words
A semiconductor laser apparatus according to claim 8, wherein said high reflectivity film is formed on both end surfaces of said cavity, and one high reflectivity film is made of a dielectric monolayer film and the other high reflectivity film is made of a dielectric multilayer film or a metal film.
Claim 14
Dependent Claim 23 words
A semiconductor laser apparatus according to claim 8, wherein said high reflectivity film is formed only at one end surface of said cavity.
Claim 15
Dependent Claim 20 words
A semiconductor laser apparatus according to claim 8, wherein said support member is an end portion of a metal lead.
Claim 16
Dependent Claim 18 words
A semiconductor laser apparatus according to claim 8, wherein the refractive index of said plastic resin is 1.54.

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