US5589319A
Expired / Lapsed
US
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Photosensitive polyimide resin composition
Assignee: JNC Corp
•
Filing: 1993-06-24
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Granted: 1996-12-31
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Expires: 2013-06-24
Abstract
Abstract PCT No. PCT/JP93/00853 Sec. 371 Date Feb. 17, 1994 Sec. 102(e) Date Feb. 17, 1994 PCT Filed Jun. 24, 1993 PCT Pub. No. WO94/00800 PCT Pub. Date Jan. 6, 1994The present invention provides a photosensitive resin composition into which a photosensitive group can be easily given and introduced and which is excellent in conservation, stability, heat resistance, practical physical properties and sensitivity and which can inhibit cracks from occurring at the time of development. The photosensitive resin composition of the present invention comprises 100 parts by weight of a polyimide, 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and 0.5-20 parts by weight of a photopolymerization initiator. This composition can be utilized to obtain a patterned polyimide film having heat resistance. This composition can be applied to uses of electronic materials such as interlayer films of multi-layer boards of printed-wiring boards, and the like.
Inventors
- 👤 Kouichi Katou
- 👤 Eiji Watanabe
- 👤 Kouichi Kunimune
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:54
CPC Classifications
C; C08; C08G; C08G18/00; C08G18/06; C08G18/70; C08G18/81; C08G18/8141; C08G18/815; C08G18/8158; C08G18/8175; C08G18/72; C08G18/77; C08G18/78; C08G18/79; C08G18/791; G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/037; H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4673; H05K3/4676; Y; Y10; Y10S; Y10S430/00; Y10S430/1053; Y10S430/1055; Y10S430/106; Y10S430/107
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
50 words
A photosensitive resin composition which comprises (1) 100 parts by weight of a fluorine-containing polyimide, (2) 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, (3) 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and (4) 0.5-20 parts by weight of a photopolymerization initiator as essential components.
Claim 2
Dependent Claim
50 words
A photosensitive resin composition which comprises (1) 100 parts by weight of a fluorine-containing polyimide, (2) 10-100 parts by weight of an isocyanurate having a (meth)acrylic group, (3) 10-100 parts by weight of a polyalkylene glycol di(meth)acrylate, and (4) 0.5-20 parts by weight of a photopolymerization initiator as essential components.
Claim 3
Dependent Claim
19 words
The photosensitive resin composition according to claim 1 wherein the polyimide is a compound also having a sulfone group.
Claim 4
Dependent Claim
25 words
The photosensitive resin composition according to claim 1 wherein said polyimide is derived from a polyamic acid formed from a tetracarboxylic dianhydride and a diamine.
Claim 5
Dependent Claim
17 words
The photosensitive resin composition according to claim 3 wherein said tetracarboxylic dianhydride and diamine are aromatic compounds.
Claim 6
Dependent Claim
15 words
The photosensitive resin composition according to claim 3 wherein said tetracarboxylic dianhydride is hexafluoroisopropylidene-2,2-bis(phthalic anhydride).
Claim 7
Dependent Claim
14 words
The photosensitive resin composition according to claim 5 wherein said diamine is 4,4'-diaminodiphenyl sulfone.
Claim 8
Dependent Claim
20 words
The photosensitive resin composition according to claim 6 wherein said isocyanurate having a (meth)acrylic group is represented by formula ##STR4##
Claim 9
Dependent Claim
25 words
The photosensitive resin composition according to claim 7 wherein said polyalkylene glycol di(meth)acrylate is represented by formula CH.sub.2 ═CHCOO (CH.sub.2 CH.sub.2 O).sub.q COCH═CH.sub.2, wherein 2≦q≦10.
Claim 10
Dependent Claim
14 words
The photosensitive resin composition according to claim 9 wherein said diamine is 4,4'-diaminodiphenyl ether.
Claim 11
Dependent Claim
21 words
The photosensitive resin composition according to claim 9 wherein said isocyanurate having a (meth)acrylic group is represented by the formula ##STR5##
Claim 12
Dependent Claim
24 words
The photosensitive resin composition according to claim 10 wherein said polyalkylene glycol di(meth)acrylate is represented by formula CH.sub.2 ═CHCOO(CH.sub.2 CH.sub.2 O).sub.q COCH═CH.sub.2, wherein 2≦q≦10.
Claim 13
Dependent Claim
15 words
The photosensitive resin composition according to claim 3 wherein said tetracarboxylic dianhydride is diphenylsulfone-3,3',4,4'-tetracarboxylic dianhydride.
Claim 14
Dependent Claim
13 words
The photosensitive resin composition according to claim 3 wherein said diamine is 2,2-bis{4-(4-aminophenoxy)phenyl}hexafluoropropane.
Claim 15
Dependent Claim
15 words
The photosensitive resin composition according to claim 13 wherein said tetracarboxylic dianhydride is hexafluoroisopropylidene-2,2-bis(phthalic anhydride).
Claim 16
Dependent Claim
20 words
The photosensitive resin composition according to claim 14 wherein said isocyanurate having a (meth)acrylic group is represented by formula ##STR6##
Claim 17
Dependent Claim
24 words
The photosensitive resin composition according to claim 7 wherein said polyalkylene glycol di(meth)acrylate is represented by formula CH.sub.2 ═CHCOO(CH.sub.2 CH.sub.2 O).sub.q COCH═CH.sub.2, wherein 2≦q≦10.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-31 | 2000-07-01 | 2000-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-31 | 2004-07-01 | 2004-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-31 | 2008-07-01 | 2008-12-31 | $7700.00 | Window Closed / Lapsed |