Photosensitive resin composition

Abstract

Abstract PURPOSE:To provide the titled compsn. which has excellent solubility and stability in a solution state and gives high photosensitivity without exposure failure caused by whitening during the formation of a coating film, by blending a polymerizable unsaturated compd. and a photoinitiator with a soln. contg. a specified polyimide precursor. CONSTITUTION:10-500pts.wt. (per 100pts.wt. resin component of a polyimide precursor) polymerizable unsaturated compd. such as 2-ethylhexyl acrylate and 0.05-30pts.wt. (per 100pts.wt. said unsaturated compd.) photoinitiator such as benzil dimethyl ketal are blended with a soln. contg. a polyimide precursor having an MW of 700 or above and a repeating unit of the formula (wherein R is an aliph. tetracarboxylic acid residue; R' is a bivalent org. group) or a repeating unit wherein the above-mentioned unit is partially ring-closed into an imide group, to obtain a photosensitive resin compsn.

Inventors

• 👤 Makoto Kojima
• 👤 誠 小島

Bibliographic Details