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Method for manufacturing a coaxial interconnect

Assignee: Raytheon Co
•
Filing: 1995-05-26
•
Granted: 1996-12-24
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Expires: 2015-05-26
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Abstract

Abstract A multi-chip-module comprising a plurality of vertically layered substrates and including a plurality of coaxial inter-connects formed between and through the substrate layers. Each of the coaxial inter-connects is formed by a process wherein: an outer hole (aperture) is drilled through the substrate and lined with an electrically conductive material to form an outer via; the outer via is filled with a dielectric material; and, an inner hole (aperture) is drilled through the dielectric material and filled with an electrically conductive material to form a center via. The characteristic impedance of the coaxial inter-connect is determined by the selection of the outer diameters of the drilled holes for the outer and center vias.

Inventors

  • 👤 David M. White

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 13:46
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K1/0222; H05K1/11; H05K1/115; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/09654; H05K2201/09809; H05K3/00; H05K3/40; H05K3/42; H10W44/00; H10W44/20; H10W44/203; H10W44/209; H10W44/212

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 85 words
A method for manufacturing a coaxial interconnect, comprising the steps of: forming an outer aperture through a substrate layer; coating an inner surface of the outer aperture in the substrate layer with an electrically conductive material to form an outer conductor of the coaxial inter-connect; filling the coated outer aperture with a dielectric material; forming an inner aperture through the dielectric material; and filling the inner aperture in the dielectric material with an electrically conductive material to form a center conductor of the coaxial inter-connect.
Claim 2
Independent Claim 85 words
A method for manufacturing a coaxial interconnect, comprising the steps of: forming an outer aperture through a substrate layer; coating an inner surface of the outer aperture in the substrate layer with an electrically conductive material to form an outer conductor of the coaxial inter-connect; filling the coated outer aperture with a dielectric material; forming an inner aperture through the dielectric material; and filling the inner aperture in the dielectric material with an electrically conductive material to form a center conductor of the coaxial inter-connect.
Claim 3
Dependent Claim 54 words
The method as in claim 1 wherein the outer aperture in the substrate layer has a first outer diameter and the inner aperture in the dielectric material has a second outer diameter, further including the step of: selecting the first and second outer diameters to establish a predetermined characteristic impedance for the coaxial inter-connect.
Claim 4
Dependent Claim 38 words
The method as in claim 1 wherein the step of filling the inner aperture in the dielectric material comprises the step of inserting a fuzz-button through the inner aperture to form the center conductor of the coaxial inter-connect.
Claim 5
Dependent Claim 35 words
The method as in claim 1 wherein the step of filling the inner aperture in the dielectric material comprises the step of coating an inner surface of the inner aperture with an electrically conductive material.

References Cited (Backward Citations)

US4911771A Cited
US5518674A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-12-24 2000-06-24 2000-12-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-12-24 2004-06-24 2004-12-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-12-24 2008-06-24 2008-12-24 $7700.00 Window Closed / Lapsed

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