US4911771A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Laminated printed circuit board and process for its manufacture
Assignee: Junkosha Co Ltd
•
Filing: 1988-11-21
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Granted: 1990-03-27
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Expires: 2008-11-21
Abstract
Abstract A process is provided for making a laminated board useful in printed circuitry. The process involves laminating a metal layer to at least one side of a sheet of porous, expanded polytetrafluoroethylene using an adhesive followed by compressing the polytetrafluoroethylene sheet to increase its density. The metal layer may be a metal foil or it may comprise electrical circuitry. Also provided are printed circuit boards produced by the aforesaid process.
Inventors
- 👤 Satoshi Tanaka
- 👤 Masahiro Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 08:23
CPC Classifications
H; H05; H05K; H05K1/00; B; B32; B32B; B32B15/00; B32B15/04; B32B15/046; B32B15/08; B32B15/20; B32B5/00; B32B5/18; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/034; H05K1/0353; H05K3/00; H05K3/22; H05K3/28; H05K3/281; H05K3/46; B32B2266/00; B32B2266/02; B32B2266/0214; B32B2266/025; B32B2311/00; B32B2311/12; B32B2457/00; B32B2457/08; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/0137; H05K2201/015; H05K2201/0183; H05K2201/0195; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/02; H05K2203/0278; H05K3/38; H05K3/386; Y; Y10; Y10T; Y10T156/00; Y10T156/10
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
41 words
A process for making a board useful in printed circuitry comprising laminating a metal layer to at least one side of a sheet of porous, expanded polytetrafluoroethylene (E-PTFE) with an adhesive, followed by compressing the E-PTFE sheet to increase its density.
Claim 2
Dependent Claim
41 words
A process for making a board useful in printed circuitry comprising laminating a metal layer to at least one side of a sheet of porous, expanded polytetrafluoroethylene (E-PTFE) with an adhesive, followed by compressing the E-PTFE sheet to increase its density.
Claim 3
Dependent Claim
10 words
The process of claim 1 wherein said metal is copper.
Claim 4
Dependent Claim
13 words
The process of claim 1 wherein said metal layer is a metal foil.
Claim 5
Dependent Claim
13 words
The process of claim 1 wherein said metal layer forms an electrical circuit.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-03-26 | 1993-09-25 | 1994-03-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-03-26 | 1997-09-25 | 1998-03-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-03-26 | 2001-09-25 | 2002-03-27 | $7700.00 | Window Closed / Lapsed |