Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
312 words
A method for manufacturing an infrared radiation detection device comprising: providing top and bottom plates of silicon, each plate having upper and lower surfaces; forming a concavity in the lower surface of said top plate and coating said lower surface, including the concavity, with a layer of material that renders said lower surface fully reflective; roughening the lower surface of said bottom plate; forming a first layer of silicon oxide on the upper surface of said bottom plate; coating said first layer of silicon oxide with a layer of material having non-zero transmittance and a reflectance that is slightly less than unity; depositing a second layer of silicon oxide on said reflecting material then patterning and etching said second layer of silicon oxide into a rectangular shape that is slightly larger than said concavity; depositing a first layer of silicon nitride then heating said bottom plate to achieve stress relief; depositing a layer of resistive material on said first layer of silicon nitride and then patterning and etching said resistive layer to form a resistor having two ends; depositing, patterning, and etching a layer of conductive material to form contact pads to said resistor, one pad for each end of the resistor; depositing a second layer of silicon nitride for protective purposes; patterning and etching said first and second layers of silicon nitride to form a support platform for the resistor and supportive legs for said platform; selectively removing said second layer of silicon oxide, thereby limiting thermal contact to the platform to said supportive legs; forming support spacers on the upper surface of said bottom plate; aligning the center of the concavity with the center of the platform and then attaching the lower surface of the top plate to the support spacers thereby forming an enclosure for said concavity and platform; and evacuating said enclosure and then sealing it under vacuum.
Claim 2
Independent Claim
312 words
A method for manufacturing an infrared radiation detection device comprising: providing top and bottom plates of silicon, each plate having upper and lower surfaces; forming a concavity in the lower surface of said top plate and coating said lower surface, including the concavity, with a layer of material that renders said lower surface fully reflective; roughening the lower surface of said bottom plate; forming a first layer of silicon oxide on the upper surface of said bottom plate; coating said first layer of silicon oxide with a layer of material having non-zero transmittance and a reflectance that is slightly less than unity; depositing a second layer of silicon oxide on said reflecting material then patterning and etching said second layer of silicon oxide into a rectangular shape that is slightly larger than said concavity; depositing a first layer of silicon nitride then heating said bottom plate to achieve stress relief; depositing a layer of resistive material on said first layer of silicon nitride and then patterning and etching said resistive layer to form a resistor having two ends; depositing, patterning, and etching a layer of conductive material to form contact pads to said resistor, one pad for each end of the resistor; depositing a second layer of silicon nitride for protective purposes; patterning and etching said first and second layers of silicon nitride to form a support platform for the resistor and supportive legs for said platform; selectively removing said second layer of silicon oxide, thereby limiting thermal contact to the platform to said supportive legs; forming support spacers on the upper surface of said bottom plate; aligning the center of the concavity with the center of the platform and then attaching the lower surface of the top plate to the support spacers thereby forming an enclosure for said concavity and platform; and evacuating said enclosure and then sealing it under vacuum.
Claim 3
Dependent Claim
32 words
The method of claim 1 wherein forming said concavity further comprises: forming a cylindrically shaped trench by means of electron bombardment; and isotropically etching said trench so as to remove sharp corners.
Claim 4
Dependent Claim
33 words
The method of claim 1 wherein the roughening of the lower surface of said bottom plate is achieved by means of sand blasting to a roughness value between about 10 and 50 microns.
Claim 5
Dependent Claim
24 words
The method of claim 1 wherein said first layer of silicon oxide is formed by thermally oxidising the upper surface of said bottom plate.
Claim 6
Dependent Claim
27 words
The method of claim 1 wherein said high reflectance, non-zero transmittance material comprises one of gold or molybdenum, or tungsten having a thickness of about 50 nanometers.
Claim 7
Dependent Claim
27 words
The method of claim 1 wherein said second layer of silicon oxide is deposited by chemical vapor deposition to a thickness between about 1.8 and 2.5 microns.
Claim 8
Dependent Claim
23 words
The method of claim 1 wherein the thickness of said first layer of silicon nitride is between about 2 and about 5 microns.
Claim 9
Dependent Claim
14 words
The method of claim 1 wherein said resistive material comprises chromium or titanium oxide.
Claim 10
Dependent Claim
24 words
The method of claim 1 wherein the thickness of said second layer of silicon nitride is between about 900 and about 1,100 Angstrom units.
Claim 11
Dependent Claim
25 words
The method of claim 1 wherein said spacers comprise an alloy of nickel and iron and are formed by means of electroforming in photoresist moulds.
Claim 12
Dependent Claim
16 words
The method of claim 10 wherein said alloy comprises about 37% nickel and about 63% iron.
Claim 13
Dependent Claim
23 words
The method of claim 1 wherein the selective removal of said second layer of silicon oxide is achieved by etching with hydrofluoric acid.
Claim 14
Dependent Claim
21 words
The method of claim 1 wherein the step of sealing under vacuum is achieved by use of epoxy or glass frit.