Patent US5581226A successfully refreshed from Google Patents.
US5581226A
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High pressure sensor structure and method
Assignee: NXP USA Inc
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Filing: 1994-11-02
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Granted: 1996-12-03
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Expires: 2014-11-02
Abstract
Abstract A high pressure sensor structure (11, 111, 211) includes a housing (12, 112, 212) having an upper cavity portion (13, 113, 213) and a lower cavity portion (16, 116, 216). A diaphragm (18, 118, 218) separates the upper cavity portion (13, 113, 213) from the lower cavity portion (16, 116, 216). A semiconductor chip (26, 126, 226) is attached to the upper surface of the diaphragm (18, 118, 218) within the upper cavity portion (13, 113, 213). The diaphragm (18, 118, 218) has a thickness (21, 121, 221) and an exposed width (23, 123, 223) such that the semiconductor chip (26, 126, 226) generates a measurable output signal when the lower surface of the diaphragm (18, 118, 218) is exposed to a high pressure environment.
Inventors
- 👤 Mahesh Shah
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 05:40
CPC Classifications
G; G01; G01L; G01L19/00; G01L19/14; G01L19/142; G01L19/143; G01L19/0061; G01L19/0084; G01L19/147; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
96 words
A high pressure sensor structure comprising: a housing having an upper cavity, and a lower cavity; a pressure introducing portion separating the upper cavity from the lower cavity, the pressure introducing portion having a thickness, an exposed width, an upper surface, and a lower surface, wherein the lower cavity has an opening, and wherein the thickness is substantially uniform across the exposed width; a sensing chip attached to the upper surface of the pressure introducing portion within the upper cavity; a conductive connective structure coupled to the sensing chip; and an enclosure covering the upper cavity.
Claim 2
Dependent Claim
96 words
A high pressure sensor structure comprising: a housing having an upper cavity, and a lower cavity; a pressure introducing portion separating the upper cavity from the lower cavity, the pressure introducing portion having a thickness, an exposed width, an upper surface, and a lower surface, wherein the lower cavity has an opening, and wherein the thickness is substantially uniform across the exposed width; a sensing chip attached to the upper surface of the pressure introducing portion within the upper cavity; a conductive connective structure coupled to the sensing chip; and an enclosure covering the upper cavity.
Claim 3
Dependent Claim
13 words
The structure of claim 1 wherein the housing comprises an injection molded plastic.
Claim 4
Dependent Claim
23 words
The structure of claim 2 wherein the pressure introducing portion comprises plastic, and wherein the pressure introducing portion is integral with the housing.
Claim 5
Dependent Claim
47 words
The structure of claim 3 wherein the exposed width is in a range from approximately 6.0 to 7.5 mm, and wherein the thickness is in a range from approximately 1.0 to 1.5 mm, such that the high pressure sensor structure measures pressures up to approximately 14,000 kPa.
Claim 6
Dependent Claim
14 words
The structure of claim 2 wherein the pressure introducing portion comprises a metal insert.
Claim 7
Dependent Claim
47 words
The structure of claim 5 wherein the exposed width is in a range from approximately 6.0 to 7.5 mm, and wherein the thickness is in a range from approximately 0.5 to 1.0 mm, such that the high pressure sensor structure measures pressures up to approximately 14,000 kPa.
Claim 8
Dependent Claim
11 words
The structure of claim 1 wherein the housing comprises a ceramic.
Claim 9
Dependent Claim
24 words
The structure of claim 7 wherein the pressure introducing portion comprises a metal, and wherein the pressure introducing portion is bonded to the housing.
Claim 10
Dependent Claim
47 words
The structure of claim 8 wherein the exposed width is in a range from approximately 6.0 to 7.5 mm, and wherein the thickness is in a range from approximately 0.5 to 1.0 mm, such that the high pressure sensor structure measures pressures up to approximately 14,000 kPa.
Claim 11
Dependent Claim
51 words
The structure of claim 1 wherein the sensing chip includes a plurality of bonding pads, and wherein the conductive connective structure includes a plurality of wire bonds and a plurality of conductive leads, the plurality of wire bonds electrically connecting the plurality of bonding pads to the plurality of conductive leads.
Claim 12
Dependent Claim
21 words
The structure of claim 10 wherein at least a portion of the plurality of conductive leads is integral with the housing.
Claim 13
Dependent Claim
22 words
The structure of claim 10 further comprising a protective layer covering at least the sensing chip and the plurality of wire bonds.
Claim 14
Independent Claim
166 words
A device for sensing high pressures having a diaphragm external to a semiconductor chip comprising: a hollow containing structure having an upper portion and a lower portion, the lower portion open at one end and having an outer surface; a diaphragm within the hollow containing structure separating the upper portion from the lower portion, the diaphragm having a thickness, an upper surface, a lower surface, and an exposed width, the thickness substantially uniform across the exposed width, wherein the hollow containing structure and the diaphragm comprise an injection molded plastic, and wherein the diaphragm is integral with the hollow containing structure; a semiconductor chip attached to the upper surface of the diaphragm within the upper portion, the semiconductor chip having a plurality of bonding pads; a plurality of conductive leads, each having a bond post end and an external connecting end; a plurality of conductive wires electrically connecting the plurality of bonding pads to the plurality of conductive leads; and a lid covering the upper portion.
Claim 15
Independent Claim
166 words
A device for sensing high pressures having a diaphragm external to a semiconductor chip comprising: a hollow containing structure having an upper portion and a lower portion, the lower portion open at one end and having an outer surface; a diaphragm within the hollow containing structure separating the upper portion from the lower portion, the diaphragm having a thickness, an upper surface, a lower surface, and an exposed width, the thickness substantially uniform across the exposed width, wherein the hollow containing structure and the diaphragm comprise an injection molded plastic, and wherein the diaphragm is integral with the hollow containing structure; a semiconductor chip attached to the upper surface of the diaphragm within the upper portion, the semiconductor chip having a plurality of bonding pads; a plurality of conductive leads, each having a bond post end and an external connecting end; a plurality of conductive wires electrically connecting the plurality of bonding pads to the plurality of conductive leads; and a lid covering the upper portion.
Claim 16
Dependent Claim
22 words
The device of claim 13 further comprising a protective layer covering at least the semiconductor chip and the plurality of conductive wires.
Claim 17
Dependent Claim
33 words
The device of claim 13 wherein the thickness is in a range from approximately 6.0 to 7.5 mm, and wherein the exposed width is in a range from approximately 1.0 to 1.5 mm.
Claim 18
Dependent Claim
15 words
The device of claim 13 wherein the outer surface of the lower portion is threaded.
Claim 19
Independent Claim
115 words
A method for making a high pressure sensor structure comprising the steps of: providing a housing having an upper cavity, a lower cavity, a pressure introducing portion separating the upper cavity from the lower cavity, and a conductive connective structure, the pressure introducing portion having a thickness, an exposed width, an upper surface, and a lower surface, the lower cavity having an opening for exposing the lower surface to a high pressure media, and wherein the thickness is substantially uniform across the exposed width; attaching a semiconductor transducer to the upper surface of the pressure introducing portion within the upper cavity; connecting the semiconductor transducer to the conductive connective structure; and enclosing the upper cavity.
Claim 20
Independent Claim
115 words
A method for making a high pressure sensor structure comprising the steps of: providing a housing having an upper cavity, a lower cavity, a pressure introducing portion separating the upper cavity from the lower cavity, and a conductive connective structure, the pressure introducing portion having a thickness, an exposed width, an upper surface, and a lower surface, the lower cavity having an opening for exposing the lower surface to a high pressure media, and wherein the thickness is substantially uniform across the exposed width; attaching a semiconductor transducer to the upper surface of the pressure introducing portion within the upper cavity; connecting the semiconductor transducer to the conductive connective structure; and enclosing the upper cavity.
Claim 21
Dependent Claim
41 words
The method of claim 17 wherein the step of providing the housing includes providing an injection molded plastic housing, and wherein the pressure introducing portion comprises an injection molded plastic, and wherein the pressure introducing portion is integral with the housing.
Claim 22
Dependent Claim
58 words
The method of claim 18 wherein the step of providing the injection molded plastic housing includes providing the injection molded plastic housing wherein the thickness of the pressure introducing portion is in a range from 6.0 to 7.5 mm, and wherein the exposed width of the pressure introducing portion is in a range from 1.0 to 1.5 mm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-03 | 2000-06-03 | 2000-12-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-03 | 2004-06-03 | 2004-12-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-03 | 2008-06-03 | 2008-12-03 | $7700.00 | Window Closed / Lapsed |