US4840067A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor pressure sensor with method diaphragm
Assignee: Soken Inc
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Filing: 1987-05-15
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Granted: 1989-06-20
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Expires: 2007-05-15
Abstract
Abstract A semiconductor pressure sensor having a cylindrical housing with an opening formed at its tip end which is exposed to a pressure atmosphere and a metal diaphragm for receiving pressure which is formed in a wall of the cylindrical housing defining the opening. A metal oxide layer is formed in a surface of the metal diaphragm by oxidizing the surface of the metal diaphragm, and a glass layer is formed on the metal oxide layer. A semiconductor chip, on which a strain gauge is formed, is firmly and surely bonded to the metal diaphragm through the glass layer by virtue of the metal oxide layer. This semiconductor pressure sensor can measure high pressure with sufficient sensitivity and high accuracy.
Inventors
- 👤 Minoru Nishida
- 👤 Naohito Mizuno
- 👤 Tadashi Hattori
- 👤 Seizi Huzino
- 👤 Yoshiyasu Ando
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 14:49
CPC Classifications
G; G01; G01L; G01L19/00; G01L19/0061; G01L19/0084; G01L19/14; G01L19/147; G01L9/00; G01L9/0041; G01L9/0051; G01L9/0052; G01L9/0055
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
80 words
A semiconductor pressure sensor comprising: a metal diaphragm having a surface roughness of 0.5 μm to 3 μm and which deforms in proportion to a change in an applied pressure; a metal oxide layer formed in a surface of said metal diaphragm; a glass layer formed on said metal oxide layer; and a semiconductor chip having a strain gauge which produces output signals responsive to the deformation of said metal diaphragm, said semiconductor chip being bonded to said glass layers.
Claim 2
Dependent Claim
80 words
A semiconductor pressure sensor comprising: a metal diaphragm having a surface roughness of 0.5 μm to 3 μm and which deforms in proportion to a change in an applied pressure; a metal oxide layer formed in a surface of said metal diaphragm; a glass layer formed on said metal oxide layer; and a semiconductor chip having a strain gauge which produces output signals responsive to the deformation of said metal diaphragm, said semiconductor chip being bonded to said glass layers.
Claim 3
Dependent Claim
41 words
A semiconductor pressure sensor according to claim 1, further comprising a housing having an opening formed at its tip end, which is exposed to a pressure atmosphere, said metal diaphragm being provided in said opening so as to close said opening.
Claim 4
Dependent Claim
27 words
A semiconductor pressure sensor according to claim 1, wherein said metal diaphragm is made of Fe-Ni-Co alloy and said semiconductor chip is composed of a silicon substrate.
Claim 5
Dependent Claim
23 words
A semiconductor pressure sensor according to claim 1, wherein said metal oxide layer has a thickness of about 1.5 μm to 5.5 μm.
Claim 6
Dependent Claim
115 words
A semiconductor pressure sensor comprising: a metal diaphragm which deforms in proportion to a change in an applied pressure; a metal oxide layer formed in a surface of said metal diaphragm; a glass layer formed on said metal oxide layer, said glass layer being made of a low melting point glass having a thickness of about 40 μm to 60 μm, and a filler of said glass layer having an average particle diameter of about 2.0 μm and a maximum particle diameter of about 20 μm; and a semiconductor chip having a strain gauge which produces output signals responsive to the deformation of said metal diaphragm, said semiconductor chip being bonded to said glass layer.
Claim 7
Dependent Claim
115 words
A semiconductor pressure sensor comprising: a metal diaphragm which deforms in proportion to a change in an applied pressure; a metal oxide layer formed in a surface of said metal diaphragm; a glass layer formed on said metal oxide layer, said glass layer being made of a low melting point glass having a thickness of about 40 μm to 60 μm, and a filler of said glass layer having an average particle diameter of about 2.0 μm and a maximum particle diameter of about 20 μm; and a semiconductor chip having a strain gauge which produces output signals responsive to the deformation of said metal diaphragm, said semiconductor chip being bonded to said glass layer.
Claim 8
Dependent Claim
41 words
A semiconductor pressure sensor according to claim 5, further comprising a housing having an opening formed at its tip end, which is exposed to a pressure atmosphere, said metal diaphragm being provided in said opening so as to close said opening.
Claim 9
Dependent Claim
27 words
A semiconductor pressure sensor according to claim 5, wherein said metal diaphragm is made of Fe-Ni-Co alloy and said semiconductor chip is composed of a silicon substrate.
Claim 10
Dependent Claim
23 words
A semiconductor pressure sensor according to claim 5, wherein said metal oxide layer has a thickness of about 1.5 μm to 5.5 μm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-06-19 | 1992-12-19 | 1993-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-06-19 | 1996-12-19 | 1997-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-06-19 | 2000-12-19 | 2001-06-20 | $7700.00 | Window Closed / Lapsed |