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US4712082A Expired / Lapsed US ⏱️ 0.0 years remaining

Pressure sensor

Assignee: Soken Inc
•
Filing: 1986-03-21
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Granted: 1987-12-08
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Expires: 2006-03-21
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Abstract

Abstract A pressure sensor includes a metal diaphragm provided at the end of a pressure introduction portion, a glass layer bonded to a surface of the metal diaphragm opposite to the pressure introduction side thereof, and a semiconductor chip acting as a semiconductor strain gauge bonded to the surface of the glass layer.

Inventors

  • 👤 Novuei Ito
  • 👤 Minoru Nishida
  • 👤 Naohito Mizuno
  • 👤 Tadashi Hattori

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 22:02
CPC Classifications
G; G01; G01L; G01L9/00; G01L9/0041; G01L9/0051; G01L9/0052; G01L9/0055

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 127 words
A pressure sensor comprising: a metal tube having one end portion open and the other end portion closed by a metal diaphragm having a thermal expansion coefficient ranging from about 2.0×10 -6 °C. -1 to about 6.0×10 -6 °C. -1 , a pressure to be inspected being introduced into said open end portion of said metal tube and applied to said metal diaphragm; a glass layer bonded to a surface of said metal diaphragm opposite to the pressure application side of the metal diaphragm, the thermal expansion coefficient of said glass layer ranging from about 2.0×10 -6 °C. -1 to about 6.0×10 -6 °C. -1 ; and a semiconductor chip acting as a semiconductor strain gauge bonded to the surface of said glass layer opposite said diaphragm.
Claim 2
Dependent Claim 127 words
A pressure sensor comprising: a metal tube having one end portion open and the other end portion closed by a metal diaphragm having a thermal expansion coefficient ranging from about 2.0×10 -6 °C. -1 to about 6.0×10 -6 °C. -1 , a pressure to be inspected being introduced into said open end portion of said metal tube and applied to said metal diaphragm; a glass layer bonded to a surface of said metal diaphragm opposite to the pressure application side of the metal diaphragm, the thermal expansion coefficient of said glass layer ranging from about 2.0×10 -6 °C. -1 to about 6.0×10 -6 °C. -1 ; and a semiconductor chip acting as a semiconductor strain gauge bonded to the surface of said glass layer opposite said diaphragm.
Claim 3
Dependent Claim 29 words
A pressure sensor according to claim 1, wherein a surface roughness of the surface of said glass layer is smaller than 0.05 μm in center line means roughness (Ra).
Claim 4
Dependent Claim 134 words
A pressure sensor comprising: a metal tube having one end portion open and the other end portion closed by a metal diaphragm, a pressure to be inspected being introduced into said open end portion of said metal tube and applied to said metal diaphragm; a glass layer bonded to the surface of said metal diaphragm opposite to the pressure application side of said metal diaphragm, the thermal expansion coefficient of said metal diaphragm and said glass layer ranging from about 3.6×10 -6 °C. -1 to about 5.3×10 -6 °C. -1 and the surface roughness of the exposed surface of said glass layer being smaller than 0.03 μm in center line mean roughness (Ra); and a semiconductor chip acting as a semiconductor strain gauge bonded to the surface of said glass layer opposite said diaphragm.
Claim 5
Dependent Claim 134 words
A pressure sensor comprising: a metal tube having one end portion open and the other end portion closed by a metal diaphragm, a pressure to be inspected being introduced into said open end portion of said metal tube and applied to said metal diaphragm; a glass layer bonded to the surface of said metal diaphragm opposite to the pressure application side of said metal diaphragm, the thermal expansion coefficient of said metal diaphragm and said glass layer ranging from about 3.6×10 -6 °C. -1 to about 5.3×10 -6 °C. -1 and the surface roughness of the exposed surface of said glass layer being smaller than 0.03 μm in center line mean roughness (Ra); and a semiconductor chip acting as a semiconductor strain gauge bonded to the surface of said glass layer opposite said diaphragm.

References Cited (Backward Citations)

US2784593A Cited
US3341796A Cited
JPS5643489A Cited
US4382377A Cited
JPS585372A Cited
US4481497A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-12-07 1991-06-08 1991-12-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-12-07 1995-06-08 1995-12-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-12-07 1999-06-08 1999-12-08 $7700.00 Window Closed / Lapsed

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