Process for the production of accelerometers using silicon on insulator technology

Claim 2

A process for the production of an integrated accelerometer having moving elements, the process comprising the steps of: (a) producing a monocrystalline silicon film on a silicon substrate and separated from the latter by an insulating layer; (b) etching the monocrystalline silicon film and insulating layer down to the substrate in order to form the moving elements having shape; and (c) removing portions of the insulating layer in order to separate the moving elements, the remainder of the insulating layer remains an integral part of the moving elements and the substrate.

Claim 3

A process according to claim 1, wherein a first conductive monocrystalline silicon layer is epitaxied on a structure obtained in step (b), at least at the location of the moving elements.

Claim 4

A process according to claim 1 for the production of an accelerometer having means for measuring the displacements of said moving elements and integrated onto the substrate, wherein these means are partly defined during step (b) in the monocrystalline silicon film and/or the epitaxied layer, which are conductive, and electric contacts are produced on the first monocrystalline conductive silicon layer for the measuring means.

Claim 5

A process according to claim 1, wherein the monocrystalline silicon film is of an N type.

Claim 6

A process according to claim 1, wherein step (a) consists of implanting oxygen ions into the silicon substrate and annealing the implanted substrate.

Claim 7

A process according to claim 1 for producing an accelerometer having at least one flexible beam supporting a seismic mass, wherein openings are formed in the seismic mass to facilitate the removing of the insulating layer.

Claim 8

A process according to claim 3 for the production of an accelerometer having moving elements in a direction parallel to the substrate, wherein the silicon layer is epitaxied on the structure and the process comprises a step of etching the epitaxied silicon layer to form a comb-shaped electrostatic screen forming part of the measuring means.

Claim 9

A process according to claim 2 for the production of an accelerometer having at least one beam supporting a seismic mass, the beam and the mass being mobile in a direction (Y) parallel to the substrate, wherein the process comprises the following successive steps: 1) implanting oxygen ions in a conductive monocrystalline silicon substrate, followed by the annealing of the implanted substrate, thereby forming a buried oxide layer separating the conductive silicon film from the substrate; 2) etching the silicon-oxide layer stack down to the substrate in order to form the moving mass, the beam and part of the measuring means; 3) epitaxing a second conductive silicon layer over the entire structure obtained in step (2) in order to thicken the moving mass and the beam; 4) producing metal contacts on the measuring means; 5) etching the second epitaxied layer and the first silicon film down to the oxide layer in order to form holes in the moving mass and a comb-shaped electrostatic screen in part constituting the measuring means; and 6) removing part of the oxide layer.

Claim 10

A process according to claim 1 for the production of an accelerometer having moving elements in a direction (Z) perpendicular to the substrate, wherein the process comprises a further step of producing a buried electrode in the monocrystalline substrate and a step of forming contact on said electrode.

Claim 11

A process according to claim 9, further comprising steps of producing at least one surface electrode on the silicon film, depositing and etching of an additional insulator layer in order to electrically insulate the substrate from said surface electrode.

Claim 12

A process according to claim 10, wherein the surface electrode is made from conductive polycrystalline silicon.

Claim 13

A process according to claim 10, wherein sacrificial studs are formed on the silicon film before depositing by epitaxy a silicon layer in order to fix an air gap of the surface electrode.

Claim 14

A process according to claim 2 for the production of an accelerometer having at least one beam supporting a seismic mass, the beam and the mass being mobile in a direction perpendicular to the substrate, and at least one surface electrode and at least one buried electrode, wherein the process comprises the following successive steps: i) implanting oxygen ions in a conductive monocrystalline silicon substrate having a first conductivity type and then annealing the implanted substrate, thus forming a buried oxide layer separating the first conductive silicon film from the substrate; ii) forming a buried electrode in the substrate; iii) etching the silicon-oxide layer stack down to the substrate in order to form the moving mass, the beam and contacting the buried electrode; iv) forming studs on the moving mass and on the beam, which can be selectively removed with respect to the silicon; v) electrically insulating the structure obtained in step iv) at the location provided for the surface electrode by an electrical insulator; vi) epitaxing a second conductive monocrystalline layer on the mass in order to thicken and deposit polycrystalline silicon at the location provided for the surface electrode; vii) producing metal contacts for the surface electrode and the buried electrode; viii) etching the epitaxied silicon-silicon film stack down to the oxide in order to form openings in the moving mass; and ix) removing the studs and in part the oxide layer.

Claim 15

A process according to claim 13, wherein the studs are made from silicon dioxide.

Claim 16

A process according to claim 9, wherein the buried electrode is formed by the local implantation of ions into the substrate having a conductivity type which is the opposite of that of the substrate.

Claim 17

A process according to claim 1, further comprising the step of implanting P type ions over the entire surface of the silicon film, wherein the silicon film is N type.

Claim 18

A process according to claim 1, wherein the insulating layer is removed by wet isotropic etching.